Patents by Inventor Jie Lin

Jie Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11965329
    Abstract: A connection between a connector, a fastener and one or more structural members is disclosed. The connector can be formed with a fastening and alignment member. The fastening and alignment member includes a projecting member and a protruding member in close proximity to a predetermined location for the fastener.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: April 23, 2024
    Inventors: Michael S. Downs, Jin-Jie Lin, Timothy M. Stauffer, Emmet J. Mielbrecht, Dustin P. Muhn
  • Publication number: 20240124307
    Abstract: The present disclosure provides a method for preparing lithium iron phosphate from ferric hydroxyphosphate, including: purifying ferrous sulfate to form a ferrous sulfate solution, adding hydrogen peroxide, phosphoric acid, an ammonium dihydrogen phosphate solution and ammonia water into the ferrous sulfate solution and then reacting to form a mixed slurry, holding the mixed slurry at a temperature for a period of time, and then washing with water and subjecting to press filtration to form ferric hydroxyphosphate precursors with different iron-phosphorus ratios; then flash drying, sintering at a high temperature, and pulverizing to obtain ferric hydroxyphosphate precursors with different iron-phosphorus ratios and different specific surface areas.
    Type: Application
    Filed: December 27, 2023
    Publication date: April 18, 2024
    Inventors: Jie Sun, Ji Yang, Yihua Wei, Zhonglin He, Jianhao He, Zhongzhu Xu, Jing Mei, Guangchun Cheng, Shuo Lin, Cheng Xu, Pingjun Lin, Menghua Yu, Bin Wang, Xiaoting Wang, Chao Liu, Yuan Yao
  • Publication number: 20240126872
    Abstract: A labeling method for information security detection rules and tactic, technique and procedure (TTP) labeling device for the same are provided. The labeling method includes: obtaining reference documents related to definitions of TTP and classify the reference documents to generate corpuses; creating a keyword thesaurus; obtaining to-be-labeled detection rules, and extracting key information fields from the to-be-labeled detection rules and comparing the key information fields with keywords, so as to label the to-be-labeled detection rules; for the to-be-labeled detection rules that are not labeled, performing a text similarity calculation on the key information fields and the corpuses, and labeling those not labeled of the to-be-labeled detection rules with the corpus having the highest similarity; training with the labeled detection rules and the corpuses as a training data set to generate a TTP labeling model; and inputting a current to-be-labeled detection rule to generate a TTP labeling result.
    Type: Application
    Filed: November 15, 2022
    Publication date: April 18, 2024
    Inventors: ZONG-JYUN LI, SHENG-XIANG LIN, DONG-JIE WU
  • Publication number: 20240128542
    Abstract: A battery pack includes a battery body, a housing, and a heat sink. The housing surrounds a part of the surface of the battery body. The heat sink is disposed on the housing. A bottom surface of the heat sink abuts against a bus board disposed on the upper end of the battery body, and the heat sink is in thermal contact with a module electrode at the upper end of the battery body. In the battery pack provided by the present application, heat dissipation around the battery body could be achieved, heat generated by a tab or heat conducted by the battery body to the tab could also be guided outwards, so that all-round heat dissipation around the battery pack is achieved. The battery pack provided by the present application is suitable for the unmanned aerial vehicle and meets the high heat dissipation requirement.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 18, 2024
    Applicant: ZHUHAI COSMX POWER BATTERY CO., LTD.
    Inventors: Zhiguo ZHANG, Xuping ZOU, Jiafan WU, Jie LI, Changquan LIN
  • Publication number: 20240116829
    Abstract: Disclosed in the present application are a concrete protection material, and a preparation method and a construction method therefor. The concrete protection material consists of 50%-90% of a component A and 10%-50% of a component B in percentage by weight, where the component A is prepared from 30%-65% of organic silicon, 2%-5% of nano-silicon dioxide and the balance of an organic solvent in percentage by weight; and the component B is prepared from 20%-50% of an organic base and the balance of water in percentage by weight. The present application not only can form nano-particles having a strengthening effect in capillary channels of a concrete surface layer, but also can achieve a technical effect of superhydrophobicity on the concrete surface layer.
