Patents by Inventor Jin-Uk Lee

Jin-Uk Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230199951
    Abstract: A printed circuit board includes: a wiring substrate including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers; and a bridge embedded in the wiring substrate and having a plurality of connection pads thereon. An uppermost wiring layer of the plurality of wiring layers includes a plurality of bump pads connected to the plurality of connection pads, and a pitch between at least two adjacent connection pads of the plurality of connection pads is larger than a pitch between at least two adjacent ones of the plurality of bump pads.
    Type: Application
    Filed: May 12, 2022
    Publication date: June 22, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Uk LEE, Chi Won HWANG, Eun Sun KIM
  • Publication number: 20230199955
    Abstract: A printed circuit board includes: an insulating member; a first wiring layer disposed in the insulating member, and including first and second pattern layers spaced apart from each other based on a thickness direction of the printed circuit board; and a second wiring layer disposed in the insulating member, and spaced apart from the first pattern layer over the first pattern layer based on the thickness direction. Based on the thickness direction, an insulation distance between the first pattern layer and the second pattern layer is smaller than an insulation distance between the first pattern layer and the second wiring layer, and each of the first and second pattern layers is thinner than the second wiring layer.
    Type: Application
    Filed: April 4, 2022
    Publication date: June 22, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Uk Lee, Chi Won Hwang, Eun Sun Kim, Yong Wan Ji, Young Hun You
  • Patent number: 11682870
    Abstract: The disclosed invention relates to a method of manufacturing a housing-integrated board mating connector, the method including: preparing a housing of an electrical device, the housing having a housing insertion hole formed therein and a part or the entirety of the housing being made of a conductive metal material; inserting a cylindrical ground gasket into the housing insertion hole; preparing a dielectric part and signal terminal part assembly in which a dielectric part surrounds a signal terminal part; and inserting the dielectric part and signal terminal part assembly into an inner circumferential surface of the ground gasket.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: June 20, 2023
    Assignee: GigaLane Co., Ltd.
    Inventors: Hwa Yoon Song, Sang Min Seo, Eun Jung Kim, Jin Uk Lee, Kyung Hun Jung, Hee seok Jung
  • Publication number: 20230156922
    Abstract: A printed circuit board includes: a first insulating layer including a first cavity and a second cavity; a first electronic component disposed in the first cavity and including a first pad disposed in a first surface direction of the first insulating layer; a second electronic component disposed in the second cavity and including a second pad disposed in a second surface direction, facing the first surface direction, of the first insulating layer; a second insulating layer disposed on each of first and second surfaces of the first insulating layer and in the first cavity to cover the first electronic component; and a third insulating layer disposed on the first surface of the first insulating layer and in the second cavity to cover the second electronic component.
    Type: Application
    Filed: February 16, 2022
    Publication date: May 18, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyun Woo KWON, Ki Ran PARK, Kyeong Yub JUNG, Jin Uk LEE, Jae Heun LEE
  • Publication number: 20230141924
    Abstract: A composition for etching and a method of manufacturing a semiconductor device, the method including an etching process of using the composition for etching, are provided. The composition for etching includes a first inorganic acid; any one first additive selected from the group consisting of phosphorous acid, an organic phosphite, a hypophosphite, and mixtures thereof; and a solvent. The composition for etching is a high-selectivity composition for etching that can selectively remove a nitride film while minimizing the etch rate for an oxide film and does not have a problem such as particle generation, which adversely affects device characteristics.
    Type: Application
    Filed: December 26, 2022
    Publication date: May 11, 2023
    Applicant: SOULBRAIN CO., LTD.
    Inventors: Jung Hun LIM, Jin Uk LEE, Jae Wan PARK
  • Publication number: 20230141270
    Abstract: A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.
    Type: Application
    Filed: March 10, 2022
    Publication date: May 11, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chi Seong Kim, Won Seok Lee, Guh Hwan Lim, Jin Uk Lee, Jin Oh Park
  • Publication number: 20230136538
    Abstract: A composition for etching and a method of manufacturing a semiconductor device, the method including an etching process of using the composition for etching, are provided. The composition for etching includes a first inorganic acid; any one first additive selected from the group consisting of phosphorous acid, an organic phosphite, a hypophosphite, and mixtures thereof, and a solvent. The composition for etching is a high-selectivity composition for etching that can selectively remove a nitride film while minimizing the etch rate for an oxide film and does not have a problem such as particle generation, which adversely affects device characteristics.
