Patents by Inventor Joel M. Huston
Joel M. Huston has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150059981Abstract: Methods and apparatus for processing substrates are provided herein. In some embodiments, an apparatus for processing substrates includes a chamber body enclosing a processing volume, the chamber body comprising a chamber floor, a chamber wall coupled to the chamber floor, and a chamber lid removably coupled to the chamber wall, wherein at least one of the chamber floor, the chamber wall, and the chamber lid comprise passages for a flow of a thermal control media; a heater plate disposed adjacent to and spaced apart from the chamber floor; a sleeve disposed adjacent to and spaced apart from the chamber wall, the sleeve supported by the heater plate; and a first sealing element disposed at a first interface between the chamber wall and the chamber lid.Type: ApplicationFiled: July 16, 2014Publication date: March 5, 2015Inventors: JOEL M. HUSTON, OLKAN CUVALCI, MICHAEL P. KARAZIM, JOSEPH YUDOVSKY
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Patent number: 8846163Abstract: A method for removing native oxides from a substrate surface is provided. In one embodiment, the method comprises positioning a substrate having an oxide layer into a processing chamber, exposing the substrate to a gas mixture while forming a volatile film on the substrate and maintaining the substrate at a temperature below 65° C., heating the substrate to a temperature of at least about 75° C. to sublimate the volatile film and remove the oxide layer, and depositing a first layer on the substrate after heating the substrate.Type: GrantFiled: June 5, 2012Date of Patent: September 30, 2014Assignee: Applied Materials, Inc.Inventors: Chien-Teh Kao, Jing-Pei (Connie) Chou, Chiukin (Steven) Lai, Sal Umotoy, Joel M. Huston, Son Trinh, Mei Chang, Xiaoxiong (John) Yuan, Yu Chang, Xinliang Lu, Wei W. Wang, See-Eng Phan
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Publication number: 20140252015Abstract: Lid assemblies for processing chamber and processing chambers including the lid assemblies are described. The lid assemblies include a high temperature lid module and a housing. The high temperature lid module being positioned adjacent a process liner of a processing chamber. The flexible housing positioned around the high temperature lid module and joined to the high temperature lid module with an elastomeric ring.Type: ApplicationFiled: March 11, 2014Publication date: September 11, 2014Inventors: Ilker Durukan, Joel M. Huston, Dien-Yeh Wu, Chien-Teh Kao, Mei Chang
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Publication number: 20140217665Abstract: Embodiments of substrate supports are provided herein. In some embodiments, a substrate support may include a support plate having a support surface a support plate having a support surface to support a substrate, a support ring to support a substrate at a perimeter of the support surface; and a plurality of first support elements disposed in the support ring, wherein an end portion of each of the first support elements is raised above an upper surface of the support ring to define a gap between the upper surface of the support ring and an imaginary plane disposed on the end portions of plurality of first support elements.Type: ApplicationFiled: February 1, 2013Publication date: August 7, 2014Applicant: APPLIED MATERIALS, INC.Inventors: OLKAN CUVALCI, JOEL M. HUSTON, GWO-CHUAN TZU
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Publication number: 20140174362Abstract: Provided are apparatus and methods for depositing materials by vapor deposition and plasma enhanced vapor deposition techniques, and more particularly a gas distribution assembly and vapor deposition chamber to deposit a material. The gas distribution assembly comprises a plurality of sections with each section containing a flow channel with passages extending from the flow channel to the processing region of a processing chamber.Type: ApplicationFiled: December 19, 2013Publication date: June 26, 2014Inventors: Chien-Teh Kao, Mei Chang, Hyman Lam, Joel M. Huston, Xiaoxiong Yuan, Olkan Cuvalci
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Publication number: 20140137961Abstract: In some embodiments, a modular chemical delivery system may include a plurality of gas delivery units directly and removably coupled to each other, wherein each gas delivery unit includes a body with a first volume, a plurality of gas sticks disposed in the first volume, wherein each of the plurality of gas sticks is configured to be coupled to at least one gas supply through one or more inlets in the body, a plurality of valves disposed in the first volume, each valve respectively disposed in line with a corresponding one of the at least one gas supply, at least one outlet conduit to deliver at least one process gas to one or more gas delivery zones in a process chamber, and an electrical controller disposed in the first volume and configured to control the plurality of gas sticks and the plurality of valves.Type: ApplicationFiled: October 21, 2013Publication date: May 22, 2014Applicant: APPLIED MATERIALS, INC.Inventors: CHIEN-TEH KAO, MEI CHANG, HYMAN W. H. LAM, YU CHANG, JOEL M. HUSTON, OLKAN CUVALCI