    Type: Application
    Filed: November 21, 2022
    Publication date: April 11, 2024
    Applicants: NATIONAL ENGINEERING RESEARCH CENTER OF HIGH-SPEED RAILWAY CONSTRUCTION TECHNOLOGY, CHINA RAILWAY NO.4 ENGINEERING GROUP CO., LTD, ANHUI ENGINEERING MATERIAL TECHNOLOGY CO, LTD OF CTCE GROUP
    Inventors: Dongdong FAN, Hai HUANG, Jianfeng WEN, Jianwei PENG, Zhiyong WANG, Yitao CHEN, Chenhao WU, Jianan YAO, Jie TANG, Juan CHEN, Chunhong LIN, Xianzhu HU, Zhiwu YU
  • Publication number: 20240120316
    Abstract: The present disclosure relates to a semiconductor package, a semiconductor bonding structure and a method of fabricating the same. The semiconductor package includes a first chip, a second chip and a conductive structure, wherein the conductive structure is disposed at a side of the second chip and over a second upper surface of the first interconnection structure to electrically connect to the first interconnection structure. The semiconductor bonding structure includes a first substrate, a plurality of first interconnection structures, a plurality of chips and a plurality of conductive structures, wherein the conductive structures are respectively disposed at a side of each of the chips and over a second upper surface of each first interconnection structure, to electrically connect to each first interconnection.
    Type: Application
    Filed: November 17, 2022
    Publication date: April 11, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Kai-Kuang Ho, Yu-Jie Lin, Yi-Feng Hsu
  • Publication number: 20240118355
    Abstract: The present disclosure relates to a wide-range perpendicular sensitive magnetic sensor and the method for manufacturing the same, the magnetic sensor includes a substrate, a plurality of magnetic tunnel junctions, a plurality of magnetic flux regulators, a first output port and a second output port.
    Type: Application
    Filed: September 6, 2023
    Publication date: April 11, 2024
    Applicant: DIGITAL GRID RES. INST., CHINA SOUTHERN PWR. GRID
    Inventors: Peng LI, Qiancheng LV, Bing TIAN, Zejie TAN, Zhiming WANG, Jie WEI, Renze CHEN, Xiaopeng FAN, Zhong LIU, Zhenheng XU, Senjing YAO, Licheng LI, Yuehuan LIN, Shengrong LIU, Bofeng LUO, Jiaming ZHANG, Xu YIN
  • Publication number: 20240120306
    Abstract: A semiconductor package includes a die stack including a first semiconductor die having a first interconnect structure, and a second semiconductor die having a second interconnect structure direct bonding to the first interconnect structure of the first semiconductor die. The second interconnect structure includes connecting pads disposed in a peripheral region around the first semiconductor die. First connecting elements are disposed on the connecting pads, respectively. A substrate includes second connecting elements on a mounting surface of the substrate. The first connecting elements are electrically connected to the second connecting elements through an anisotropic conductive structure.
    Type: Application
    Filed: November 4, 2022
    Publication date: April 11, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Kai-Kuang Ho, Yu-Jie Lin, Yi-Feng Hsu
  • Patent number: 11954521
    Abstract: A deep learning job scheduling method includes obtaining a job request of a deep learning job, determining a target job description file template from a plurality of pre-stored job description file templates based on the job request, determining an identifier of a target job basic image from identifiers of a plurality of pre-stored job basic images based on the job request, generating a target job description file based on the target job description file template and the identifier of the target job basic image, sending the target job description file to a container scheduler, and selecting the target job basic image from the pre-stored job base images based on the target job description file, and creating at least one container for executing the job request.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: April 9, 2024
    Assignee: HUAWEI CLOUD COMPUTING TECHNOLOGIES CO., LTD.
    Inventors: Jian Lin, Jie Yang, Sibao Hong
  • Patent number: 11953568
    Abstract: The present disclosure relates to a wide-range perpendicular sensitive magnetic sensor and the method for manufacturing the same, the magnetic sensor includes a substrate, a plurality of magnetic tunnel junctions, a plurality of magnetic flux regulators, a first output port and a second output port.
