Abstract: Integrated circuit devices include data inversion circuits therein that are configured to evaluate at least first and second ordered groups of input data in parallel with an ordered group of output data previously generated by the data inversion circuit. The data inversion circuit is further configured to generate inverted versions of the first and second ordered groups of input data as versions of the first and second ordered groups of data in parallel at outputs thereof whenever a number of bit differences between the first ordered group of input data and the ordered group of output data is greater than one-half a size of the first ordered group of input data and a number of bit differences between the second ordered group of input data and the version of the first ordered group of input data is greater than one-half a size of the second ordered group of input data, respectively.

Abstract: A semiconductor memory device includes a plurality of banks. A data path may be divided into a read data path and a write data path, therefore, parallel processing of write and read commands are possible. The semiconductor memory device may include an address bank buffer, address buffer, column predecoder and/or a decoder. The semiconductor memory device may begin execution of a write command in a bank in one clock cycle and begin execution of a read command in the following clock cycle, therefore, bus efficiency is increased and/or write-to-read turn around time is reduced.

Abstract: Memory bank selection control circuits and methods are provided which improve the data sensing margin for data sense amplifiers in a multi-bank semiconductor memory structure. In one aspect, a bank selection signal control circuit includes a bank switch control unit that receives memory bank selection signals and outputs corresponding memory bank selection control signals to selectively connect memory banks to a global data input/output line according to a predetermined sequence. For memory bank selected prior to a last selected memory bank in the predetermined sequence, the bank switch control unit outputs memory bank selection control signals that are enabled for a first time period P1, and for the last selected memory bank, the bank switch control unit outputs a memory bank selection control signal that is enabled for a second time period P2, wherein P2 is greater than P1.

Abstract: A semiconductor memory system, a memory control circuit and a semiconductor memory device are disclosed. The system includes a memory control circuit for generating a data strobe signal and a data load signal in synchronization with each other. The memory circuit, which can be an SDRAM memory circuit, receives the data strobe signal and the data load signal and writes data in response to the two synchronous signals. Because the signal are synchronous, parameters introduced by timing variations caused by different signal domains are eliminated. As a result, high-frequency operation of the system is greatly improved.

Abstract: Memory bank selection control circuits and methods are provided which improve the data sensing margin for data sense amplifiers in a multi-bank semiconductor memory structure. In one aspect, a bank selection signal control circuit includes a bank switch control unit that receives memory bank selection signals and outputs corresponding memory bank selection control signals to selectively connect memory banks to a global data input/output line according to a predetermined sequence. For memory bank selected prior to a last selected memory bank in the predetermined sequence, the bank switch control unit outputs memory bank selection control signals that are enabled for a first time period P1, and for the last selected memory bank, the bank switch control unit outputs a memory bank selection control signal that is enabled for a second time period P2, wherein P2 is greater than P1.

Abstract: A memory system includes first and second memory devices having commonly connected data terminals and commonly connected memory control signal terminals, e.g., devices in respective first and second independently selectable memory banks that share common data lines and common memory control signal lines, such as column address strobe, row address strobe, write enable, and address signal lines. The first and second memory devices includes respective selective on-die termination (ODT) circuits configured to selectively provide first and second termination impedances at their respective data terminals responsive to a memory control signal at the commonly connected memory control signal terminals. The selective ODT circuits may produce the first termination impedance responsive to a memory write operation, and may produce the second termination impedance responsive to a memory read operation and/or expiration of a predetermined time interval following termination of the memory write operation.

Abstract: Integrated circuit devices include data inversion circuits therein that are configured to evaluate at least first and second ordered groups of input data in parallel with an ordered group of output data previously generated by the data inversion circuit. The data inversion circuit is further configured to generate inverted versions of the first and second ordered groups of input data as versions of the first and second ordered groups of data in parallel at outputs thereof whenever a number of bit differences between the first ordered group of input data and the ordered group of output data is greater than one-half a size of the first ordered group of input data and a number of bit differences between the second ordered group of input data and the version of the first ordered group of input data is greater than one-half a size of the second ordered group of input data, respectively.

Abstract: Integrated circuit devices include data inversion circuits therein that are configured to evaluate at least first and second ordered groups of input data in parallel with an ordered group of output data previously generated by the data inversion circuit. The data inversion circuit is further configured to generate inverted versions of the first and second ordered groups of input data as versions of the first and second ordered groups of data in parallel at outputs thereof whenever a number of bit differences between the first ordered group of input data and the ordered group of output data is greater than one-half a size of the first ordered group of input data and a number of bit differences between the second ordered group of input data and the version of the first ordered group of input data is greater than one-half a size of the second ordered group of input data, respectively.

Abstract: A semiconductor memory device includes a plurality of banks. A data path may be divided into a read data path and a write data path, therefore, parallel processing of write and read commands are possible. The semiconductor memory device may include an address bank buffer, address buffer, column predecoder and/or a decoder. The semiconductor memory device may begin execution of a write command in a bank in one clock cycle and begin execution of a read command in the following clock cycle, therefore, bus efficiency is increased and/or write-to-read turn around time is reduced.

Abstract: A memory system includes first and second memory devices having commonly connected data terminals and commonly connected memory control signal terminals, e.g., devices in respective first and second independently selectable memory banks that share common data lines and common memory control signal lines, such as column address strobe, row address strobe, write enable, and address signal lines. The first and second memory devices includes respective selective on-die termination (ODT) circuits configured to selectively provide first and second termination impedances at their respective data terminals responsive to a memory control signal at the commonly connected memory control signal terminals. The selective ODT circuits may produce the first termination impedance responsive to a memory write operation, and may produce the second termination impedance responsive to a memory read operation and/or expiration of a predetermined time interval following termination of the memory write operation.

