Abstract: In some aspects of the present disclosure, an electrostatic discharge (ESD) protection circuit is disclosed. In some aspects, the ESD protection circuit includes a first transistor coupled to a pad, a second transistor coupled between the first transistor and ground, a stack of transistors coupled to the first transistor, and an ESD clamp coupled between the stack of transistors and the ground.

Abstract: An electrostatic discharge (ESD) protection circuit includes a first diode, a second diode, an ESD clamp circuit and a first conductive structure on a backside of a semiconductor wafer, and being coupled to the first voltage supply. The first diode is in the semiconductor wafer, and coupled between an IO pad and a first node. The second diode is in the semiconductor wafer, coupled to the first diode and coupled between the IO pad and a second node. The ESD clamp circuit is in the semiconductor wafer, coupled between the first node and the second node, and further coupled to the first and second diode. The ESD clamp circuit includes a first signal tap region in the semiconductor wafer that is coupled to a first voltage supply. The first diode is coupled to and configured to share the first signal tap region with the ESD clamp circuit.

Abstract: An electrostatic discharge (ESD) protection apparatus and method for fabricating the same are disclosed herein. In some embodiments, the ESD protection apparatus, comprises: an internal circuit patterned in a device wafer and electrically coupled between a first node and a second node, an array of electrostatic discharge (ESD) circuits patterned in a carrier wafer, where the ESD circuits are electrically coupled between a first node and a second node and configured to protect the internal circuit from transient ESD events, and where the device wafer is bonded to the carrier wafer.

Abstract: An artificial respiration apparatus for first aid is provided, and relates to the field of medical first-aid supplies. The artificial respiration apparatus comprises an adhesive film, wherein a fixing block is provided on an upper end of the adhesive film; a first adhesive strip is provided on a lower end of the adhesive film; a second adhesive strip is also provided on the lower end of the adhesive film; and a blowing device is inserted in the fixing block. An intraoral ventilation pipe is inserted into the mouth of a person to be rescued, then the adhesive film is applied to the mouth and nose of the person to be rescued, and finally air is blown into a blowing port such that the blown air enters the body of the person to be rescued through a ventilation pipe, and the intraoral ventilation pipe.

Abstract: A semiconductor device includes a substrate. The semiconductor device further includes a doped well in the substrate, wherein the doped well comprises a first concentration of dopants of a first type in the substrate. The semiconductor device further includes a doped region in the substrate, wherein the doped region comprises a second concentration of the dopants of the first type, the doped region extends around the doped well, and the doped region is electrically insulated from the doped well. The semiconductor device further includes an active area, and wherein the active area comprises an emitter region and a collector region, wherein the emitter region is electrically connected to the doped region. The semiconductor device further includes a deep trench isolation (DTI) structure extending through the active area and between the emitter region and the collector region.

Abstract: A catalyst system for olefin polymerization contains a main catalyst and a cocatalyst. The cocatalyst contains a twelve-membered ring compound represented by formula (M). The catalyst system is suitable for preparing polypropylene products having high stereoregularity and low ash, and can regulate the melt index of the products within a wide range by adjusting the amount of hydrogenation. It is also suitable for copolymerization systems to improve the copolymerization yield.

Abstract: A magnesium-based solid, by means of determination based on a nitrogen adsorption method, has a multimodal pore distribution and a specific surface area of not less than 50 m2/g, and the pore size distribution of the solid is in a range of 1 nm to 300 nm. There is at least one peak within a pore size range of less than 10 nm, and there is at least another peak within a pore size range of not less than 10 nm. A catalyst is formed using the solid catalyst component is used for propylene polymerization.

Abstract: An electrostatic discharge (ESD) protection apparatus and method for fabricating the same are disclosed herein. In some embodiments, the ESD protection apparatus comprises: an internal circuit formed in a first wafer; an array of electrostatic discharge (ESD) circuits formed in a second wafer, wherein the ESD circuits include a plurality of ESD protection devices each coupled to a corresponding switch and configured to protect the internal circuit from a transient ESD event; and a switch controller in the second wafer, wherein the switch controller is configured to control, based on a control signal from the first wafer, each of the plurality of ESD protection devices to be activated or deactivated by the corresponding switch, and wherein the first wafer is bonded to the second wafer.

Abstract: A semiconductor device includes a first doped zone and a second doped zone in a first semiconductor material, the first doped zone being separated from the second doped zone; an isolation structure between the first doped zone and the second doped zone; and a first line segment over a top surface of the first doped zone, where the ends of the first line segment and the ends of the second line are over the isolation structure. The first line segment and the second line segment have a first width; and a dielectric material is between the first line segment and the second line segment and over the isolation structure. The first width is substantially similar to a width of a gate electrode in the semiconductor device.

Abstract: The disclosure provides a border touch module, including a cover plate, a shielding layer, a first adhesive layer, a sensing electrode layer, a second adhesive layer, an opaque adhesive, and a backlight layer. The shielding layer is disposed below the cover plate. The first adhesive layer is disposed below the shielding layer. The sensing electrode layer is disposed below the first adhesive layer. The second adhesive layer is disposed below the sensing electrode layer. The opaque adhesive is disposed below the sensing electrode layer. The backlight layer is disposed below the opaque adhesive and is in the same plane as the second adhesive layer. The shielding layer has a backlight pattern, and the opaque adhesive has a light source hole. When the backlight layer is in the state of driving backlight, the light illuminates the backlight pattern of the shielding layer through the light source hole.

