Patents by Inventor Jin Woong Lee
Jin Woong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9929314Abstract: Disclosed herein is an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode pad located on the second conductive type semiconductor layer opposite to the first conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.Type: GrantFiled: October 27, 2016Date of Patent: March 27, 2018Assignee: Seoul Viosys Co., Ltd.Inventors: Ye Seul Kim, Kyoung Wan Kim, Yeo Jin Yoon, Sang Hyun Oh, Keum Ju Lee, Jin Woong Lee, Da Yeon Jeong, Sang Won Woo
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Patent number: 9905729Abstract: A light emitting diode is provided to comprises: a substrate that has an elongated rectangular shape in one direction; a light emitting structure positioned on the substrate and having an opening for exposing a first conductive semiconductor layer; a first electrode pad disposed to be closer to a first corner of the substrate; a second electrode pad disposed to be relatively closer to a second corner of the substrate opposing to the first corner; a first extension extending from the first electrode pad; and a second extension and a third extension extending from the second electrode pad to sides of the first extension, wherein an imaginary line connecting an end of the second extension and an end of the third extension is located between the first electrode pad and the first corner.Type: GrantFiled: November 17, 2016Date of Patent: February 27, 2018Assignee: Seoul Viosys Co., Ltd.Inventors: Mae Yi Kim, Jin Woong Lee, Yeo Jin Yoon, Seom Geun Lee, Yong Woo Ryu, Keum Ju Lee
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Publication number: 20170364171Abstract: The present invention relates to a touch panel and, more specifically, to a touch panel comprising: a substrate having an effective region and a non-effective region; a sensing electrode and a touch electrode formed in the effective region on the substrate; a wiring electrode formed in the non-effective region on the substrate and connected to the sensing electrode; a touch wiring electrode formed in the non-effective region on the substrate and connected to the touch electrode; and a coil part formed in the non-effective region on the substrate.Type: ApplicationFiled: February 2, 2016Publication date: December 21, 2017Inventors: Young Sun YOU, Jin Woong LEE, Kwang Yong JIN, Seong Su EOM, Chung Wan LEE, Yong Jae CHOI
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Publication number: 20170351131Abstract: The present invention relates to a touch panel and, more particularly, to a touch panel comprising: a substrate, which is divided into a valid area and an invalid area; sensing electrodes disposed in the valid area, thereby sensing a first input; touch electrodes disposed in the valid area so as not to overlap with the sensing electrode, thereby sensing a second input; first wirings disposed in the invalid area and connected to the sensing electrodes; and second wirings disposed in the invalid area and connected to the touch electrodes, wherein the touch electrodes are mesh form and disposed between the sensing electrodes, and each second wiring surrounds at least one sensing electrode and is electrically connected in a loop form.Type: ApplicationFiled: December 28, 2015Publication date: December 7, 2017Inventors: Seong Su OEM, Young Sun YOU, Jin Woong LEE, Chung Wan LEE, Kwang Yong JIN, Yong Jae CHOI
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Publication number: 20170200857Abstract: A method of fabricating a light emitting diode (LED) includes: sequentially stacking a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer on a substrate; and separating the substrate into unit chips, and at the same time, forming a concavo-convex structure having the shape of irregular vertical lines in a side surface of the unit chip.Type: ApplicationFiled: March 24, 2017Publication date: July 13, 2017Inventors: Kyung Wan KIM, Tae Kyoon KIM, Yeo Jin YOON, Ye Seul KIM, Sang Hyun OH, Jin Woong LEE, In Soo KIM
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Patent number: 9638297Abstract: A rack bar supporting device is a device for supporting a rack bar of a steering apparatus of a vehicle toward a pinion shaft and includes a rack bearing and a biasing assembly. The biasing assembly includes an adjustment plug, an adjustment assembly and a support plate assembly. The adjustment assembly includes an adjustment member and a first biasing member. The support plate assembly includes a first support plate, a second support plate, a second biasing member which provides a force for pushing the first support plate along the biasing axis against the second support plate, and a connection structure which connects the first and the second support plates together so as to restrict movement of the second plate in a direction away from the rack bearing.Type: GrantFiled: March 4, 2013Date of Patent: May 2, 2017Assignee: ERAE AUTOMOTIVE SYSTEMS CO., LTD.Inventors: Chang-Wook Son, Seong-Hun Bae, Min-Young Choi, Jin-Woong Lee, Je-Won Kim
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Patent number: 9608165Abstract: A method of fabricating a light emitting diode (LED) includes: sequentially stacking a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer on a substrate; and separating the substrate into unit chips, and at the same time, forming a concavo-convex structure having the shape of irregular vertical lines in a side surface of the unit chip.Type: GrantFiled: July 9, 2015Date of Patent: March 28, 2017Assignee: Seoul Viosys Co., Ltd.Inventors: Kyung Wan Kim, Tae Kyoon Kim, Yeo Jin Yoon, Ye Seul Kim, Sang Hyun Oh, Jin Woong Lee, In Soo Kim
