Patents by Inventor Jin-Seon Park
Jin-Seon Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150195905Abstract: There are provided a package board, a method of manufacturing the same, and a semiconductor package using the same. According to an exemplary embodiment of the present disclosure, the package substrate may include: an insulating layer; a circuit layer formed on and beneath the insulating layer; a capacitor formed in the insulating layer and including an upper electrode, a lower electrode, and a dielectric layer formed between the upper electrode and the lower electrode; and a via connecting the circuit layer to the upper electrode and the lower electrode.Type: ApplicationFiled: August 11, 2014Publication date: July 9, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Myung Sam KANG, Seung Eun LEE, Seung Yeop KOOK, Ki Jung SUNG, Ju Hee PARK, Je Gwang YOO, Jin Seon PARK
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Patent number: 8881382Abstract: Embodiments of the invention provide a method of manufacturing an embedded printed circuit board, which includes the following operations in the order presented: a first operation of forming a first cavity and a third cavity, disposing a first device in the first cavity and disposing a third device in the third cavity; a second operation of forming a second cavity and a fourth cavity, disposing a second device in the second cavity; a third operation of providing an insulating member; a fourth operation of disposing a first base substrate and a second base substrate and pressure laminating the first base substrate, the second base substrate, and the insulating member together; and a fifth operation of forming a first copper clad laminate and forming a second copper clad laminate.Type: GrantFiled: August 19, 2011Date of Patent: November 11, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Sang Chul Lee, Jung Soo Byun, Jin Seon Park, Doo Hwan Lee
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Patent number: 8826527Abstract: Disclosed herein is a printed circuit board, including: a substrate including an insulation layer in which a cavity is formed; an electronic component mounted in the cavity of the substrate and having connection terminals; an insulation material layer formed on one side of the substrate to bury the electronic component; a first circuit layer formed on the other side of the substrate and including a connection pattern connecting with the connection terminals of the electronic component; and a second circuit layer formed on the insulation material layer. The printed circuit board is advantageous in that it can prevent the warpage thereof and ensure the reliability of electrical connection between an electronic component and a circuit layer by adjusting the thickness, thermal expansion coefficient and elastic modulus of insulation layer or the insulating material.Type: GrantFiled: September 14, 2012Date of Patent: September 9, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventor: Jin Seon Park
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Patent number: 8552305Abstract: Disclosed herein is an electronic component-embedded printed circuit board including: a base plate including an insulating resin layer and circuit layers; and an electronic component embedded in the insulating resin layer, wherein the insulating resin layer has a thickness 1.3˜3 times greater than that of the electronic component. The electronic component-embedded printed circuit board has an optimum thickness ratio of its constituents in order to minimize the warpage thereof at the time of manufacturing the same.Type: GrantFiled: June 24, 2009Date of Patent: October 8, 2013Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jin Seon Park, Sung Yi, Jung Won Lee
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Publication number: 20130008024Abstract: Disclosed herein is a printed circuit board, including: a substrate including an insulation layer in which a cavity is formed; an electronic component mounted in the cavity of the substrate and having connection terminals; an insulation material layer formed on one side of the substrate to bury the electronic component; a first circuit layer formed on the other side of the substrate and including a connection pattern connecting with the connection terminals of the electronic component; and a second circuit layer formed on the insulation material layer. The printed circuit board is advantageous in that it can prevent the warpage thereof and ensure the reliability of electrical connection between an electronic component and a circuit layer by adjusting the thickness, thermal expansion coefficient and elastic modulus of insulation layer or the insulating material.Type: ApplicationFiled: September 14, 2012Publication date: January 10, 2013Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Jin Seon PARK
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Patent number: 8339796Abstract: Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided.Type: GrantFiled: December 17, 2010Date of Patent: December 25, 2012Assignee: Samsung Electro-Mechanics, Co., LtdInventors: Sang Chul Lee, Jung Soo Byun, Jin Seon Park, Doo Hwan Lee
