Patents by Inventor Jeffrey A. Zitz
Jeffrey A. Zitz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160165755Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.Type: ApplicationFiled: December 5, 2014Publication date: June 9, 2016Inventors: Paul F. BODENWEBER, Kenneth C. MARSTON, Kamal K. SIKKA, Hilton T. TOY, Randall J. WERNER, Jeffrey A. ZITZ
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Publication number: 20150371922Abstract: Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.Type: ApplicationFiled: August 28, 2015Publication date: December 24, 2015Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Evan G. Colgan, Taryn J. Davis, Chenzhou Lian, Yi Pan, Kamal K. Sikka, Jeffrey A. Zitz
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Publication number: 20150371917Abstract: Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.Type: ApplicationFiled: August 27, 2015Publication date: December 24, 2015Applicant: International Business Machines CorporationInventors: Evan G. Colgan, Taryn J. Davis, Chenzhou Lian, Yi Pan, Kamal K. Sikka, Jeffrey A. Zitz
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Publication number: 20150373880Abstract: Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.Type: ApplicationFiled: August 28, 2015Publication date: December 24, 2015Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Evan G. Colgan, Taryn J. Davis, Chenzhou Lian, Yi Pan, Kamal K. Sikka, Jeffrey A. Zitz
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Publication number: 20150373879Abstract: Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.Type: ApplicationFiled: August 27, 2015Publication date: December 24, 2015Applicant: International Business Machines CorporationInventors: Evan G. Colgan, Taryn J. Davis, Chenzhou Lian, Yi Pan, Kamal K. Sikka, Jeffrey A. Zitz
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Publication number: 20150371919Abstract: Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.Type: ApplicationFiled: August 28, 2015Publication date: December 24, 2015Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Evan G. Colgan, Taryn J. Davis, Chenzhou Lian, Yi Pan, Kamal K. Sikka, Jeffrey A. Zitz
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Publication number: 20150371918Abstract: Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.Type: ApplicationFiled: August 27, 2015Publication date: December 24, 2015Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Evan G. Colgan, Taryn J. Davis, Chenzhou Lian, Yi Pan, Kamal K. Sikka, Jeffrey A. Zitz
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Patent number: 9153460Abstract: An assembly process for a heatsink attachment module for a chip packaging apparatus is provided and includes attaching a semiconductor chip to a substrate to form a module subassembly, placing a load frame and shim in a fixture, dispensing adhesive to the load frame and loadably placing the module subassembly chip face down in the fixture.Type: GrantFiled: August 27, 2013Date of Patent: October 6, 2015Assignee: International Business Machines CorporationInventors: Evan G. Colgan, Michael A. Gaynes, Jeffrey A. Zitz
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Patent number: 9105500Abstract: A multi-chip module (MCM) package is provided and includes a substrate and a hat assembly. The substrate includes a surface on which chips of the MCM are re-workable. The hat assembly is configured to be non-hermetically sealed to the substrate. The hat assembly and the substrate are configured for tension-type disassembly in a dimension oriented substantially normally with respect to a plane of the substrate surface.Type: GrantFiled: July 13, 2012Date of Patent: August 11, 2015Assignee: International Business Machines CorporationInventors: Paul F. Bodenweber, Hilton T. Toy, Krishna R. Tunga, Jeffrey A. Zitz
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Patent number: 9087834Abstract: A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips.Type: GrantFiled: October 28, 2013Date of Patent: July 21, 2015Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Suresh D. Kadakia, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz
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Patent number: 9066460Abstract: Cooled electronic assemblies and methods of fabrication are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic component(s), and one or more coolant-carrying channel(s) integrated within the module, and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure facilitates flow of coolant to the coolant-carrying channel(s) of the electronic module, and the coolant manifold structure and electronic module include adjoining surfaces. One surface of the adjoining surfaces includes a plurality of coolant capillaries or passages. The coolant capillaries are sized to inhibit, for instance, via surface tension, leaking of coolant therefrom at the one surface with decoupling of the coolant manifold structure and electronic module along the adjoining surfaces.Type: GrantFiled: January 17, 2013Date of Patent: June 23, 2015Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Thomas J. Brunschwiler, Evan G. Colgan, Michael J. Ellsworth, Jr., Werner Escher, Ingmar Meijer, Stephen Paredes, Gerd Schlottig, Jeffrey A. Zitz
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Patent number: 8937810Abstract: Cooled electronic assemblies, and a method of decoupling a cooled electronic assembly, are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic components and one or more coolant-carrying channels integrated within the module and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure, which includes a coolant inlet and outlet in fluid communication with the coolant-carrying channel(s) of the electronic module, facilitates flow of coolant through the coolant-carrying channel, and thus cooling of the electronic component(s). Coolant-absorbent material is positioned at the interface between the electronic module and the manifold structure to facilitate absorbing any excess coolant during a stepwise detaching of the manifold structure from the electronic module.Type: GrantFiled: September 14, 2012Date of Patent: January 20, 2015Assignee: International Business Machines CorporationInventors: Thomas J. Brunschwiler, Evan G. Colgan, Michael J. Ellsworth, Jr., Werner Escher, Ingmar G. Meijer, Stephan Paredes, Gerd Schlottig, Martin Witzig, Jeffrey A. Zitz