    Type: Application
    Filed: December 26, 2022
    Publication date: May 4, 2023
    Applicant: SOULBRAIN CO., LTD.
    Inventors: Jung Hun LIM, Jin Uk LEE, Jae Wan PARK
  • Patent number: 11641715
    Abstract: A printed circuit board includes a first insulating layer; a protective filler layer disposed on one surface of the first insulating layer; a first wiring layer disposed on the one surface of the first insulating layer and having a pad protruding with respect to the protective filler layer; a first via passing through the first insulating layer and contacting the pad; and a second insulating layer disposed on the first wiring layer and the protective filler layer, and having a cavity exposing the pad and at least a portion of the protective filler layer, respectively.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: May 2, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Eun Sun Kim, Jin Uk Lee, Young Hun You, Chi Seong Kim
  • Patent number: 11640798
    Abstract: A display device comprises a display panel including a plurality of sub-pixels defined by a plurality of gate lines and a plurality of data lines; and an auxiliary ground voltage line disposed between two adjacent data lines of the plurality of data lines.
    Type: Grant
    Filed: December 16, 2021
    Date of Patent: May 2, 2023
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Seong-Wook Choi, Jin-Uk Lee
  • Patent number: 11634633
    Abstract: The disclosure is related to a composition for etching, a method for manufacturing the composition, and a method for fabricating a semiconductor using the same. The composition may include a first inorganic acid, at least one of silane inorganic acid salts produced by reaction between a second inorganic acid and a silane compound, and a solvent. The second inorganic acid may be at least one selected from the group consisting of a sulfuric acid, a fuming sulfuric acid, a nitric acid, a phosphoric acid, and a combination thereof.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: April 25, 2023
    Inventors: Jin Uk Lee, Jae Wan Park, Jung Hun Lim
  • Patent number: 11634632
    Abstract: The disclosure is related to a composition for etching, a method for manufacturing the composition, and a method for fabricating a semiconductor using the same. The composition may include a first inorganic acid, at least one of silane inorganic acid salts produced by reaction between a second inorganic acid and a silane compound, and a solvent. The second inorganic acid may be at least one selected from the group consisting of a sulfuric acid, a fuming sulfuric acid, a nitric acid, a phosphoric acid, and a combination thereof.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: April 25, 2023
    Inventors: Jin Uk Lee, Jae Wan Park, Jung Hun Lim
  • Patent number: 11634634
    Abstract: The disclosure is related to a composition for etching, a method for manufacturing the composition, and a method for fabricating a semiconductor using the same. The composition may include a first inorganic acid, at least one of silane inorganic acid salts produced by reaction between a second inorganic acid and a silane compound, and a solvent. The second inorganic acid may be at least one selected from the group consisting of a sulfuric acid, a fuming sulfuric acid, a nitric acid, a phosphoric acid, and a combination thereof.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: April 25, 2023
    Inventors: Jin Uk Lee, Jae Wan Park, Jung Hun Lim
  • Publication number: 20230066381
    Abstract: A printed circuit board includes a first board including a plurality of first insulating layers and a plurality of first wiring layers disposed between the plurality of first insulating layers, respectively; and a second board disposed on one surface of the first board and including a plurality of second insulating layers and a plurality of second wiring layers disposed on or between the plurality of second insulating layers, respectively. At least one of the plurality of first insulating layers has a thickness less than a thickness of at least one of the plurality of second insulating layers. The first board further includes a through-via penetrating each of the plurality of first insulating layers and connected to one of the plurality of second wiring layers.
    Type: Application
    Filed: January 19, 2022
    Publication date: March 2, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Uk LEE, Chi Won HWANG, Eun Sun KIM, Yong Wan JI
  • Publication number: 20230030484
    Abstract: A printed circuit board includes: a first insulating layer having a recess portion in one surface of the first insulating layer; a first circuit pattern embedded in the first insulating layer and being in contact with a lower surface of the recess portion; a second insulating layer disposed on the one surface of the first insulating layer to be disposed in at least a portion of the recess portion; and a via penetrating through at least a portion of the second insulating layer, disposed in the recess portion, and connected to the first circuit pattern.
