Abstract: The present invention relates to a method for designing a die-based vehicle controller-only semiconductor and a vehicle controller-only semiconductor manufactured by the same, and breaks the conventional semiconductor process to design and manufacture a novel conceptual vehicle controller-only semiconductor, EIP (ECU in Package), through a fusion of a new semiconductor process technique with a controller system technique, thereby obtaining an effect of capable of implementing a high performance/high quality semiconductor in micro-miniature size/ultra-light weight in a short time period.

Abstract: The present invention relates to a method for designing a die-based vehicle controller-only semiconductor and a vehicle controller-only semiconductor manufactured by the same, and breaks the conventional semiconductor process to design and manufacture a novel conceptual vehicle controller-only semiconductor, EIP (ECU in Package), through a fusion of a new semiconductor process technique with a controller system technique, thereby obtaining an effect of capable of implementing a high performance/high quality semiconductor in micro-miniature size/ultra-light weight in a short time period.

Abstract: Disclosed herein are a camera module for a vehicle and a monitoring system provided with the same capable of conveniently identifying circumstances around a vehicle by photographing the circumference of the vehicle in various directions. According to an exemplary embodiment of the present invention, the camera module includes a camera module including a plurality of lenses which is mounted in different directions to form each image, one image sensor unit which is mounted to be movable to corresponding positions of each image formed by the plurality of lenses, a guide part which selectively moves the image sensor unit, and an image processor which processes an image signal output from the image sensor unit.

Abstract: A mounting device for a sub-frame may include a mounting bracket positioned to correspond with a one side penetration opening formed at a front side inside member of the front side member, a reinforce panel provided to an upper surface of the front side inside member, a mounting bolt separated with a bolt part and a head by a flange which is positioned at a center thereof, joined to a circumference of a bolt opening of the mounting bracket through the flange on a state that the bolt part is inserted into the bolt opening of the mounting bracket, and joined on a state that the head is wedged through the penetration opening of the front side inside member to the welding opening of the reinforce panel, and a foam filler foamed by a heat treatment and filled in a space formed by the front side inside member, the mounting bracket, the reinforce panel, and a front side outside member.

Abstract: A mounting device for a sub-frame may include a mounting bracket positioned to correspond with a one side penetration opening formed at a front side inside member of the front side member, a reinforce panel provided to an upper surface of the front side inside member, a mounting bolt separated with a bolt part and a head by a flange which is positioned at a center thereof, joined to a circumference of a bolt opening of the mounting bracket through the flange on a state that the bolt part is inserted into the bolt opening of the mounting bracket, and joined on a state that the head is wedged through the penetration opening of the front side inside member to the welding opening of the reinforce panel, and a foam filler foamed by a heat treatment and filled in a space formed by the front side inside member, the mounting bracket, the reinforce panel, and a front side outside member.

Abstract: The present invention relates to a method for designing a die-based vehicle controller-only semiconductor and a vehicle controller-only semiconductor manufactured by the same, and breaks the conventional semiconductor process to design and manufacture a novel conceptual vehicle controller-only semiconductor, EIP (ECU in Package), through a fusion of a new semiconductor process technique with a controller system technique, thereby obtaining an effect of capable of implementing a high performance/high quality semiconductor in micro-miniature size/ultra-light weight in a short time period.

Abstract: The present invention relates to a method for designing a die-based vehicle controller-only semiconductor and a vehicle controller-only semiconductor manufactured by the same, and breaks the conventional semiconductor process to design and manufacture a novel conceptual vehicle controller-only semiconductor, EIP (ECU in Package), through a fusion of a new semiconductor process technique with a controller system technique, thereby obtaining an effect of capable of implementing a high performance/high quality semiconductor in micro-miniature size/ultra-light weight in a short time period.

Abstract: Disclosed herein are a printed circuit board and a manufacturing method thereof. The printed circuit board includes a rigid substrate having a solder resist applied thereon and a flexible substrate connected to the rigid substrate in order to increase productivity by simplifying a process of manufacturing the printed circuit board. The manufacturing method includes: attaching a coverlay onto an upper surface of the flexible substrate; attaching an electromagnetic interference (EMI) film onto an upper surface of the coverlay; attaching and pressurizing a substrate molding subsidiary material onto an upper surface of the EMI film; and separating the substrate molding subsidiary material.

Abstract: A nonaqueous ink composition for an ink jet and a method of manufacturing ink comprising the same are provided. The nonaqueous ink composition for the ink jet includes: a glycol ether acetate solvent represented by a specific chemical formula; and a polypropylene glycol binder represented by a specific chemical formula. The nonaqueous ink composition for an ink jet has dynamic viscoelasticity obtained by a chemical interaction between the solvent and the binder, exhibits excellent print quality and is capable of high-speed printing.

Abstract: The present invention relates to a method for manufacturing copper nanoparticles, in particular, to a method for manufacturing copper nanoparticles, wherein the method includes preparing a mixture solution including a copper salt, a dispersing agent, a reducing agent and an organic solvent; raising temperature of the mixture solution up to 30-50° C. and agitating; irradiating the mixture solution with microwaves; and obtaining the copper nanoparticles by lowering temperature of the mixture solution. According to the present invention, several tens of nm of copper nanoparticles having a narrow particle size distribution and good dispersibility can be synthesized in mass production.

