Abstract: There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.

Abstract: A semiconductor package includes: a semiconductor chip including a passivation film disposed on an active surface and having a first opening exposing at least a portion of a connection pad and a protective film disposed on the passivation film, filling at least a portion in the first opening, and having a second opening exposing at least a portion of the connection pad in the first opening; an encapsulant covering at least a portion of the semiconductor chip; and the connection structure including an insulating layer having a via hole connected to the second opening to expose at least a portion of the connection pad, a redistribution layer, and a connection via connecting the connection pad to the redistribution layer while filling at least a portion of each of the via hole and the second opening. The second opening and the via hole are connected to have a stepped portion.

Abstract: A semiconductor package includes a connection member having a first surface and a second surface opposing each other and including a first redistribution layer on the second surface and at least one second redistribution layer on a level different from a level of the first redistribution layer; a semiconductor chip on the first surface of the connection member; a passivation layer on the second surface of the connection member, and including openings; UBM layers connected to the first redistribution layer through the openings; and electrical connection structures on UBM layers. An interface between the passivation layer and the UBM layers has a first unevenness surface, an interface between the passivation layer and the first redistribution layer has a second unevenness surface, connected to the first unevenness surface, and the second unevenness surface has a surface roughness greater than a surface roughness of the second redistribution layer.

Abstract: A semiconductor package includes a connection member having first and second surfaces opposing each other and including at least one insulating layer and redistribution layer, the redistribution layer including a via penetrating through the insulating layer and a RDL pattern connected to the via while being located on an upper surface of the insulating layer; a semiconductor chip disposed on the first surface and including a connection pad connected to the redistribution layer; and an encapsulant disposed on the first surface and encapsulating the semiconductor chip. The redistribution layer includes a seed layer disposed on a surface of the insulating layer and a plating layer disposed on the seed layer. An interface between the insulating layer and a portion of the seed layer constituting the via includes a first uneven surface with a surface roughness of 30 nm or more.

Abstract: Disclosed is a battery system, including: a plurality of battery modules provided in a space formed between an upper casing and a lower casing; connection busbars respectively connected to terminals of the battery modules; an intermediate busbar connected to the connection busbars such that the connection busbars are electrically connected to each other; and an insulation protector provided with opposite end portions attached to the upper casing, and with a holding portion placed below the intermediate busbar at a position between the opposite end portions.

Abstract: A battery module for a vehicle is provided. The battery module includes a cell assembly that has a plurality of battery cells stacked on top of each other in one direction. A cooling channel integrated plate is positioned to face the cell assembly in a direction that is perpendicular to the direction in which the battery cells are stacked. The cooling channel integrated plate includes a cooling passage formed therein and cooling water flows through the cooling passage. A thermally conductive adhesive layer adheres the cell assembly and the cooling channel integrated plate to each other.

Abstract: Provided are a method of preparing a metal oxide-silica composite aerogel, which includes preparing metal oxide-silica composite precipitates by adding a metal salt solution to a silicate solution and performing a reaction, and drying the metal oxide-silica composite precipitates by irradiation with infrared rays in a wavelength range of 2 ?m to 8 ?m, and a metal oxide-silica composite aerogel having excellent physical properties, such as low tap density and high specific surface area, as well as excellent pore properties prepared by the method.

Abstract: A battery module for a vehicle includes a cell module in which battery cells are overlapped with each other while having a predetermined directivity, and a cooling channel module directly bonded to at least one surface parallel to an overlap direction of the battery cells of the cell module, the cooling channel module having a refrigerant circulated therein, where a cell bonding surface of the cooling channel module has a wave-shaped cross section curved along a curvature formed by end portions of the overlapped battery cells.

Abstract: Disclosed is a battery system, including: a plurality of battery modules provided in a space formed between an upper casing and a lower casing; connection busbars respectively connected to terminals of the battery modules; an intermediate busbar connected to the connection busbars such that the connection busbars are electrically connected to each other; and an insulation protector provided with opposite end portions attached to the upper casing, and with a holding portion placed below the intermediate busbar at a position between the opposite end portions.