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Publication number: 20140076234Abstract: A multi-chamber processing system includes a transfer chamber, a first processing chamber outfitted to perform CVD, a second processing chamber, and a robot positioned to transfer substrates between the transfer chamber, the first processing chamber, and the second processing chamber. The second processing chamber may include one or a combination of a first electrode and a second electrode comprising a plasma cavity formed therein.Type: ApplicationFiled: October 18, 2013Publication date: March 20, 2014Applicant: APPLIED MATERIALS, INC.Inventors: Chien-Teh KAO, Jing-Pei Connie CHOU, Chiukin (Steven) LAI, Salvador P. UMOTOY, Joel M. HUSTON, Son TRINH, Mei CHANG, Xiaoxiong YUAN, Yu CHANG, Xinliang LU, Wei W. WANG, See-Eng PHAN
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Patent number: 8343307Abstract: A method and apparatus for removing native oxides from a substrate surface is provided. In one embodiment, the apparatus for removing native oxides from a substrate surface includes a showerhead assembly. One embodiment of a showerhead assembly includes a hollow cylinder, a disc and an annular mounting flange. The hollow cylinder has a top wall, a bottom wall, an inner diameter wall and an outer diameter wall. The disc has a top surface and a lower surface. The top surface is coupled to the inner diameter wall. The lower surface is coupled to the bottom wall. The disc has a plurality of apertures connecting the lower surface to the top surface. The annular mounting flange extends from the outer diameter wall of the hollow cylinder. The mounting flange has an upper surface and a lower surface. The upper surface is coplanar with the top wall of the hollow cylinder. The lower surface having an elevation above the top surface of the disc.Type: GrantFiled: October 23, 2008Date of Patent: January 1, 2013Assignee: Applied Materials, Inc.Inventor: Joel M. Huston
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Publication number: 20120267346Abstract: A method and apparatus for removing native oxides from a substrate surface is provided. In one aspect, the apparatus comprises a support assembly. In one embodiment, the support assembly includes a shaft coupled to a disk-shaped body. The disk-shaped body includes an upper surface, a lower surface and a cylindrical outer surface. A flange extends radially outward from the cylindrical outer surface. A fluid channel is formed in the disk-shaped body and is coupled to the heat transfer fluid conduit of the shaft. A plurality of grooves formed in the upper surface are coupled by a hole to the vacuum conduit of the shaft. A gas conduit formed through the disk-shaped body couples the gas conduit of the shaft to the cylindrical outer surface of the disk-shaped body.Type: ApplicationFiled: April 26, 2012Publication date: October 25, 2012Inventors: Chien-Teh Kao, Joel M. Huston, Mei Chang, Xiaoxiong (John) Yuan
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Publication number: 20120244704Abstract: A method for removing native oxides from a substrate surface is provided. In one embodiment, the method comprises positioning a substrate having an oxide layer into a processing chamber, exposing the substrate to a gas mixture while forming a volatile film on the substrate and maintaining the substrate at a temperature below 65° C., heating the substrate to a temperature of at least about 75° C. to sublimate the volatile film and remove the oxide layer, and depositing a first layer on the substrate after heating the substrate.Type: ApplicationFiled: June 5, 2012Publication date: September 27, 2012Inventors: Chien-Teh KAO, Jing-Pei(Connie) CHOU, Chiukin(Steven) LAI, Sal UMOTOY, Joel M. HUSTON, Son TRINH, Mei CHANG, Xiaoxiong (John) YUAN, Yu CHANG, Xinliang LU, Wei W. WANG, See-Eng PHAN
