Abstract: A method of processing a SOI substrate to form a groove in the SOI substrate in which a silicon layer is stacked on both sides of an oxide layer is disclosed. In accordance with an embodiment of the present invention, the method includes dividing a portion of the silicon layer, in which the groove is to be processed, into a plurality of unit portions, performing dry etching on certain portions of the plurality of divided unit portions such that the oxide layer is exposed and removing remaining portions of the plurality of divided unit portions by removing the oxide layer.

Abstract: An ink-jet head is disclosed. The ink-jet head can include: a chamber for holding ink, an actuator coupled to one side of the chamber to provide pressure to the chamber, a damper portion connected with the other side of the chamber, an accelerator portion extending from a lateral surface of the damper portion, and a nozzle formed at an end of the accelerator portion. Certain embodiments of the invention can be used to increase the speed at which ink is ejected and improve the straightness of the ejection path.

Abstract: The present invention relates to a method for forming fine wiring comprising: preparing a substrate for a printed circuit board; forming a metal thin sacrificial layer on the substrate using a first metal ink; forming a wiring on the metal thin sacrificial layer by inkjet printing using a second metal ink; and removing a portion of the metal thin sacrificial layer to form a wiring pattern. The method for forming fine wiring according to the invention can improve adhesiveness by using metal thin sacrificial layer and prevent spreading of ink in forming fine wiring.

Abstract: Disclosed are a method of forming metal wiring and metal wiring formed using the same. The method includes printing wiring using an ink composition including metallic nanoparticles and dispersants maintaining dispersion of the metallic nanoparticles, performing a first firing process of firing the wiring under vacuum or in an inert atmosphere to suppress grain growth, and performing a second firing process of firing the wiring with the vacuum or inert atmosphere released, to accelerate grain growth. The method of forming metal wiring induces abnormal grain growth by rapidly removing dispersants, capable of inducing the growth of metallic nanoparticles, at a temperature at which the growth force of the metallic nanoparticles is high, in the process of firing the metallic nanoparticles. Accordingly, the metal wiring has a coarse-grained structure containing metallic particles with a large average particle size, and the electrical and mechanical characteristics thereof can be enhanced.

Abstract: A printed circuit board and a manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board can include: forming surface roughness on an insulation layer, coating a chemical compound onto the insulation layer that lowers the surface energy of the insulation layer, and forming a circuit pattern by inkjet printing on the insulation layer coated with the chemical compound. Certain embodiments of the invention can be utilized to improve adhesive strength between the insulation layer and the inkjet-printed circuit patterns, suppress spreading in the inkjet-printed circuit patterns to improve resolution, and reduce manufacturing costs by forming the circuits using inkjet printing.

Abstract: The present invention relates to a reducing agent for low temperature reducing and sintering of copper nanoparticles and a method for low temperature sintering using the same. The reducing agent includes formic acid or acetic acid and C1 to C3 alcohol or ether which allows reducing and sintering at a low temperature of less than 250° C. The sintered copper nanoparticles provide excellent electrical properties and are suitable for forming fine wirings patterns.

Abstract: A method of manufacturing an ink-jet head is disclosed. The method in accordance with an embodiment of the present invention includes: forming a dividing groove such that one surface of a piezoelectric element is divided corresponding to the position of the chamber; filling the dividing groove with a filler; bonding one surface of the piezoelectric element to one surface of the ink-jet head in which the chamber is formed; and polishing the other surface of the piezoelectric element such that the filler is exposed.

Abstract: A method for surface modification of non-dispersible metal nanoparticles comprises mixing metal nanoparticles having an amorphous carbon layer on the surface with an alcohol or thiol solvent, mixing a capping molecule having a carboxylic head group in the mixed solution, and separating the metal nanoparticles from the mixed solution and the metal nanoparticles for inkjet printing thus modified.

Abstract: There are provided an inkjet head package, an apparatus and a method for assembling the same. The inkjet head package may include a plurality of inkjet heads each having an ink channel so as to eject ink through a plurality of nozzles formed on one surface thereof, and a frame having one surface to which another surface of the plurality of inkjet heads is fixed while facing the one surface thereof, the frame including an opening for exposing a portion of the another surface disposed therein.

Abstract: There is provided an inkjet head and an inkjet head assembly having the same. The inkjet head includes an inkjet head plate having a plurality of nozzles ejecting ink provided therein; pressure chambers storing ink drawn in from both outer ends of the inkjet head plate in a width direction thereof and facing each other in a direction inwards of the width direction; piezoelectric elements supplying the pressure champers with driving force allowing ink to be ejected through the nozzles connected to the pressure chambers and disposed on the pressure chambers having membranes interposed therebetween; a pressure adjusting channel connecting the pressure chambers to adjust a pressure of ink ejected through the nozzles.