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Publication number: 20170077355Abstract: According to the present invention, a light-emitting diode with improved light extraction efficiency comprises: a semiconductor laminated structure including an N-layer, a light-emitting layer, and a P-layer formed on a substrate; an N-type electrode formed on the N-layer; and a P-type electrode formed on the P-layer, wherein the N-type electrode and the P-type electrode include a pad electrode and a dispersion electrode, and the N-type electrode and/or the P-type electrode includes a reflective electrode layer for reflecting light onto the dispersion electrode. Thus, the light-emitting diode has a reflective electrode layer on the electrode so as to improve light extraction efficiency. Further, a reflective layer is patterned beneath a pad unit, thus forming roughness and improving adhesion.Type: ApplicationFiled: July 25, 2016Publication date: March 16, 2017Inventors: Jin Woong Lee, Kyoung Wan Kim, Yeo Jin Yoon, Ye Seul Kim
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Publication number: 20170069789Abstract: A light emitting diode is provided to comprises: a substrate that has an elongated rectangular shape in one direction; a light emitting structure positioned on the substrate and having an opening for exposing a first conductive semiconductor layer; a first electrode pad disposed to be closer to a first corner of the substrate; a second electrode pad disposed to be relatively closer to a second corner of the substrate opposing to the first corner; a first extension extending from the first electrode pad; and a second extension and a third extension extending from the second electrode pad to sides of the first extension, wherein an imaginary line connecting an end of the second extension and an end of the third extension is located between the first electrode pad and the first corner.Type: ApplicationFiled: November 17, 2016Publication date: March 9, 2017Inventors: Mae Yi Kim, Jin Woong Lee, Yeo Jin Yoon, Seom Geun Lee, Yong Woo Ryu, Keum Ju Lee
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Publication number: 20170047483Abstract: Disclosed herein is an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode pad located on the second conductive type semiconductor layer opposite to the first conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.Type: ApplicationFiled: October 27, 2016Publication date: February 16, 2017Inventors: Ye Seul Kim, Kyoung Wan Kim, Yeo Jin Yoon, Sang Hyun Oh, Keum Ju Lee, Jin Woong Lee, Da Yeon Jeong, Sang Won Woo
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Publication number: 20160380157Abstract: A light-emitting diode (LED) includes a light-emitting structure arranged on a first surface of a substrate, the light-emitting structure including a first conductivity-type semiconductor layer; a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer. The LED includes a first distributed Bragg reflector arranged on a second surface of the substrate opposite to the first surface, the first distributed Bragg reflector including a first laminate structure including alternately stacked SiO2 and Nb2O5 layers. The first laminate structure of the first distributed Bragg reflector is configured to reflect at least 90% of a first wavelength range of blue light emitted from the light emitting structure.Type: ApplicationFiled: September 12, 2016Publication date: December 29, 2016Inventors: Duk Il SUH, Jae Moo Kim, Kyoung Wan Kim, Yeo Jin Yoon, Ye Seul Kim, Sang Hyun Oh, Jin Woong Lee
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Patent number: 9520536Abstract: Disclosed herein is an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode pad located on the second conductive type semiconductor layer opposite to the first conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.Type: GrantFiled: December 30, 2015Date of Patent: December 13, 2016Assignee: SEOUL VIOSYS CO., LTD.Inventors: Ye Seul Kim, Kyoung Wan Kim, Yeo Jin Yoon, Sang Hyun Oh, Keum Ju Lee, Jin Woong Lee, Da Yeon Jeong, Sang Won Woo
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Publication number: 20160253589Abstract: A system for developing a composition for powder molding which, after a viscosity of the composition for powder molding and a degreasing process, extracts optimal compositional information of the composition in terms of the ratios of the residual binder materials is disclosed. Such a system includes a searching logic unit configured, after generating a plurality of candidate compositional information, to extract the optimal compositional information therefrom and a synthesis/analysis module configured to synthesize and analyze compositions corresponding to the plurality of candidate compositional information and provide to the searching logic unit measurement information on the viscosities of the compositions corresponding to each of the plurality of candidate compositional information and ratios of residual binder materials after a degreasing process.Type: ApplicationFiled: February 19, 2016Publication date: September 1, 2016Inventors: Ji Sik KIM, Kee Sun SOHN, Jin Woong LEE