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Patent number: 8302270Abstract: A method of manufacturing a capacitor-embedded printed circuit board that includes fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate.Type: GrantFiled: January 10, 2011Date of Patent: November 6, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Woon-Chun Kim, Sung Yi, Hwa-Sun Park, Hong-Won Kim, Dae-Jun Kim, Jin-Seon Park
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Patent number: 8305766Abstract: Disclosed herein is a printed circuit board, including: a substrate including an insulation layer in which a cavity is formed; an electronic component mounted in the cavity of the substrate and having connection terminals; an insulation material layer formed on one side of the substrate to bury the electronic component; a first circuit layer formed on the other side of the substrate and including a connection pattern connecting with the connection terminals of the electronic component; and a second circuit layer formed on the insulation material layer. The printed circuit board is advantageous in that it can prevent the warpage thereof and ensure the reliability of electrical connection between an electronic component and a circuit layer by adjusting the thickness, thermal expansion coefficient and elastic modulus of insulation layer or the insulating material.Type: GrantFiled: July 22, 2010Date of Patent: November 6, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventor: Jin Seon Park
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Publication number: 20120075818Abstract: Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided.Type: ApplicationFiled: December 17, 2010Publication date: March 29, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Chul LEE, Jung Soo BYUN, Jin Seon PARK, Doo Hwan LEE
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Publication number: 20120073747Abstract: Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided.Type: ApplicationFiled: August 19, 2011Publication date: March 29, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Chul LEE, Jung Soo BYUN, Jin Seon PARK, Doo Hwan LEE
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Publication number: 20110259630Abstract: Disclosed herein is a printed circuit board, including: a substrate including an insulation layer in which a cavity is formed; an electronic component mounted in the cavity of the substrate and having connection terminals; an insulation material layer formed on one side of the substrate to bury the electronic component; a first circuit layer formed on the other side of the substrate and including a connection pattern connecting with the connection terminals of the electronic component; and a second circuit layer formed on the insulation material layer. The printed circuit board is advantageous in that it can prevent the warpage thereof and ensure the reliability of electrical connection between an electronic component and a circuit layer by adjusting the thickness, thermal expansion coefficient and elastic modulus of insulation layer or the insulating material.Type: ApplicationFiled: July 22, 2010Publication date: October 27, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Jin Seon PARK
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Publication number: 20110099779Abstract: A method of manufacturing a capacitor-embedded printed circuit board that includes fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate.Type: ApplicationFiled: January 10, 2011Publication date: May 5, 2011Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Woon-Chun Kim, Sung Yi, Hwa-Sun Park, Hong-Won Kim, Dae-Jun Kim, Jin-Seon Park
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Patent number: 7886414Abstract: A method of manufacturing a capacitor-embedded PCB is disclosed. The method may include fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate.Type: GrantFiled: April 22, 2008Date of Patent: February 15, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Woon-Chun Kim, Sung Yi, Hwa-Sun Park, Hong-Won Kim, Dae-Jun Kim, Jin-Seon Park
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Publication number: 20100236821Abstract: Disclosed herein is an electronic component-embedded printed circuit board including: a base plate including an insulating resin layer and circuit layers; and an electronic component embedded in the insulating resin layer, wherein the insulating resin layer has a thickness 1.3˜3 times greater than that of the electronic component. The electronic component-embedded printed circuit board has an optimum thickness ratio of its constituents in order to minimize the warpage thereof at the time of manufacturing the same.Type: ApplicationFiled: June 24, 2009Publication date: September 23, 2010Inventors: Jin Seon Park, Sung Yi, Jung Won Lee
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Publication number: 20090025195Abstract: A method of manufacturing a capacitor-embedded PCB is disclosed. The method may include fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate.Type: ApplicationFiled: April 22, 2008Publication date: January 29, 2009Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Woon-Chun Kim, Sung Yi, Hwa-Sun Park, Hong-Won Kim, Dae-Jun Kim, Jin-Seon Park