    Type: Grant
    Filed: September 6, 2023
    Date of Patent: April 9, 2024
    Assignee: DIGITAL GRID RES. INST., CHINA SOUTHERN PWR. GRID
    Inventors: Peng Li, Qiancheng Lv, Bing Tian, Zejie Tan, Zhiming Wang, Jie Wei, Renze Chen, Xiaopeng Fan, Zhong Liu, Zhenheng Xu, Senjing Yao, Licheng Li, Yuehuan Lin, Shengrong Liu, Bofeng Luo, Jiaming Zhang, Xu Yin
  • Publication number: 20240114625
    Abstract: A back drilling processing method for a circuit board includes: obtaining a board to be back drilled, wherein the board includes a target signal layer and at least two conductive reference layers; drilling a through hole at a set position of the board, and obtaining an actually measured spacing between two conductive reference layers; in response to a hole to be back drilled being of a first type, determining a target back drilling depth; controlling a drilling bit to drill for the target back drilling depth towards the target signal layer; in response to the hole to be back drilled being of a second type, determining a target relative height of a back drilling end point relative to a machine; and controlling the drilling bit to drill for the target relative height towards the target signal layer. The back drilling does not drill through the target signal layer.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 4, 2024
    Inventors: Dantian LIN, Yufang DU, Xuechuan HAN, Hailong LIU, Jie WU
  • Publication number: 20240113188
    Abstract: An integrated circuit (IC) structure includes a semiconductor substrate, a first gate line, a second gate line, and a first auxiliary gate portion. The semiconductor substrate comprises a semiconductor fin. The semiconductor fin extends substantially along a first direction. The first gate line and the second gate line extend substantially along a second direction different form the first direction from a top view. The first auxiliary gate portion connects the first gate line to the second gate line from the top view.
    Type: Application
    Filed: March 27, 2023
    Publication date: April 4, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wen-Li CHIU, Yi-Juei LEE, Yu-Jie YE, Chi-Hsin CHANG, Chun-Jun LIN
  • Patent number: 11946122
    Abstract: The present disclosure relates to a micron silver particle-reinforced 316L stainless steel matrix composite, including a 316L stainless steel matrix and silver particles uniformly distributed in the 316L stainless steel matrix. The silver particles have a weight 1% to 5% of the total weight of the composite; and the composite has a density of 7.9 g/cm3 to 8.2 g/cm3 and a relative density of more than 98%. The composite is prepared by the following method: mixing raw materials of a spherical silver powder and a spherical 316L stainless steel powder; subjecting a resulting mixture to mechanical ball milling to obtain a mixed powder; sieving the mixed powder and adding a resulting powder to a powder cylinder of an SLM forming machine; and charging an inert protective gas for printing to obtain the composite.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: April 2, 2024
    Assignee: NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS
    Inventors: Dongdong Gu, Kaijie Lin, Jingfeng Quan, Yamei Fang, Qing Ge, Jie Zhuang, Yang Liu, Weisong Dong, Pengjiang Shuai
  • Patent number: 11948439
    Abstract: A method of measuring one or more conditions within a predetermined area includes receiving at a control system a signal including scattered light and time of flight information associated with a plurality of nodes of a detection system, parsing the time of flight information into zones of the detection system, identifying one or more features within the scattered light signal, and analyzing the one or more features within the scattered light signal to determine a presence of the one or more conditions within the predetermined area.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: April 2, 2024
    Assignee: CARRIER CORPORATION
    Inventors: Jie Xi, Michael J. Birnkrant, Junyang Lin, Jun Hou, Peter R. Harris, Tianyuan Chen
  • Patent number: 11947694
    Abstract: A method, a computer program product, and a system for implementing a dynamic virtual database honeypot. The method includes relaying a query request received from a database client to a database and receiving, from the database, a response relating to the query request. The method also includes determining the query request is an attack on the database based on session information relating to the database and the database client, generating a honey token based on information contained within the response, generating an alternate response formatted in a same format as the response and containing artificial information that masks the information contained within the response. The method further includes inserting the honey token into the alternate response and transmitting the alternate response to the database client.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: April 2, 2024
    Assignee: International Business Machines Corporation
    Inventors: Galia Diamant, Richard Ory Jerrell, Chun-Shuo Lin, Wei-Hsiang Hsiung, Cheng-Ta Lee, Wei-Jie Liau
  • Publication number: 20240102955
    Abstract: A non-invasive time domain reflection probe calibration method includes: using different volume ratio of ethanol and deionized water mixed solution to calculate a test target's medium weight coefficient and waveguide length of the non-invasive time domain reflection probes; using different concentrations of NaCl solutions to calibrate a waveguide geometric dimensioning of the non-invasive time domain reflection probes; preparing compacted soil samples with known different moisture contents and densities, and calibrating a correlation parameter of compacted soil samples' dielectric constant and conductivity with moisture content and density. The method not only determines the sensitivity of the test target medium of the non-invasive time domain reflection probes, but also obtains the waveguide length and geometric dimensioning of the probe, and realizes an accurate test of moisture content and density of the soil.
