Abstract: Roughly described, an antenna diode is formed at least partially within the exclusion zone around a TSV, and is connected to the TSV by way of a metal 1 layer conductor at the same time that the TSV is connected to either the gate poly or a diffusion region of one or more transistors placed outside the exclusion zone.

Abstract: Roughly described, an antenna diode is formed at least partially within the exclusion zone around a TSV, and is connected to the TSV by way of a metal 1 layer conductor at the same time that the TSV is connected to either the gate poly or a diffusion region of one or more transistors placed outside the exclusion zone.

Abstract: One embodiment of the present invention provides a system that computes dummy feature density for a CMP (Chemical-Mechanical Polishing) process. Note that the dummy feature density is used to add dummy features to a layout to reduce the post-CMP topography variation. During operation, the system discretizes a layout of an integrated circuit into a plurality of panels. Next, the system computes a feature density and a slack density for the plurality of panels. The system then computes a dummy feature density for the plurality of panels by, iteratively, (a) calculating an effective feature density for the plurality of panels using the feature density and a function that models the CMP process, (b) calculating a filling amount for a set of panels in the plurality of panels using a target feature density, the effective feature density, and the slack density, and (c) updating the feature density, the slack density, and the dummy feature density for the set of panels using the filling amount.

Abstract: Roughly described, an antenna diode is formed at least partially within the exclusion zone around a TSV, and is connected to the TSV by way of a metal 1 layer conductor at the same time that the TSV is connected to either the gate poly or a diffusion region of one or more transistors placed outside the exclusion zone.

Abstract: A method and system for minimizing sub-threshold leakage in a logic block is disclosed. An NDR isolation device is coupled between the logic block and ground to form a virtual ground node. To put the logic block into sleep mode, the virtual ground control device raises the voltage at the virtual ground node above an isolation voltage, which causes NDR isolation device isolates the virtual ground node from ground. The virtual ground control device can then raise the voltage at the virtual ground node to the positive supply voltage to eliminate sub-threshold leakage currents the logic block. Alternatively, the virtual ground control device can raise the voltage at the virtual ground node to the positive supply voltage minus a retention voltage so that storage elements in the logic block can retain state information while still greatly reducing sub-threshold leakage current.

Abstract: Embodiments of an interface circuit are described. This interface circuit includes an input pad, a control node and a transistor, which has three terminals. A first terminal is electrically coupled to the input pad and a second terminal is electrically coupled to the control node. Moreover, the interface circuit includes a micro-electromechanical system (MEMS) switch, which is electrically coupled to the input pad and the control node, where the MEMS switch is in parallel with the transistor. In the absence of a voltage applied to a control terminal of the MEMS switch, the MEMS switch is closed, thereby electrically coupling the input pad and the control node. Furthermore, when the voltage is applied to the control terminal of the MEMS switch, the MEMS switch is open, thereby electrically decoupling the input pad and the control node.

Abstract: Embodiments of an interface circuit are described. This interface circuit includes an input pad, a control node and a transistor, which has three terminals. A first terminal is electrically coupled to the input pad and a second terminal is electrically coupled to the control node. Moreover, the interface circuit includes a micro-electromechanical system (MEMS) switch, which is electrically coupled to the input pad and the control node, where the MEMS switch is in parallel with the transistor. In the absence of a voltage applied to a control terminal of the MEMS switch, the MEMS switch is closed, thereby electrically coupling the input pad and the control node. Furthermore, when the voltage is applied to the control terminal of the MEMS switch, the MEMS switch is open, thereby electrically decoupling the input pad and the control node.

Abstract: One embodiment of the present invention provides a system that computes dummy feature density for a CMP (Chemical-Mechanical Polishing) process. Note that the dummy feature density is used to add dummy features to a layout to reduce the post-CMP topography variation. During operation, the system discretizes a layout of an integrated circuit into a plurality of panels. Next, the system computes a feature density and a slack density for the plurality of panels. The system then computes a dummy feature density for the plurality of panels by, iteratively, (a) calculating an effective feature density for the plurality of panels using the feature density and a function that models the CMP process, (b) calculating a filling amount for a set of panels in the plurality of panels using a target feature density, the effective feature density, and the slack density, and (c) updating the feature density, the slack density, and the dummy feature density for the set of panels using the filling amount.