Abstract: Disclosed herein are a camera module for a vehicle and a monitoring system provided with the same capable of conveniently identifying circumstances around a vehicle by photographing the circumference of the vehicle in various directions. According to an exemplary embodiment of the present invention, the camera module includes a camera module including a plurality of lenses which is mounted in different directions to form each image, one image sensor unit which is mounted to be movable to corresponding positions of each image formed by the plurality of lenses, a guide part which selectively moves the image sensor unit, and an image processor which processes an image signal output from the image sensor unit.

Abstract: Provided is a strength reinforcement device for a front shock absorber of a vehicle to provide a sufficient supporting force in spite of a load transferred to the front shock absorber. To this end, a cowl inner lower panel and a reinforce panel which form a box-shape cross-section structure are provided and their both side end portions are integrally connected to shock absorber supporting panels. A support panel is integrally formed in front end portions of both side ends of the cowl inner lower panel to cover and be integrally connected to the front portions of the shock absorber supporting panels, thereby easily distributing the loads transferred in various directions from the shock absorber supporting panels engaged with the front shock absorbers and providing a sufficient supporting force for the shock absorber supporting panels.

Abstract: Provided is a strength reinforcement device for a front shock absorber of a vehicle to provide a sufficient supporting force in spite of a load transferred to the front shock absorber. To this end, a cowl inner lower panel and a reinforce panel which form a box-shape cross-section structure are provided and their both side end portions are integrally connected to shock absorber supporting panels. A support panel is integrally formed in front end portions of both side ends of the cowl inner lower panel to cover and be integrally connected to the front portions of the shock absorber supporting panels, thereby easily distributing the loads transferred in various directions from the shock absorber supporting panels engaged with the front shock absorbers and providing a sufficient supporting force for the shock absorber supporting panels.

Abstract: Disclosed herein is a method of manufacturing a rigid flexible printed circuit board, including: preparing a flexible substrate having an inner layer circuit pattern formed on one surface or both surfaces thereof and divided into a rigid region and a flexible region; forming a protective layer in the flexible region of the flexible substrate; forming a coverlay so as to expose the protective layer on one surface of the flexible substrate; stacking a rigid insulating layer in the rigid region and stacking a metal layer in the protective layer and the rigid insulating layer; forming an outer layer circuit layer by patterning the metal layer and removing the metal layer in the flexible region; and removing the protective layer.

Abstract: Disclosed herein is a rigid-flexible substrate including: a rigid area including a circuit layer; a flexible area formed at one end of the rigid area; and a raw material formed over the flexible area and having indentation formed on a surface thereof.

Abstract: A method of processing image data according to an embodiment of the present invention includes: setting a permissible pitch range for a distance between adjacent ink blots; arranging image data for the line pattern in an x-y coordinate system; selecting a first base point corresponding to one side of the image data for the line pattern; selecting a first determination point from the first base point, in which the first determination point is parallel to and separated from one side of the image data for the line pattern; determining whether a distance between the first base point and the first determination point is within the permissible pitch range; and storing a coordinate as print data if the distance between the first base point and the first determination point is within the permissible pitch range, in which the coordinate is located at a shortest distance from the first determination point.

Abstract: There is provided a dissolution properties measurement system using a piezoelectric sensor, capable of continuously measuring dissolution properties of a substrate in an aqueous solution by using the piezoelectric sensor. The dissolution properties measurement system includes: a specimen receiving unit including a chamber receiving a specimen therein; a mass measuring unit connected with the specimen to measure a mass change of the specimen in real time; and a dissolution properties measuring unit measuring a dissolution properties of the specimen on the basis of the value measured by the mass measuring unit.

Abstract: An inkjet head according to an aspect of the invention may include: a flow path plate having a plurality of ink chambers; a nozzle plate having a plurality of nozzles connected to the ink chambers in order to eject ink in the ink chambers to the outside; and a temperature control unit having a heat exchange passage in at least one of the flow path plate and the nozzle plate in order to control temperature of the ink.

Abstract: A method of manufacturing an inkjet head includes: forming an inlet and a pressure chamber in an upper substrate, the inlet penetrating the upper substrate and providing a passage for an inflow of ink, and the pressure chamber formed as a recess in one side of the upper substrate; forming a manifold and an ink channel in a middle substrate, the manifold configured to be connected with the inlet, and the ink channel penetrating the middle substrate and configured to be connected with the pressure chamber; forming a straight portion and a nozzle in a plate substrate, the straight portion configured to be connected with the ink channel, and the nozzle connected with the straight portion; forming a hydrophobic layer on one side of the plate substrate, the hydrophobic layer having a window formed therein, and the window opening the nozzle by a circumference greater than a circumference of an end of the nozzle; and stacking in order and attaching the upper substrate, the middle substrate, and the plate substrate.

Abstract: The present invention relates to an apparatus and a method of manufacturing metal nanoparticles, and more particularly to an apparatus including: a precursor supplying part which supplies a precursor solution of metal nanoparticles; a first heating part which is connected with the precursor supplying part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where any particle is not produced; a second heating part which is connected with the first heating part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where particles are produced; and a cooler which is connected with the second heating part and collects and cools metal nanoparticles produced at the second heating part which allows continuous mass production of metal nanoparticles.