Abstract: The present invention relates to a drying system, and according to one aspect of the present invention, there is provided a drying system comprising a transfer conveyor for transporting particles, a particle dispersing device including a rotary member provided at one side of the transfer conveyor and having a rotation center, a drive part for rotating the rotary member and a particle supply part mounted on the rotary member having particles stored therein, and a heating part for drying the particles on the transfer conveyor in a transfer process, wherein the heating part comprises a heat exchanger and a blast fan, and is provided such that air discharged from the blast fan is supplied to the transfer conveyor after passing through the heat exchanger.

Abstract: There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.

Abstract: A method of manufacturing a semiconductor package is provided and includes forming a protective layer on a passivation layer and a connection pad of a semiconductor chip exposed by a first opening of the passivation layer, forming an insulating layer on the protective layer, forming a via hole penetrating the insulating layer to expose the protective layer, forming a second opening by removing a portion of the protective layer through the via hole, and forming a connection via filling the via hole and the second opening and a redistribution layer on the connection via. The second opening and the via hole are connected to have a stepped portion. The first opening has a width narrower closer to the connection pad, and the second opening has a width wider closer to the connection pad.

Abstract: There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.

Abstract: A system for manufacturing a laminated film, in which a first film and a second film are sequentially laminated, and the system includes: a film supplying part which supplies the first film and the second film; a bonding part which includes a first roll and a second roll that rotate in opposite directions, and compresses the first film and the second film supplied from the film supplying part and bonds the first film and the second film as the laminated film; and a bending inducing part which supports and bends the laminated film bonded and output from the bonding part, in which the second roll shifts in a direction along a circumference of a virtual circle having a larger radius than a radius of the first roll to control the bending of the laminated film.

Abstract: A millimeter wave band array antenna is disclosed. The disclosed antenna includes: a first dipole array antenna unit including first +dipole members, formed on an upper portion of a first substrate and provided with feed signals through a first feed line, and first ?dipole members, formed on a lower portion of the first substrate and joined with a ground plane on a lower portion of the first substrate; and a slot antenna unit including slot radiators, which are formed on an upper portion of the first substrate, where the ground plane includes a first sloped structure having an upward slope of a first angle to the right from the point of junction with a first ?dipole member and a second sloped structure having an upward slope of the first angle toward the left from the point of junction.

Abstract: A semiconductor package includes: a semiconductor chip including a passivation film disposed on an active surface and having a first opening exposing at least a portion of a connection pad and a protective film disposed on the passivation film, filling at least a portion in the first opening, and having a second opening exposing at least a portion of the connection pad in the first opening; an encapsulant covering at least a portion of the semiconductor chip; and the connection structure including an insulating layer having a via hole connected to the second opening to expose at least a portion of the connection pad, a redistribution layer, and a connection via connecting the connection pad to the redistribution layer while filling at least a portion of each of the via hole and the second opening. The second opening and the via hole are connected to have a stepped portion.

Abstract: Disclosed are a passenger side airbag housing, a manufacturing method therefor, and a passenger side airbag for a vehicle. According to one embodiment of the present invention, a method for manufacturing a passenger side airbag housing comprises: a material preparation step of preparing a fiber reinforced composite material as a fabric form; and a press molding step of manufacturing a passenger side airbag housing by press-molding the fiber reinforced composite material.

Abstract: A semiconductor package includes a connection member having a first surface and a second surface opposing each other and including a first redistribution layer on the second surface and at least one second redistribution layer on a level different from a level of the first redistribution layer; a semiconductor chip on the first surface of the connection member; a passivation layer on the second surface of the connection member, and including openings; UBM layers connected to the first redistribution layer through the openings; and electrical connection structures on UBM layers. An interface between the passivation layer and the UBM layers has a first unevenness surface, an interface between the passivation layer and the first redistribution layer has a second unevenness surface, connected to the first unevenness surface, and the second unevenness surface has a surface roughness greater than a surface roughness of the second redistribution layer.

Abstract: A power supply system of a vehicle is provided. The system includes a high-voltage battery for storing power and a power relay that is disposed between the high-voltage battery and an electric load. A first converter receives the power from the high-voltage battery through the power relay and a second converter bypasses the power relay to directly receive the power from the high-voltage battery. The electric load receives the power from at least any one of the first converter and the second converter.

Abstract: A braking control system for a vehicle is provided. The system includes a motor providing rotational force to wheels of the vehicle and a first battery storing electric energy for driving the motor. An inverter is connected to the first battery via a DC link terminal and performs a bidirectional power conversion between the DC link terminal and the motor. A DC converter is connected to the DC link terminal to down-convert a voltage of the DC link terminal and output the down-converted voltage. A second battery is supplied with the voltage converted by the DC converter and has a voltage lower than that of the first battery. A controller operates the inverter and the DC converter to charge regenerative braking energy generated from the motor during braking of the vehicle in the first battery and the second battery.

Abstract: A printed circuit board and method thereof include an electronic component embedded in an insulation layer and comprising a connection terminal exposed on a surface of the insulation layer. The printed circuit board and method thereof also include a bump formed on the connection terminal of the electronic component and exposed on the surface of the insulation layer.

Abstract: A semiconductor package includes a connection member having first and second surfaces opposing each other and including at least one insulating layer and redistribution layer, the redistribution layer including a via penetrating through the insulating layer and a RDL pattern connected to the via while being located on an upper surface of the insulating layer; a semiconductor chip disposed on the first surface and including a connection pad connected to the redistribution layer; and an encapsulant disposed on the first surface and encapsulating the semiconductor chip. The redistribution layer includes a seed layer disposed on a surface of the insulating layer and a plating layer disposed on the seed layer. An interface between the insulating layer and a portion of the seed layer constituting the via includes a first uneven surface with a surface roughness of 30 nm or more.

Abstract: An electronic device includes an input/output interface capable of being electrically connected to a 3-dimensional movable accessory and a processor electrically connected to the input/output interface. The processor is configured to sense an event generated in the electronic device and to transmit a command to operate the accessory to the accessory through the input/output interface in response to the event.

Abstract: There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.

Abstract: A method for charging a battery may include: obtaining a state of health of the battery and a magnitude of an initial charging current preset for the battery; converting the magnitude of the initial charging current on the basis of the state of health of the battery, thereby generating a charging current command; and providing the charging current command to a charger, and supplying a charging current corresponding to the charging current command to the battery by the charger.

Abstract: There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.

Abstract: The present invention relates to a drying system, and according to one aspect of the present invention, there is provided a drying system comprising a transfer conveyor for transporting particles, a particle dispersing device including a rotary member provided at one side of the transfer conveyor and having a rotation center, a drive part for rotating the rotary member and a particle supply part mounted on the rotary member having particles stored therein, and a heating part for drying the particles on the transfer conveyor in a transfer process, wherein the heating part comprises a heat exchanger and a blast fan, and is provided such that air discharged from the blast fan is supplied to the transfer conveyor after passing through the heat exchanger.

Abstract: The present application relates to a method for determining process conditions to remove volatile organic compounds from a polymer product through blowing. According to the method of the present application, time and energy can be saved.

Abstract: An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.