Abstract: One embodiment of the present invention provides a system that computes dummy feature density for a CMP (Chemical-Mechanical Polishing) process. Note that the dummy feature density is used to add dummy features to a layout to reduce the post-CMP topography variation. During operation, the system discretizes a layout of an integrated circuit into a plurality of panels. Next, the system computes a feature density and a slack density for the plurality of panels. The system then computes a dummy feature density for the plurality of panels by, iteratively, (a) calculating an effective feature density for the plurality of panels using the feature density and a function that models the CMP process, (b) calculating a filling amount for a set of panels in the plurality of panels using a target feature density, the effective feature density, and the slack density, and (c) updating the feature density, the slack density, and the dummy feature density for the set of panels using the filling amount.

Abstract: A method and system for minimizing sub-threshold leakage in a logic block is disclosed. An NDR isolation device is coupled between the logic block and ground to form a virtual ground node. To put the logic block into sleep mode, the virtual ground control device raises the voltage at the virtual ground node above an isolation voltage, which causes NDR isolation device isolates the virtual ground node from ground. The virtual ground control device can then raise the voltage at the virtual ground node to the positive supply voltage to eliminate sub-threshold leakage currents the logic block. Alternatively, the virtual ground control device can raise the voltage at the virtual ground node to the positive supply voltage minus a retention voltage so that storage elements in the logic block can retain state information while still greatly reducing sub-threshold leakage current.

Abstract: A method and system for minimizing sub-threshold leakage in a logic block is disclosed. An NDR isolation device is coupled between the logic block and ground to form a virtual ground node. To put the logic block into sleep mode, the virtual ground control device raises the voltage at the virtual ground node above an isolation voltage, which causes NDR isolation device isolates the virtual ground node from ground. The virtual ground control device can then raise the voltage at the virtual ground node to the positive supply voltage to eliminate sub-threshold leakage currents the logic block. Alternatively, the virtual ground control device can raise the voltage at the virtual ground node to the positive supply voltage minus a retention voltage so that storage elements in the logic block can retain state information while still greatly reducing sub-threshold leakage current.

Abstract: One embodiment of the invention provides a system that facilitates designing an integrated circuit using a mask-programmable fabric, which contains both mask-programmable logic and a mask-programmable interconnect. During operation, the system receives a description of a mask-programmable cell, wherein instances of the mask-programmable cell are repeated to form the mask-programmable fabric. The system uses this description of the mask-programmable cell to generate a derived library containing cells that can be obtained by programming the mask-programmable cell. Next, the system receives a high-level design for the integrated circuit. The system then performs a synthesis operation on the high-level design to generate a preliminary netlist for the high-level design, wherein the preliminary netlist contains references to cells in the derived library. Finally, the system converts the preliminary netlist into a netlist that contains references to the mask-programmable cell with the logic appropriately programmed.

Abstract: A method and system for minimizing sub-threshold leakage in a logic block is disclosed An NDR isolation device is coupled between the logic block and ground to form a virtual ground node. To put the logic block into sleep mode, the virtual ground control device raises the voltage at the virtual ground node above an isolation voltage, which causes NDR isolation device isolates the virtual ground node from ground. The virtual ground control device can then raise the voltage at the virtual ground node to the positive supply voltage to eliminate sub-threshold leakage currents the logic block. Alternatively, the virtual ground control device can raise the voltage at the virtual ground node to the positive supply voltage minus a retention voltage so that storage elements in the-logic block can retain state information while still greatly reducing sub-threshold leakage current.

Abstract: One embodiment of the invention provides a system for creating a mask-programmable module from standard cells. The system operates by first specifying characteristics of an end design and then selecting a plurality of standard cells from a standard cell library based on the characteristics of the end design. Next, the system combines the plurality of standard cells into a mask-programmable module, wherein instances of the mask-programmable module are repeated to form a mask-programmable fabric. The system also designs a mask-programmable interconnect to match the mask-programmable module, whereby connections within the mask-programmable module and between mask-programmable modules can be generated by programming the mask-programmable interconnect.

