Abstract: Embodiments of the present disclosure are directed to leadframes having the cantilevered extension that includes an integral support on the end of the lead nearest the die pad. A support integral to the leadframe allows the support to be built to the proper height to support the cantilevered lead in each package and reduces or eliminates the upward, downward, and side to side deflections caused or allowed by supports built-in to the tooling of the manufacturing equipment. Also, by building the support into the leadframe, the leadframes may be pretaped prior to the die attach and wire bonding steps of the manufacturing process.

Abstract: A leadframe having extensions around an outer edge of a die pad are disclosed. More specifically, leadframes are created with a flange formed at the outer edge of the die pad and extending away from the die pad. The flange is bent, such that it is positioned at an angle with respect to the die pad. Leadframes are also created with anchoring posts formed adjacent the outer edge of the die pad and extending away from the die pad. The anchoring posts have a central thickness that is less than a thickness of first and second portions opposite the central portion. When the leadframe is incorporated into a package, molding compound completely surrounds each flange or anchoring post, which increases the bond strength between the leadframe and the molding compound due to increased contact area. The net result is a reduced possibility of delamination at edges of the die pad.

Abstract: The present disclosure is directed to a semiconductor die on a tapeless leadframe and covered in encapsulant. The semiconductor package includes leads formed from the leadframe and electrically coupled to the semiconductor die, the leads being accessible through electrical contacts embedded in the encapsulant. Openings between the leads and the leadframe are formed from etching recesses from opposing sides of the leadframe. The resulting openings have non-uniform sidewalls. The leadframe is further electrically or thermally coupled to electrical contacts embedded in the encapsulant. The embedded electrical contacts forming a land grid array.

Abstract: The present disclosure is directed to a leadframe package having a side solder ball contact and methods of manufacturing the same. A plurality of solder balls are coupled to recesses in a leadframe before encapsulation and singulation. After singulation, a portion of each solder ball is exposed on sidewalls of the package. This ensures that the sidewalls of the leads are solder wettable, which allows for the formation of stronger joints when the package is coupled to a substrate. This increased adhesion reduces resistance at the joints and also mitigates the effects of expansion of the components in the package such that delamination is less likely to occur. As a result, packages with a side solder ball contact have increased life cycle expectancies.

Abstract: According to principles as taught herein, a leadframe array for a semiconductor die is prepared having locations to receive solder balls. Solder balls are then applied to the leadframe array, after which the leadframe array and solder ball combination is placed in a first mold and encased in a first molding compound. After the molding compound is cured, a layer of molding compound is removed to expose the solder balls. After this, a semiconductor die is electrically connected to the exposed solder balls. The combined semiconductor die and leadframe are placed in a second mold, and a second molding compound injected. The second molding compound flows around the semiconductor die and leadframe combination, fully enclosing the electrical connections between the leadframe and the semiconductor die, making the final package a twice-molded configuration. After this, the twice-molded semiconductor package array is cut at the appropriate locations to singulate the packages into individual products.

Abstract: The present disclosure is directed to a leadframe having a recess in a body of the leadframe to collect glue overflowing from the manufacturing process of coupling a semiconductor die to the leadframe. The recess extends beneath an edge of the semiconductor die so that any tendency of the glue to adhere to the semiconductor die is counteracted by a tendency of the glue to adhere to a wall of the recess and at least partially fill the volume of the recess. In addition, the recess for collecting adhesive may also form a mold lock on an edge of the leadframe, the mold lock providing a more durable connection between the leadframe and an encapsulant during physical and temperature stresses.

Abstract: According to principles as taught herein, a leadframe array for a semiconductor die is prepared having locations to receive solder balls. Solder balls are then applied to the leadframe array, after which the leadframe array and solder ball combination is placed in a first mold and encased in a first molding compound. After the molding compound is cured, a layer of molding compound is removed to expose the solder balls. After this, a semiconductor die is electrically connected to the exposed solder balls. The combined semiconductor die and leadframe are placed in a second mold, and a second molding compound injected. The second molding compound flows around the semiconductor die and leadframe combination, fully enclosing the electrical connections between the leadframe and the semiconductor die, making the final package a twice-molded configuration. After this, the twice-molded semiconductor package array is cut at the appropriate locations to singulate the packages into individual products.

Abstract: According to principles of the disclosure as explained herein, selected leads are electrically connected through metal strips to the lead frame until the end of the manufacturing process. The lead frame is grounded through the manufacturing process to prevent any ESD event from causing damage to the protected leads. In the final singulation step, the leads are electrically isolated from each other and from the lead frame, thus maintaining protection from a potential ESD event up until the final package singulation step.

Abstract: The present disclosure is directed to a semiconductor die on a tapeless leadframe and covered in encapsulant. The semiconductor package includes leads formed from the leadframe and electrically coupled to the semiconductor die, the leads being accessible through electrical contacts embedded in the encapsulant. Openings between the leads and the leadframe are formed from etching recesses from opposing sides of the leadframe. The resulting openings have non-uniform sidewalls. The leadframe is further electrically or thermally coupled to electrical contacts embedded in the encapsulant. The embedded electrical contacts forming a land grid array.