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Patent number: 9401456Abstract: According to the present invention, a light-emitting diode with improved light extraction efficiency comprises: a semiconductor laminated structure including an N-layer, a light-emitting layer, and a P-layer formed on a substrate; an N-type electrode formed on the N-layer; and a P-type electrode formed on the P-layer, wherein the N-type electrode and the P-type electrode include a pad electrode and a dispersion electrode, and the N-type electrode and/or the P-type electrode includes a reflective electrode layer for reflecting light onto the dispersion electrode. Thus, the light-emitting diode has a reflective electrode layer on the electrode so as to improve light extraction efficiency. Further, a reflective layer is patterned beneath a pad unit, thus forming roughness and improving adhesion.Type: GrantFiled: June 15, 2015Date of Patent: July 26, 2016Assignee: SEOUL VIOSYS CO., LTD.Inventors: Jin Woong Lee, Kyoung Wan Kim, Yeo Jin Yoon, Ye Seul Kim
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Patent number: 9397264Abstract: Disclosed herein in an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer, a first electrode pad located on the second conductive type semiconductor layer opposite to the second conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.Type: GrantFiled: February 24, 2015Date of Patent: July 19, 2016Assignee: SEOUL VIOSYS CO., LTD.Inventors: Ye Seul Kim, Kyoung Wan Kim, Yeo Jin Yoon, Sang Hyun Oh, Keum Ju Lee, Jin Woong Lee, Da Yeon Jeong, Sang Won Woo
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Publication number: 20160118564Abstract: Disclosed herein is an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode pad located on the second conductive type semiconductor layer opposite to the first conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.Type: ApplicationFiled: December 30, 2015Publication date: April 28, 2016Inventors: Ye Seul Kim, Kyoung Wan Kim, Yeo Jin Yoon, Sang Hyun Oh, Keum Ju Lee, Jin Woong Lee, Da Yeon Jeong, Sang Won Woo
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Patent number: 9321477Abstract: A rack bar support device supports a rack bar of a steering device of a vehicle toward a pinion shaft, and includes a rack bearing which is disposed opposite the pinion to contact the rack bar and a biasing assembly providing a force of pushing the rack bearing along a biasing axis toward the rack bar to urge the rack bearing to push the rack bar is engaged with the pinion shaft. The biasing assembly includes an adjustment plug, an adjustment assembly and a support plate assembly. The support plate assembly includes a support plate which is movably disposed between the adjustment member and the rack bearing in a state of being supported by the adjustment member, and a gap is formed between the support plate and the rack bearing.Type: GrantFiled: September 6, 2012Date of Patent: April 26, 2016Assignee: ERAE AUTOMOTIVE SYSTEMS CO., LTD.Inventors: Seong-Hun Bae, Chang-Wook Son, Chung-Shin Lee, Jin-Woong Lee, Je-Won Kim
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Patent number: 9202984Abstract: A light-emitting diode (LED) including a semiconductor stack structure including a first semiconductor layer, an active layer, and a second semiconductor layer, the semiconductor stack disposed on a substrate, a conductive substrate disposed on the semiconductor stack structure, and an electrode disposed on the conductive substrate and in ohmic contact with the conductive substrate, wherein the electrode comprises grooves penetrating the electrode and a portion of the conductive substrate.Type: GrantFiled: May 26, 2015Date of Patent: December 1, 2015Assignee: Seoul Viosys Co., Ltd.Inventors: Jin Woong Lee, Kyoung Wan Kim, Yeo Jin Yoon, Ye Seul Kim, Tae Kyoon Kim
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Publication number: 20150311390Abstract: A method of fabricating a light emitting diode (LED) includes: sequentially stacking a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer on a substrate; and separating the substrate into unit chips, and at the same time, forming a concavo-convex structure having the shape of irregular vertical lines in a side surface of the unit chip.Type: ApplicationFiled: July 9, 2015Publication date: October 29, 2015Inventors: Kyung Wan KIM, Tae Kyoon KIM, Yeo Jin YOON, Ye Seul KIM, Sang Hyun OH, Jin Woong LEE, In Soo KIM
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Publication number: 20150280074Abstract: According to the present invention, a light-emitting diode with improved light extraction efficiency comprises: a semiconductor laminated structure including an N-layer, a light-emitting layer, and a P-layer formed on a substrate; an N-type electrode formed on the N-layer; and a P-type electrode formed on the P-layer, wherein the N-type electrode and the P-type electrode include a pad electrode and a dispersion electrode, and the N-type electrode and/or the P-type electrode includes a reflective electrode layer for reflecting light onto the dispersion electrode. Thus, the light-emitting diode has a reflective electrode layer on the electrode so as to improve light extraction efficiency. Further, a reflective layer is patterned beneath a pad unit, thus forming roughness and improving adhesion.Type: ApplicationFiled: June 15, 2015Publication date: October 1, 2015Inventors: Jin Woong Lee, Kyoung Wan Kim, Yeo Jin Yoon, Ye Seul Kim