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Patent number: 8906809Abstract: A multi-chip electronic package and methods of manufacture are provided. The structure includes a lid encapsulating at least one chip mounted on a chip carrier; at least one seal shim fixed between the lid and the chip carrier, the at least one seal shim forming a gap between pistons of the lid and respective ones of the chips; and thermal interface material within the gap and contacting the pistons of the lid and respective ones of the chips.Type: GrantFiled: June 7, 2012Date of Patent: December 9, 2014Assignee: International Business Machines CorporationInventors: Martin M. Beaumier, Steven P. Ostrander, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz
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Patent number: 8900927Abstract: A multi-chip electronic package and methods of manufacture are provided. The method includes contacting pistons of a lid with respective ones of chips on a chip carrier. The method further includes separating the lid and the chip carrier and placing at least one seal shim on one of the lid and chip carrier. The at least one seal shim has a thickness that results in a gap between the pistons with the respective ones of the chips on the chip carrier. The method further includes dispensing thermal interface material within the gap and in contact with the chips. The method further includes sealing the lid to the chip carrier with the at least one seal shim between the lid and the chip carrier.Type: GrantFiled: August 16, 2010Date of Patent: December 2, 2014Assignee: International Business Machines CorporationInventors: Martin M. Beaumier, Steven P. Ostrander, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz
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Publication number: 20140331792Abstract: An apparatus for determining a magnitude of a compressive load applied to a piston including a compliant film disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the magnitude of the compressive load is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to a deformation of the compliant film as the compressive load is applied.Type: ApplicationFiled: July 24, 2014Publication date: November 13, 2014Inventors: Paul F. Bodenweber, Virendra R. Jadhav, Steven P. Ostrander, Kamal K. Sikka, Jiantao Zheng, Jeffrey A. Zitz
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Patent number: 8860206Abstract: A multi-chip electronic package and methods of manufacture are provided. The method includes adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier. The adjusting includes placing a chip shim on the chips and placing a seal shim between a lid and the chip carrier. The seal shim is thicker than the chip shim. The adjusting further includes lowering the lid until the pistons contact the chip shim. The method further includes separating the lid and the chip carrier and removing the chip shim and the seal shim. The method further includes dispensing thermal interface material on the chips and lowering the lid until a gap filled with the thermal interface material is about a particle size of the thermal interface material. The method further includes sealing the lid to the chip carrier with sealant.Type: GrantFiled: September 30, 2013Date of Patent: October 14, 2014Assignee: International Business Machines CorporationInventors: Kamal K. Sikka, Hilton T. Toy, Krishna R. Tunga, Jeffrey A. Zitz
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Publication number: 20140284040Abstract: Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.Type: ApplicationFiled: March 22, 2013Publication date: September 25, 2014Applicant: International Business Machines CorporationInventors: Evan G. Colgan, Taryn J. Davis, Chenzhou Lian, Yi Pan, Kamal K. Sikka, Jeffrey A. Zitz
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Patent number: 8823164Abstract: A chip packaging apparatus includes a substrate, a load frame attached to the substrate by an adhesive material, the load frame being formed to define an aperture and a semiconductor chip mounted on the substrate within the aperture. A thickness of the adhesive material between the load frame and the substrate is varied and adjusted such that a surface of the load frame opposite the substrate is disposed substantially in parallel to a surface of the chip opposite the substrate.Type: GrantFiled: October 28, 2011Date of Patent: September 2, 2014Assignee: International Business Machines CorporationInventors: Evan G. Colgan, Michael A. Gaynes, Jeffrey A. Zitz
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Patent number: 8794079Abstract: An apparatus for determining a magnitude of a compressive load applied to a piston including a compliant film disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the magnitude of the compressive load is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to a deformation of the compliant film as the compressive load is applied.Type: GrantFiled: November 4, 2011Date of Patent: August 5, 2014Assignee: International Business Machines CorporationInventors: Paul F. Bodenweber, Virendra R. Jadhav, Steven P. Ostrander, Kamal Sikka, Jiantao Zheng, Jeffrey A. Zitz
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Publication number: 20140198452Abstract: Cooled electronic assemblies and methods of fabrication are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic component(s), and one or more coolant-carrying channel(s) integrated within the module, and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure facilitates flow of coolant to the coolant-carrying channel(s) of the electronic module, and the coolant manifold structure and electronic module include adjoining surfaces. One surface of the adjoining surfaces includes a plurality of coolant capillaries or passages. The coolant capillaries are sized to inhibit, for instance, via surface tension, leaking of coolant therefrom at the one surface with decoupling of the coolant manifold structure and electronic module along the adjoining surfaces.Type: ApplicationFiled: January 17, 2013Publication date: July 17, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Thomas J. BRUNSCHWILER, Evan G. COLGAN, Michael J. ELLSWORTH, JR., Werner ESCHER, Ingmar MEIJER, Stephen PAREDES, Gerd SCHLOTTIG, Jeffrey A. ZITZ