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Publication number: 20110223755Abstract: A method for removing native oxides from a substrate surface is provided. In one embodiment, the method comprises positioning a substrate having an oxide layer into a processing chamber, generating a plasma of a reactive species from a gas mixture within the processing chamber, exposing the substrate to the reactive species while forming a volatile film on the substrate and maintaining the substrate at a temperature below 65° C., heating the substrate to a temperature of at least about 75° C. to vaporize the volatile film and remove the oxide layer, and depositing a first layer on the substrate after heating the substrate.Type: ApplicationFiled: May 20, 2011Publication date: September 15, 2011Inventors: CHIEN-TEH KAO, Jing-Pei(Connie) Chou, Chiukin(Steven) Lai, Sal Umotoy, Joel M. Huston, Son Trinh, Mei Chang, Xiaoxiong (John) Yuan, Yu Chang, Xinliang Lu, Wei W. Wang, See-Eng Phan
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Patent number: 7910853Abstract: A method and apparatus for controlling power output of a capacitatively-coupled plasma are provided. A detector is disposed on the power delivery conduit carrying power to one electrode to detect fluctuations in power output to the electrode. The detector is coupled to a signal generator, which converts the RF input signal to a constant control signal. A controller adjusts power input to the RF generator by comparing the control signal to a reference.Type: GrantFiled: February 28, 2008Date of Patent: March 22, 2011Assignee: Applied Materials, IncInventors: David T. Or, Yu Chang, William Kuang, Joel M. Huston, Chien-Teh Kao, Mei Chang
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Patent number: 7767024Abstract: In one embodiment, a method for removing native oxides from a substrate surface is provided which includes supporting a substrate containing silicon oxide within a processing chamber, generating a plasma of reactive species from a gas mixture within the processing chamber, cooling the substrate to a first temperature of less than about 65° C. within the processing chamber, and directing the reactive species to the cooled substrate to react with the silicon oxide thereon while forming a film on the substrate. The film usually contains ammonium hexafluorosilicate. The method further provides positioning the substrate in close proximity to a gas distribution plate, and heating the substrate to a second temperature of about 100° C. or greater within the processing chamber to sublimate or remove the film. The gas mixture may contain ammonia, nitrogen trifluoride, and a carrier gas.Type: GrantFiled: June 6, 2008Date of Patent: August 3, 2010Assignee: Appplied Materials, Inc.Inventors: Chien-Teh Kao, Jing-Pei (Connie) Chou, Chiukin (Steven) Lai, Sal Umotoy, Joel M. Huston, Son Trinh, Mei Chang, Xiaoxiong (John) Yuan, Yu Chang, Xinliang Lu, Wei W. Wang, See-Eng Phan
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Publication number: 20090218324Abstract: A method and apparatus for controlling power output of a capacitatively-coupled plasma are provided. A detector is disposed on the power delivery conduit carrying power to one electrode to detect fluctuations in power output to the electrode. The detector is coupled to a signal generator, which converts the RF input signal to a constant control signal. A controller adjusts power input to the RF generator by comparing the control signal to a reference.Type: ApplicationFiled: February 28, 2008Publication date: September 3, 2009Inventors: David T. Or, Yu Chang, William Kuang, Joel M. Huston, Chien-Teh Kao, Mei Chang
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Publication number: 20090111280Abstract: A method for removing native oxides from a substrate surface is provided. In one embodiment, the method comprises positioning a substrate having an oxide layer into a processing chamber, generating a plasma of a reactive species from a gas mixture within the processing chamber, exposing the substrate to the reactive species while forming a volatile film on the substrate and maintaining the substrate at a temperature below 65° C., heating the substrate to a temperature of at least about 75° C. to vaporize the volatile film and remove the oxide layer, and depositing a first layer on the substrate after heating the substrate.Type: ApplicationFiled: December 4, 2008Publication date: April 30, 2009Applicant: APPLIED MATERIALS, INC.Inventors: Chien-Teh Kao, Jing-Pei (Connie) Chou, Chiukin (Steven) Lai, Sal Umotoy, Joel M. Huston, Son Trinh, Mei Chang, Xiaoxiong (John) Yuan, Yu Chang, Xinliang Lu, Wei W. Wang, See-Eng Phan
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Patent number: 7520957Abstract: A lid assembly for semiconductor processing is provided. In at least one embodiment, the lid assembly includes a first electrode comprising an expanding section that has a gradually increasing inner diameter. The lid assembly also includes a second electrode disposed opposite the first electrode. A plasma cavity is defined between the inner diameter of the expanding section of the first electrode and a first surface of the second electrode.Type: GrantFiled: May 24, 2005Date of Patent: April 21, 2009Assignee: Applied Materials, Inc.Inventors: Chien-Teh Kao, Jing-Pei (Connie) Chou, Chiukin (Steven) Lai, Sal Umotoy, Joel M. Huston, Son Trinh, Mei Chang, Xiaoxiong (John) Yuan, Yu Chang, Xinliang Lu, Wei W. Wang, See-Eng Phan