Abstract: Disclosed are a solar cell and a manufacturing method thereof. The solar cell in accordance with an embodiment of the present invention includes: a substrate having a plurality of holes formed on one surface thereof; a metal layer formed on an inner wall of the hole and on one surface of the substrate; a p-type semiconductor coated on the metal layer; an n-type semiconductor formed inside the hole and on one surface of the substrate; a transparent conductive oxide formed on the n-type semiconductor; and an electrode terminal formed on the p-type semiconductor and on the transparent conductive oxide.

Abstract: An inkjet head module and a method of aligning inkjet heads using the inkjet head module are disclosed. The inkjet head module can include a frame, which can be attached to and detached from an inkjet apparatus; a multiple number of heads, which may be coupled to the frame, and which may each have at least one nozzle formed for ejecting ink; a multiple number of support racks, each of which may be interposed between the frame and a head, and which may support the head such that the head is movable in relation to the frame; and a multiple number of piezoelectric motors, which may move the heads to align the heads in relation to one another. Certain embodiments of the invention make it possible to reduce the size of the overall inkjet apparatus, as well as to align a multiple number of inkjet heads with higher precision.

Abstract: Disclosed are an ink-jet head and a method of manufacturing the ink-jet head including a plurality of chambers, a membrane covering the plurality of chambers, and a plurality of actuators separated from one another by a virtual dividing line on the membrane such that pressure is applied to each of the plurality of chambers. The method in accordance with an embodiment of the present invention includes: forming a groove at a position on one surface of the membrane, the position corresponding to the position of the dividing line; bonding a piezoelectric member to the one surface of the membrane having the groove formed therein by using adhesive resin; and dividing the piezoelectric member such that the groove is exposed.

Abstract: Disclosed herein are a piezo-electric inkjet print head and an apparatus for driving the print head. The piezo-electric inkjet print head includes: a pressure chamber; a piezo-electric actuator applying a driving force for discharging ink to the pressure chamber; and a pulse applying unit applying a driving pulse to the piezo-electric actuator. The exemplary embodiment of the present invention can obtain the stable discharge characteristics even at the time of discharging at a high frequency of 30 kHz or more by forming the driving waveform of the inkjet head under the condition of measuring the unique vibration period owned by the inkjet head and simultaneously generating constructive interference and destructive interference against the vibrations.

Abstract: Disclosed is an inkjet printer. The inkjet printer in accordance with an embodiment of the present invention includes a supply channel coupled to a plurality of inkjet heads; a first main reservoir and a second main reservoir being coupled to either side of the supply channel; and a first press and a second press applying pressure to the inside of the first main reservoir and the second main reservoir, respectively.

Abstract: There are provided an inkjet head assembly and a method for manufacturing the same. The inkjet head assembly includes: an inkjet head plate having an ink flow passage formed therein and having an actuator formed thereon, the actuator providing driving force for discharging ink; a flexible printed circuit board (FPCB) applying voltage to the actuator; and an intermediate substrate provided so as to electrically connect the actuator to the flexible printed circuit board and having a second bonding portion bonded to the flexible printed circuit board formed inwardly of a first bonding portion, bonded to the actuator in a width direction of the inkjet head plate.

Abstract: There is provided a dissolution properties measurement system using a piezoelectric sensor, capable of continuously measuring dissolution properties of a substrate in an aqueous solution by using the piezoelectric sensor. The dissolution properties measurement system includes: a specimen receiving unit including a chamber receiving a specimen therein; a mass measuring unit connected with the specimen to measure a mass change of the specimen in real time; and a dissolution properties measuring unit measuring a dissolution properties of the specimen on the basis of the value measured by the mass measuring unit.

Abstract: There are provided an inkjet head actuator and a manufacturing method of the same. The inkjet head actuator includes: a vibration plate having a recess formed in a top surface thereof; a first electrode formed to cover a bottom surface and a side wall of the recess; a piezoelectric body formed on the first electrode to fill the recess; and a second electrode formed on the piezoelectric body. The inkjet head actuator having the thin film piezoelectric body and the vibration plate ensures large vibration displacement.

Abstract: A circuit line forming device, including an inkjet head to eject a conductive ink onto one side of a substrate, the conductive ink containing nanoparticles including a ferromagnetic core and a conductive layer surrounding the ferromagnetic core; and a magnetic field generator part, positioned on the other side of the substrate in correspondence with the inkjet head, wherein the magnetic field generator part applies a magnetic field on the conductive ink, when the conductive ink is ejected to form circuit lines.

Abstract: Disclosed are an electronic component module and a method of manufacturing the same. The electronic component module includes a first insulating layer having a first surface in which first circuit patterns are embedded, electronic components of different kinds, the electronic components being mounted on the first circuit patterns and having electrode parts placed in different locations, and a molding layer encompassing the electronic components. Accordingly, a thin-film type electronic component module having a thin insulating layer with a circuit pattern can be provided.