Abstract: Integrated circuit devices include data inversion circuits therein that are configured to evaluate at least first and second ordered groups of input data in parallel with an ordered group of output data previously generated by the data inversion circuit. The data inversion circuit is further configured to generate inverted versions of the first and second ordered groups of input data as versions of the first and second ordered groups of data in parallel at outputs thereof whenever a number of bit differences between the first ordered group of input data and the ordered group of output data is greater than one-half a size of the first ordered group of input data and a number of bit differences between the second ordered group of input data and the version of the first ordered group of input data is greater than one-half a size of the second ordered group of input data, respectively.

Abstract: Integrated circuit devices include data inversion circuits therein that are configured to evaluate at least first and second ordered groups of input data in parallel with an ordered group of output data previously generated by the data inversion circuit. The data inversion circuit is further configured to generate inverted versions of the first and second ordered groups of input data whenever a number of bit differences between the first ordered group of input data and the ordered group of output data is greater than one-half a size of the first ordered group of input data and a number of bit differences between the second ordered group of input data and the inverted version of the first ordered group of input data is greater than one-half a size of the second ordered group of input data, respectively.

Abstract: A system and method allows for multiple modes of termination, including termination by a fixed value that is preprogrammed, and by a variable value that can, for example, be measured and determined by a self-calibration circuit. Multiple termination values can be achieved within a single device. This configuration is especially applicable to devices that have different loadings for address and data signals, for example in a configuration having a common, shared address bus, and multiple, localized data buses.

Abstract: Integrated circuit devices include data inversion circuits therein that are configured to evaluate at least first and second ordered groups of input data in parallel with an ordered group of output data previously generated by the data inversion circuit. The data inversion circuit is further configured to generate inverted versions of the first and second ordered groups of input data whenever a number of bit differences between the first ordered group of input data and the ordered group of output data is greater than one-half a size of the first ordered group of input data and a number of bit differences between the second ordered group of input data and the inverted version of the first ordered group of input data is greater than one-half a size of the second ordered group of input data, respectively.

Abstract: A system and method allows for multiple modes of termination, including termination by a fixed value that is preprogrammed, and by a variable value that can, for example, be measured and determined by a self-calibration circuit. Multiple termination values can be achieved within a single device. This configuration is especially applicable to devices that have different loadings for address and data signals, for example in a configuration having a common, shared address bus, and multiple, localized data buses.

Abstract: A semiconductor memory system, a memory control circuit and a semiconductor memory device are disclosed. The system includes a memory control circuit for generating a data strobe signal and a data load signal in synchronization with each other. The memory circuit, which can be an SDRAM memory circuit, receives the data strobe signal and the data load signal and writes data in response to the two synchronous signals. Because the signal are synchronous, parameters introduced by timing variations caused by different signal domains are eliminated. As a result, high-frequency operation of the system is greatly improved.

Abstract: A first clock signal is processed to produce a second clock signal that lags the first clock signal by a first predetermined time and a third clock signal that leads the first clock signal by a second predetermined time. A synchronous read status signal generator circuit receives a read initiation signal indicative of initiation of a read operation and a read termination signal indicative of termination of the read operation. The synchronous read status signal generator circuit produces a transition in a read status signal in response to assertion of either of the read initiation signal or the read termination signal, and latches the read status signal responsive to the second clock signal to generate a synchronized read status signal. A latency signal generator circuit receives the synchronized read status signal and generates a latency control signal therefrom responsive to the third clock signal. Output of data from the memory device is controlled responsive to the latency control signal.

Abstract: A data output circuit and method in a synchronous semiconductor device are described. The semiconductor device is preferably a wave pipelined synchronous semiconductor device. A first-stage or former-stage latch unit receives a first bit of a group of data bits to be output. A second-stage or latter-stage latch unit receives a second bit of the group of data bits. A buffering unit is interposed between the first and second stage latch units. The buffering unit receives the second bit from the second-stage latch unit and forwards the second bit to the first-stage latch unit.

Abstract: A data output circuit and method in a synchronous semiconductor device are described. The semiconductor device is preferably a wave pipelined synchronous semiconductor device. A first-stage or former-stage latch unit receives a first bit of a group of data bits to be output. A second-stage or latter-stage latch unit receives a second bit of the group of data bits. A buffering unit is interposed between the first and second stage latch units. The buffering unit receives the second bit from the second-stage latch unit and forwards the second bit to the first-stage latch unit.

Abstract: In a semiconductor memory device that includes memory cell array banks, memory cell array blocks in each memory cell array bank, partial blocks in each memory cell array block, data input/output line pairs connected to the partial blocks, and a predetermined number of redundant partial blocks connected to a predetermined number of redundant data input/output line pairs, the semiconductor memory device further includes an address setting circuit to set a redundant control signal and a defect address of each of the memory cell array blocks, decoder and shifting control signal generating circuits to generate shifting control signals to control shifting of the data input/output line pairs and the predetermined number of redundant data input/output line pairs by decoding the redundant control signal and the defective address, and switching circuits for routing data through data input/output line pairs adjacent to a corresponding data input/output line pairs in response to each of the shifting control signals.