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Publication number: 20090095334Abstract: A method and apparatus for removing native oxides from a substrate surface is provided. In one embodiment, the apparatus for removing native oxides from a substrate surface includes a showerhead assembly. One embodiment of a showerhead assembly includes a hollow cylinder, a disc and an annular mounting flange. The hollow cylinder has a top wall, a bottom wall, an inner diameter wall and an outer diameter wall. The disc has a top surface and a lower surface. The top surface is coupled to the inner diameter wall. The lower surface is coupled to the bottom wall. The disc has a plurality of apertures connecting the lower surface to the top surface. The annular mounting flange extends from the outer diameter wall of the hollow cylinder. The mounting flange has an upper surface and a lower surface. The upper surface is coplanar with the top wall of the hollow cylinder. The lower surface having an elevation above the top surface of the disc.Type: ApplicationFiled: October 23, 2008Publication date: April 16, 2009Inventor: Joel M. Huston
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Publication number: 20090095621Abstract: A method and apparatus for removing native oxides from a substrate surface is provided. In one aspect, the apparatus comprises a support assembly. In one embodiment, the support assembly includes a shaft coupled to a disk-shaped body. The shaft has a vacuum conduit, a heat transfer fluid conduit and a gas conduit formed therein. The disk-shaped body includes an upper surface, a lower surface and a cylindrical outer surface. A thermocouple is embedded in the disk-shaped body. A flange extends radially outward from the cylindrical outer surface, wherein the lower surface of the disk-shaped body comprises one side of the flange. A fluid channel is formed in the disk-shaped body proximate the flange and lower surface. The fluid channel is coupled to the heat transfer fluid conduit of the shaft. A plurality of grooves are formed in the upper surface of the disk-shaped body, and are coupled by a hole in the disk-shaped body to the vacuum conduit of the shaft.Type: ApplicationFiled: October 23, 2008Publication date: April 16, 2009Inventors: Chien-Teh Kao, Joel M. Huston, Mei Chang, Xiaoxiong (John) Yuan
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Publication number: 20080268645Abstract: In one embodiment, a method for removing native oxides from a substrate surface is provided which includes supporting a substrate containing silicon oxide within a processing chamber, generating a plasma of reactive species from a gas mixture within the processing chamber, cooling the substrate to a first temperature of less than about 65° C. within the processing chamber, and directing the reactive species to the cooled substrate to react with the silicon oxide thereon while forming a film on the substrate. The film usually contains ammonium hexafluorosilicate. The method further provides positioning the substrate in close proximity to a gas distribution plate, and heating the substrate to a second temperature of about 100° C. or greater within the processing chamber to sublimate or remove the film. The gas mixture may contain ammonia, nitrogen trifluoride, and a carrier gas.Type: ApplicationFiled: June 6, 2008Publication date: October 30, 2008Inventors: CHIEN-TEH KAO, Jing-Pei (Connie) Chou, Chiukin (Steven) Lai, Sal Umotoy, Joel M. Huston, Son Trinh, Mei Chang, Xiaoxiong (John) Yuan, Yu Chang, Xinliang Lu, Wei W. Wang, See-Eng Phan
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Patent number: 7396480Abstract: A method for removing native oxides from a substrate surface is provided. In at least one embodiment, the method includes supporting the substrate surface in a vacuum chamber and generating reactive species from a gas mixture within the chamber. The substrate surface is then cooled within the chamber and the reactive species are directed to the cooled substrate surface to react with the native oxides thereon and form a film on the substrate surface. The substrate surface is then heated within the chamber to vaporize the film.Type: GrantFiled: May 24, 2005Date of Patent: July 8, 2008Assignee: Applied Materials, Inc.Inventors: Chien-Teh Kao, Jing-Pei (Connie) Chou, Chiukin (Steven) Lai, Sal Umotoy, Joel M. Huston, Son Trinh, Mei Chang, Xiaoxiong (John) Yuan, Yu Chang, Xinliang Lu, Wei W. Wang, See-Eng Phan