    Type: Application
    Filed: July 28, 2023
    Publication date: March 28, 2024
    Applicants: China Jikan Research Institute Of Engineering Investigations And Design, Co.,Ltd, Xi'an Jiaotong University
    Inventors: Jie CAO, Yonglin YANG, Zaixin WAN, Peng GAO, Qingyi MU, Dongjing WANG, Yuanqiang ZHOU, Zhi LIU, Long ZHANG, Hui LI, Jian CHEN, Teng YANG, Lei RAN, Jiao LIN, Xiao DONG, Shuai LIU, Weiwei ZHAO
  • Publication number: 20240106223
    Abstract: An electrostatic discharge (ESD) protection circuit includes a first and second diode in a semiconductor wafer, an ESD clamp circuit and a first conductive structure on a backside of a semiconductor wafer. The first diode is coupled between an input output (IO) pad and a first node. The second diode is coupled to the first diode, and coupled between the IO pad and a second node. The ESD clamp circuit is in the semiconductor wafer, coupled to the first and second node, and between the first and second diode. The ESD clamp circuit includes a first signal tap region in the semiconductor wafer that is coupled to a reference voltage supply. The second diode is coupled to and configured to share the first signal tap region with the ESD clamp circuit. The first conductive structure is configured to provide a reference voltage to the first signal tap region.
    Type: Application
    Filed: November 24, 2023
    Publication date: March 28, 2024
    Inventors: Yu-Hung YEH, Wun-Jie LIN, Jam-Wem LEE
  • Patent number: 11939212
    Abstract: A MEMS device is provided. The MEMS device includes a substrate having at least one contact, a first dielectric layer disposed on the substrate, at least one metal layer disposed on the first dielectric layer, a second dielectric layer disposed on the first dielectric layer and the metal layer and having a recess structure, and a structure layer disposed on the second dielectric layer and having an opening. The opening is disposed on and corresponds to the recess structure, and the cross-sectional area at the bottom of the opening is smaller than the cross-sectional area at the top of the recess structure. The MEMS device also includes a sealing layer, and at least a portion of the sealing layer is disposed in the opening and the recess structure. The second dielectric layer, the structure layer, and the sealing layer define a chamber.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: March 26, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Heng-Chung Chang, Jhih-Jie Huang, Chih-Ya Tsai, Jing-Yuan Lin
  • Publication number: 20240099147
    Abstract: In some embodiments, the present disclosure relates to a method in which a first set of one or more voltage pulses is applied to a piezoelectric device over a first time period. During the first time period, the method determines whether a performance parameter of the piezoelectric device has a first value that deviates from a reference value by more than a predetermined value. Based on whether the first value deviates from the reference value by more than the predetermined value, the method selectively applies a second set of one or more voltage pulses to the piezoelectric device over a second time period. The second time period is after the first time period and the second set of one or more voltage pulses differs in magnitude and/or polarity from the first set of one or more voltage pulses.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 21, 2024
    Inventors: Chi-Yuan Shih, Shih-Fen Huang, You-Ru Lin, Yan-Jie Liao
  • Patent number: 11932350
    Abstract: A power assisted electric bicycle includes a body, a motor, a torque sensor, and a controller. The motor is operated in an operating period. The torque sensor is configured to output a plurality of torque signals corresponding to a pedal force. The controller is coupled to the motor and the torque sensor. The controller is configured to: receive the torque signals from the torque sensor; determine a peak and a valley, which is adjacent to the peak, among the torque signals; compute and determine a pedaling period between the peak and the valley, which is adjacent to the peak, among the torque signals; and generate an error signal associated with the torque sensor if it is determined that the pedaling period and the operating period fail to meet a default ratio.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: March 19, 2024
    Assignee: Gogoro Inc.
    Inventors: Neng-Jie Yang, Ying-Che Shih, Sung-Ching Lin