Abstract: One embodiment of the invention provides a system for creating a mask-programmable module from standard cells. The system operates by first specifying characteristics of an end design and then selecting a plurality of standard cells from a standard cell library based on the characteristics of the end design. Next, the system combines the plurality of standard cells into a mask-programmable module, wherein instances of the mask-programmable module are repeated to form a mask-programmable fabric. The system also designs a mask-programmable interconnect to match the mask-programmable module, whereby connections within the mask-programmable module and between mask-programmable modules can be generated by programming the mask-programmable interconnect.

Abstract: One embodiment of the invention provides a system that facilitates designing an integrated circuit using a mask-programmable fabric, which contains both mask-programmable logic and a mask-programmable interconnect. During operation, the system receives a description of a mask-programmable cell, wherein instances of the mask-programmable cell are repeated to form the mask-programmable fabric. The system uses this description of the mask-programmable cell to generate a derived library containing cells that can be obtained by programming the mask-programmable cell. Next, the system receives a high-level design for the integrated circuit. The system then performs a synthesis operation on the high-level design to generate a preliminary netlist for the high-level design, wherein the preliminary netlist contains references to cells in the derived library. Finally, the system converts the preliminary netlist into a netlist that contains references to the mask-programmable cell with the logic appropriately programmed.

Abstract: One embodiment of the present invention provides a system that computes dummy feature density for a CMP (Chemical-Mechanical Polishing) process. Note that the dummy feature density is used to add dummy features to a layout to reduce the post-CMP topography variation. During operation, the system discretizes a layout of an integrated circuit into a plurality of panels. Next, the system computes a feature density and a slack density for the plurality of panels. The system then computes a dummy feature density for the plurality of panels by, iteratively, (a) calculating an effective feature density for the plurality of panels using the feature density and a function that models the CMP process, (b) calculating a filling amount for a set of panels in the plurality of panels using a target feature density, the effective feature density, and the slack density, and (c) updating the feature density, the slack density, and the dummy feature density for the set of panels using the filling amount.

Abstract: The present invention provides a voltage tolerant input/output circuit configured to ensure proper interface tolerance between various close voltages in deep sub-micron circuits without any DC leakage. The voltage tolerant input/output circuit includes (1) an arbiter circuit logically configured to ensure that a gate of a P-driver of the voltage tolerant input/output circuit is biased at the higher of an input/output voltage and an input/output supply voltage when the P-driver is tri-stated, (2) a bias circuit logically configured to biased a floating N-well of the P-driver to ensure that no parasitic diodes formed between any source or drain of a p-device of the voltage tolerant input/output circuit and the N-well of the P-driver is forward biased, and (3) a driver circuit comprising the P-driver.

Abstract: A buffer characterized by a pull-up network and a pull-down network which are both coupled between an input and an output of the buffer. Each of the networks include a number of switch elements which can be sequentially turned on or off by means of an RC network to provide slew-rate control for the buffer. Preferably, each of the networks are associated with diode bypass networks to reduce crowbar current. In operation, both the pull-up network and the pull-down network turn on slowly but turn off very quickly due to the diode bypass networks.

Abstract: Slew-rate control is implemented in input/output device structures where MOSFETs are employed to switch the output signal. These MOSFETs each have a substrate, an insulating layer adjacent to the substrate and a strip of semiconductor material separated from the substrate by the insulating layer. The strip of semiconductor material functions as the gate of the MOSFET. The strip of semiconductor material does not form a closed loop. One end of the strip of a first transistor is connected to one end of the strip of the second transistor. Thus, the gates of the two transistors are placed in series so that they are not switched on at the same time. A delay is thereby automatically introduced between the switching on of the two transistors. The delay is controlled by placing metal straps across selected transistor gates to effectively bypass the delays caused by the current propagating through the gates.