    Type: Application
    Filed: May 18, 2022
    Publication date: February 2, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Wan Ji, Jin Uk Lee, Eun Sun Kim, Young Hun You
  • Patent number: 11566178
    Abstract: A composition for etching and a method of manufacturing a semiconductor device, the method including an etching process of using the composition for etching, are provided. The composition for etching includes a first inorganic acid; any one first additive selected from the group consisting of phosphorous acid, an organic phosphite, a hypophosphite, and mixtures thereof, and a solvent. The composition for etching is a high-selectivity composition for etching that can selectively remove a nitride film while minimizing the etch rate for an oxide film and does not have a problem such as particle generation, which adversely affects device characteristics.
    Type: Grant
    Filed: November 10, 2020
    Date of Patent: January 31, 2023
    Inventors: Jung Hun Lim, Jin Uk Lee, Jae Wan Park
  • Patent number: 11558959
    Abstract: A printed circuit board includes an insulating layer, a circuit pattern embedded in the insulating layer and including a first metal layer, a second metal layer and a third metal layer disposed between the first metal layer and the second metal layer, and a connection conductor disposed on one surface of the insulating layer and connected to the circuit pattern, wherein the first metal layer is exposed through the one surface of the insulating layer.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: January 17, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Uk Lee, Sangik Cho, Eun Sun Kim, Young Hun You, Jong Eun Park
  • Patent number: 11530355
    Abstract: A composition for etching and a method of manufacturing a semiconductor device, the method including an etching process of using the composition for etching, are provided. The composition for etching includes a first inorganic acid; any one first additive selected from the group consisting of phosphorous acid, an organic phosphite, a hypophosphite, and mixtures thereof; and a solvent. The composition for etching is a high-selectivity composition for etching that can selectively remove a nitride film while minimizing the etch rate for an oxide film and does not have a problem such as particle generation, which adversely affects device characteristics.
    Type: Grant
    Filed: November 10, 2020
    Date of Patent: December 20, 2022
    Inventors: Jung Hun Lim, Jin Uk Lee, Jae Wan Park
  • Publication number: 20220399739
    Abstract: A Depth of Charge (DOC) setting apparatus includes a charging and discharging unit for completely charging a battery to a set target voltage and discharging the completely-charged battery; a profile obtaining unit for obtaining a voltage profile for capacity and voltage of the battery while the battery is charged and discharged and obtaining a differential profile for capacity and differential voltage of the battery from the obtained voltage profile; and a processor for sequentially selecting any one of a plurality of preset voltages and setting the selected preset voltage as the target voltage and for obtaining a feature value for a target peak in each of a plurality of differential profiles and setting a DOC for the battery based on the plurality of obtained feature values.
    Type: Application
    Filed: May 11, 2021
    Publication date: December 15, 2022
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: Sang-Hyun PARK, Jun-Young KWON, Seol YOO, Min-Soo PARK, Jin-Uk LEE
  • Patent number: 11512226
    Abstract: The present invention relates to a composition for etching, comprising a first inorganic acid, a first additive represented by Chemical Formula 1, and a solvent. The composition for etching is a high-selectivity composition that can selectively remove a nitride film while minimizing the etch rate of an oxide film, and which does not have problems such as particle generation, which adversely affect the device characteristics.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: November 29, 2022
    Inventors: Jae-Wan Park, Jung-Hun Lim, Jin-Uk Lee
  • Patent number: 11499073
    Abstract: The present invention relates to a composition for etching, comprising a first inorganic acid, a first additive represented by Chemical Formula 1, and a solvent. The composition for etching is a high-selectivity composition that can selectively remove a nitride film while minimizing the etch rate of an oxide film, and which does not have problems such as particle generation, which adversely affect the device characteristics.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: November 15, 2022
    Inventors: Jae-Wan Park, Jung-Hun Lim, Jin-Uk Lee