Abstract: A battery management system (BMS) may include a battery, a relay configured to electrically connect and disconnect the battery for supplying a voltage (an electric power) to an electric load to and from the electric load, the electric load configured to receive the voltage (the electric power) from the battery, to compare the received voltage (the electric power) with a reference value and to output a wakeup signal according to the compared result, when the relay is electrically connected, and a controller configured to wake up by the wakeup signal, to monitor a state of the battery and to control a state of the relay. It is possible to prevent overdischarge and overcharge of the battery by monitoring the battery through the electric load in a state in which a vehicle is turned off and switching the BSM to a wakeup state only if necessary.

Abstract: A method and system for detecting fusion of a relay are provided to more accurately diagnose fusion of a relay by adjusting relay OFF order when a vehicle engine is turned off using data regarding whether fusion of a relay was detected when the vehicle engine was turned on. The method includes detecting whether first and second relays have been fused when a vehicle engine was turned on and adjusting OFF order of the first and second relays when the vehicle engine is turned off based on whether the first and second relays have been fused.

Abstract: Disclosed herein is a cooling control method for a battery management system in a vehicle in which battery cooling is controlled by according to the degree of battery durability deterioration. Specifically, the method of controlling battery cooling using a battery management system (BMS) configured to control a degree of cooling fan operation based on a battery temperature in the vehicle equipped with the battery and the cooling fan, includes the steps of increasing the degree of cooling fan operation compared normal conditions when an actual battery durability deterioration rate (Vt) measured using battery durability deterioration degree information during vehicle operation is higher than a predicted battery durability deterioration rate.

Abstract: A power supply system of a vehicle is provided. The system includes a high-voltage battery for storing power and a power relay that is disposed between the high-voltage battery and an electric load. A first converter receives the power from the high-voltage battery through the power relay and a second converter bypasses the power relay to directly receive the power from the high-voltage battery. The electric load receives the power from at least any one of the first converter and the second converter.

Abstract: An electromagnetic wave absorber that improves an electromagnetic wave absorption rate in a specific frequency is provided. The electromagnetic wave absorber includes a dielectric layer; a first metal conductive layer disposed on a first surface of the dielectric layer and having a slot positioned symmetrical about a center of the dielectric layer and a second metal conductive layer disposed on a second surface of the dielectric layer.

Abstract: A system for manufacturing a laminated film, in which a first film and a second film are sequentially laminated, and the system includes: a film supplying part which supplies the first film and the second film; a bonding part which includes a first roll and a second roll that rotate in opposite directions, and compresses the first film and the second film supplied from the film supplying part and bonds the first film and the second film as the laminated film; and a bending inducing part which supports and bends the laminated film bonded and output from the bonding part, in which the second roll shifts in a direction along a circumference of a virtual circle having a larger radius than a radius of the first roll to control the bending of the laminated film.

Abstract: An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.

Abstract: A battery system for a vehicle includes: a battery assembly including at least one first battery module and at least one second battery module; a first relay being closed/opened between a first node and one of a first end of the first battery module and a first end of the second battery module being connected to a second end of the first battery module; a second relay being closed/opened between a second node and a second end of the second battery module; a converter converting a voltage between the nodes; a third relay being closed/opened between the converter and the first end of the first battery module; a fourth relay being closed/opened between the first end of the first battery module and a ground; and a battery manager controlling the relays based on a driving condition of the vehicle and energy storage amounts of the modules.

Abstract: A semiconductor device according to an embodiment comprises: a substrate; a buffer layer provided on the substrate; a first conductivity type semiconductor layer provided on the buffer layer; a second conductivity type semiconductor layer; a light emitting structure, provided between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, comprising an active layer which emits ultraviolet light; and a plurality of air voids provided within the buffer layer, wherein the air voids can be formed to have two or more inclined surfaces.

Abstract: An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.

Abstract: An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.