Abstract: The present disclosure is directed to a leadframe package having a side solder ball contact and methods of manufacturing the same. A plurality of solder balls are coupled to recesses in a leadframe before encapsulation and singulation. After singulation, a portion of each solder ball is exposed on sidewalls of the package. This ensures that the sidewalls of the leads are solder wettable, which allows for the formation of stronger joints when the package is coupled to a substrate. This increased adhesion reduces resistance at the joints and also mitigates the effects of expansion of the components in the package such that delamination is less likely to occur. As a result, packages with a side solder ball contact have increased life cycle expectancies.

Abstract: The present disclosure is directed to a leadframe having a recess in a body of the leadframe to collect glue overflowing from the manufacturing process of coupling a semiconductor die to the leadframe. The recess extends beneath an edge of the semiconductor die so that any tendency of the glue to adhere to the semiconductor die is counteracted by a tendency of the glue to adhere to a wall of the recess and at least partially fill the volume of the recess. In addition, the recess for collecting adhesive may also form a mold lock on an edge of the leadframe, the mold lock providing a more durable connection between the leadframe and an encapsulant during physical and temperature stresses.

Abstract: The present disclosure is directed to a leadframe package having a side solder ball contact and methods of manufacturing the same. A plurality of solder balls are coupled to recesses in a leadframe before encapsulation and singulation. After singulation, a portion of each solder ball is exposed on sidewalls of the package. This ensures that the sidewalls of the leads are solder wettable, which allows for the formation of stronger joints when the package is coupled to a substrate. This increased adhesion reduces resistance at the joints and also mitigates the effects of expansion of the components in the package such that delamination is less likely to occur. As a result, packages with a side solder ball contact have increased life cycle expectancies.

Abstract: The present disclosure is directed to a die having a metallized sidewall and methods of manufacturing the same. A contiguous metal layer is applied to each edge of a backside of a wafer. The wafer is cut at a base of a plurality of channels formed in the backside to create individual die each having a flange that is part of a sidewall of the die and includes a portion that is covered by the metal layer. When an individual die is coupled to a die pad, a semiconductive glue bonds the metal layer on the sidewall and a backside of the die to the die pad, which decreases the risk of delamination along the sides of the die. The flange also prevents the glue from contacting the active side of the die by acting as a barrier against adhesive creep of the glue up the sidewall of the die.

Abstract: A semiconductor device may include a circuit board having an opening, and a frame. The frame may have an IC die pad in the opening, and arms extending outwardly from the IC die pad and coupled to the circuit board. The semiconductor device may include an IC mounted on the IC die pad, bond wires coupling the circuit board with the IC, and encapsulation material surrounding the IC, the bond wires, and the arms.

Abstract: The present disclosure is directed to a leadframe having a recess in a body of the leadframe to collect glue overflowing from the manufacturing process of coupling a semiconductor die to the leadframe. The recess extends beneath an edge of the semiconductor die so that any tendency of the glue to adhere to the semiconductor die is counteracted by a tendency of the glue to adhere to a wall of the recess and at least partially fill the volume of the recess. In addition, the recess for collecting adhesive may also form a mold lock on an edge of the leadframe, the mold lock providing a more durable connection between the leadframe and an encapsulant during physical and temperature stresses.

Abstract: A method is for making a semiconductor device. The method may include providing a lead frame having a recess, forming a sacrificial material in the recess of the lead frame, and mounting an IC on the lead frame. The method may include encapsulating the IC and the lead frame, removing portions of the lead frame to define lead frame contacts for the IC, and removing the sacrificial material to define for each lead frame contact a solder anchoring tab extending outwardly at a lower region and defining a sidewall recess between opposing portions of the solder anchoring tab and the encapsulation material.

Abstract: One or more embodiments are directed to semiconductor packages with one or more cantilever pads and methods of making same. In one embodiment a recess is located in a substrate of the package facing the cantilever pad. The cantilever pad includes a conductive pad on which a conductive ball is formed. The cantilever pad is configured to absorb stresses acting on the package.

Abstract: The present disclosure is directed to a leadframe package having a side solder ball contact and methods of manufacturing the same. A plurality of solder balls are coupled to recesses in a leadframe before encapsulation and singulation. After singulation, a portion of each solder ball is exposed on sidewalls of the package. This ensures that the sidewalls of the leads are solder wettable, which allows for the formation of stronger joints when the package is coupled to a substrate. This increased adhesion reduces resistance at the joints and also mitigates the effects of expansion of the components in the package such that delamination is less likely to occur. As a result, packages with a side solder ball contact have increased life cycle expectancies.

Abstract: A method is for making a semiconductor device. The method may include providing a lead frame having a recess, forming a sacrificial material in the recess of the lead frame, and mounting an IC on the lead frame. The method may include encapsulating the IC and the lead frame, removing portions of the lead frame to define lead frame contacts for the IC, and removing the sacrificial material to define for each lead frame contact a solder anchoring tab extending outwardly at a lower region and defining a sidewall recess between opposing portions of the solder anchoring tab and the encapsulation material.

Abstract: A method for making a semiconductor device may include bonding a top lead frame component, having recesses, with a bottom lead frame component to form a lead frame, the top and bottom lead frame components each including metal. The method may include mounting an IC on the lead frame, encapsulating the IC and the lead frame, and removing portions of the bottom lead frame component to define contacts for the IC.