Abstract: An apparatus for controlling the flow of liquid material from a liquid material source to a process chamber is disclosed. The apparatus comprises an injector/vaporizer disposed proximate to the process chamber. The injector/vaporizer includes one or more piezoelectric grids located proximate to a vaporization chamber. The one or more piezoelectric grids function to control the flow of liquid material into the vaporization chamber. Each piezoelectric grid includes interlocking arrays of stripes attached to a frame.

Abstract: An apparatus for controlling the flow of liquid material from a liquid material source to a process chamber is disclosed. The apparatus comprises an injector/vaporizer disposed proximate to the process chamber. The injector/vaporizer includes one or more piezoelectric grids located proximate to a vaporization chamber. The one or more piezoelectric grids function to control the flow of liquid material into the vaporization chamber. Each piezoelectric grid includes interlocking arrays of stripes attached to a frame.

Abstract: Generally, a substrate processing apparatus is provided. In one aspect of the invention, a substrate processing apparatus is provided. In one embodiment, the substrate processing apparatus includes one or more chamber bodies coupled to a gas distribution system. The chamber bodies define at least a first processing region and a second processing region within the chamber bodies. The gas distribution system includes a first, a second and a third gas supply circuit. The first gas supply circuit is teed between the first and second processing regions and is adapted to supply a first processing gas thereto. The second gas supply circuit is coupled to the first processing region and adapted to supply a second process gas thereto. The third gas supply circuit is coupled to the second processing region and is adapted to supply a third process gas thereto. Alternatively, the processing regions may be disposed in a single chamber body.

Abstract: The present invention provides for improved liquid vaporizer systems and methods for their use. Vaporizer systems of the present invention are likely to be particularly useful for the vaporization of liquids having a relatively low vapor pressure, such as TDMAT. In one preferred embodiment, a liquid vaporizer system (10) includes a vaporizer unit (16) having first and second inlets (50 and 60) and an outlet (62). The vaporizer system further includes a vessel (22) having an inlet (70) and an outlet (72), whereby the vessel inlet is operably connected to the vaporizer outlet. The vessel contains a plurality of passages (78) which operably connect the vessel inlet and the vessel outlet. In this manner, liquids and/or gases flowing into the vaporizer unit through either or both of its two inlets, exit the vaporizer unit outlet and enter the vessel inlet. Liquids and/or gases pass through the plurality of passages and exit the vessel outlet.

Abstract: The present invention provides for improved liquid vaporizer systems and methods for their use. Vaporizer systems of the present invention are likely to be particularly useful for the vaporization of liquids having a relatively low vapor pressure, such as TDMAT. In one preferred embodiment, a liquid vaporizer system (10) includes a vaporizer unit (16) having first and second inlets (50 and 60) and an outlet (62). The vaporizer system further includes a vessel (22) having an inlet (70) and an outlet (72), whereby the vessel inlet is operably connected to the vaporizer outlet. The vessel contains a plurality of passages (78) which operably connect the vessel inlet and the vessel outlet. In this manner, liquids and/or gases flowing into the vaporizer unit through either or both of its two inlets, exit the vaporizer unit outlet and enter the vessel inlet. Liquids and/or gases pass through the plurality of passages and exit the vessel outlet.

Abstract: The present invention generally provides a gas delivery system adapted for positioning near the process chamber. More particularly, the present invention provides an apparatus for processing a substrate that includes a process chamber and a gas delivery system. The gas delivery system is in fluid communication with and is adapted to supply one or more process gases and/or carrier/purge gases to the process chamber. The gas delivery system is positioned proximal the process chamber within about two to three feet of the process chamber.