Abstract: An antenna element comprises one or more directors, a resonator, and a three dimensional ground assembly. Parts of the antenna element are arranged on three metal layers. A top layer has an unconnected metal bar which forms a beam director, a resonator and a top part of the ground assembly. The resonator is an integral piece substantially in the form of a loop connected to a feed line and a feed line terminal ending. The feed line terminal ending serves as the ground plane for the feed line as well as providing impedance matching from the external transceiver circuit to the resonator. The ground assembly includes a top layer ground connected to a plurality of metallized half cylindrical hole channels (or metallized via holes) which connect to a ground terminal in a bottom layer.

Abstract: An electrostatic discharge (ESD) protection apparatus and method for fabricating the same are disclosed herein. In some embodiments, the ESD protection apparatus comprises: an internal circuit formed in a first wafer; an array of electrostatic discharge (ESD) circuits formed in a second wafer, wherein the ESD circuits include a plurality of ESD protection devices each coupled to a corresponding switch and configured to protect the internal circuit from a transient ESD event; and a switch controller in the second wafer, wherein the switch controller is configured to control, based on a control signal from the first wafer, each of the plurality of ESD protection devices to be activated or deactivated by the corresponding switch, and wherein the first wafer is bonded to the second wafer.

Abstract: An impact-resistant polystyrene resin includes a continuous phase and a plurality of particles dispersed in the continuous phase. The average particle size of the particles is about 0.1 to 4.0 ?m, and the average distance between the particles is about 0.3 to 5.0 ?m. The impact-resistant polystyrene resin is made from a polystyrene composition including a polystyrene plastic, a styrene block copolymer, a processing aid, and an antioxidant.

Abstract: A post cover that is formed from a plurality of separate pieces that are joined together by fastenings to make the cover where each piece is formed with a facing surface, the facing surface has a plurality of outer edges, and one or more peripheral flanges depend from one or more of the outer edges.

Abstract: A paper-based micro-concentrator includes a bearing substrate, a fluid reservoir unit, a filter paper, an external electric field, an ion exchange membrane and a magnet. The fluid reservoir unit includes a first buffer solution tank and a second buffer solution tank, which are interval disposed on the bearing substrate. The filter paper is disposed on the bearing substrate, and two ends of the filter paper are respectively placed in the first buffer solution tank and the second buffer solution tank. The external electric field includes a cathode and an anode, which are respectively placed in the first buffer solution tank and the second buffer solution tank. The ion exchange membrane is disposed on the filter paper and close to the first buffer solution tank. The magnet is movably disposed under the bearing substrate.

Abstract: In some aspects of the present disclosure, an electrostatic discharge (ESD) protection circuit is disclosed. In some aspects, the ESD protection circuit includes a first transistor coupled to a pad, a second transistor coupled between the first transistor and ground, a stack of transistors coupled to the first transistor, and an ESD clamp coupled between the stack of transistors and the ground.

Abstract: The present disclosure relates to the technical field of rapid detection of molecules, and specifically relates to a method for rapid fluorescent immunoassay (FIA) and chemiluminescent immunoassay (CLIA) based on electrokinetic acceleration. The method includes the following steps sequentially: S1. sample acceleration: applying an actuating signal to a chip on which a target molecule is dripped to obtain a chip binding to the target molecule, where the chip includes an electrode sheet and coating molecules is immobilized on the electrode sheet; and S2. secondary antibody acceleration: adding a secondary antibody for binding to the target molecule dropwise on the chip binding to the target molecule, and applying an actuating signal to the chip to obtain a chip binding to the secondary antibody. The method can effectively improve a rate of FIA and CLIA, and can speed up a detection process and meet the need for rapid point-of-care testing (POCT).

Abstract: A display panel and a display apparatus are provided. The display panel includes an array substrate; a color film substrate; support pillars; pixel sub-units; and data lines. The support pillars include a primary support pillar that includes a first support pillar. The pixel sub-units are formed by crossing the scan lines and the data lines. The pixel sub-units each include a thin film transistor and a pixel electrode. The thin film transistor includes a gate, a source and a drain. The scan line is electrically connected to the gate. The data line is electrically connected to the source. The pixel electrode is electrically connected to the drain. The present disclosure can enhance supporting capacity of the display panel.

Abstract: An electrostatic discharge (ESD) protection apparatus and method for fabricating the same are disclosed herein. In some embodiments, the ESD protection apparatus, comprises: a plurality of transistors patterned on a semiconductor substrate during a front-end-of-line (FEOL) process, metal interconnects formed on top of the plurality of transistors during a back-end-of-line (BEOL) process and configured to interconnect the plurality of transistors, and a plurality of passive components formed under the semiconductor substrate in a backside layer during a backside a back-end-of-line (B-BEOL) process, wherein the plurality of passive components are connected to the plurality of transistors through a plurality of vias.

Abstract: An optical modulator includes a semiconductor substrate and an optical waveguide portion disposed on the semiconductor substrate. A signal contact that extends alongside the optical waveguide portion is disposed on the semiconductor substrate. A first ground line is disposed on the semiconductor substrate spaced away from the signal contact by a first spacing. A second ground line is disposed on the semiconductor substrate spaced away from the signal contact by a second spacing opposite the first ground line. The first spacing is different from the second spacing.