Patents by Inventor John E. Rogers

John E. Rogers has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11303039
    Abstract: An electromagnetic radiator with ground plane having discontinuities is disclosed. A disclosed example antenna includes an antenna element, including a first conductive material adjacent to a first dielectric material, to transmit a signal. The disclosed example antenna further includes a microstrip feed network, including a second conductive material adjacent to a second dielectric material, to transmit power to the antenna element, the antenna element proximity coupled to the microstrip feed network. The disclosed example antenna further includes a ground plane, including a third conductive material adjacent to a third dielectric material, to provide a signal return path, the ground plane including gaps regularly spaced in the third conductive material.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: April 12, 2022
    Assignee: The Boeing Company
    Inventor: John E. Rogers
  • Patent number: 11276933
    Abstract: An antenna device includes a conductive patch antenna element and a conductive feed line. The conductive feed line and the conductive patch antenna element are separated by one or more first dielectric layers. The antenna device also includes a ground plane. The ground plane is separated from the conductive feed line by a spacer structure that defines one or more walls of a cavity between the conductive feed line and the ground plane. The spacer structure includes one or more second dielectric layers.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: March 15, 2022
    Assignee: THE BOEING COMPANY
    Inventor: John E. Rogers
  • Publication number: 20220061161
    Abstract: A method of forming an electronics assembly includes providing a substrate, attaching an electronics component to the substrate, disposing one or more dielectric ramps on the substrate along at least a portion of a perimeter of the electronics component, disposing a first ground plane over the substrate and the dielectric ramp(s), disposing a first dielectric over the first ground plane, disposing a stripline over the first dielectric, disposing a second dielectric over the stripline and the first dielectric, and disposing a second ground plane over the second dielectric.
    Type: Application
    Filed: November 5, 2021
    Publication date: February 24, 2022
    Applicant: THE BOEING COMPANY
    Inventor: John E. Rogers
  • Patent number: 11249177
    Abstract: A transceiver assembly is configured to detect an object. The transceiver assembly includes a first transmit antenna array configured to transmit a first signal at a first frequency, a second transmit antenna array configured to transmit a second signal at a second frequency that differs from the first frequency, and a receive antenna array configured to receive a third signal at a third frequency that is a difference between the first frequency and the second frequency. The transceiver assembly detects the object in response to reception of the third signal by the receive antenna array.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: February 15, 2022
    Assignee: THE BOEING COMPANY
    Inventors: John E. Rogers, Robert Alan Smith
  • Patent number: 11251513
    Abstract: A feed line to waveguide lateral transition is described consisting of: a proximity coupled antenna element on the top surface of a composite RF board, an embedded microstrip or stripline feed line, a ground plane on the bottom surface of the RF board, and a waveguide with an aperture enclosing the antenna element with a signal propagation through the waveguide being perpendicular to the antenna element.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: February 15, 2022
    Assignee: THE BOEING COMPANY
    Inventor: John E. Rogers
  • Patent number: 11233310
    Abstract: A low-profile conformal antenna (“LPCA”) is disclosed. The LPCA includes a plurality of dielectric layers forming a dielectric structure. The plurality of dielectric layers includes a top dielectric layer that includes a top surface. The LPCA further includes an inner conductor, a patch antenna element (“PAE”), and an antenna slot. The inner conductor is formed within the dielectric structure, the PAE is formed on the top surface of the top dielectric layer, and the antenna slot is within the PAE. The LPCA is configured to support a transverse electromagnetic (“TEM”) signal within the dielectric structure.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: January 25, 2022
    Assignee: THE BOEING COMPANY
    Inventors: John E. Rogers, John D. Williams
  • Patent number: 11228121
    Abstract: A pressure sensing method includes providing a first receive antenna array that receives a first signal at a first frequency, providing a second receive antenna array that receives a second signal at a second frequency that differs from the first frequency, coupling a diode to the first receive antenna array and the second receive antenna array, coupling a transmit antenna array to the diode, receiving, by the diode, the first signal at the first frequency and the second signal at the second frequency, outputting, by the diode, a third signal at a third frequency that is a difference between the first frequency and the second frequency, receiving, by the transmit antenna array from the diode, the third signal at the third frequency, and outputting, by the transmit antenna array, the third signal at the third frequency.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: January 18, 2022
    Assignee: THE BOEING COMPANY
    Inventor: John E. Rogers
  • Patent number: 11223138
    Abstract: An apparatus may include a substrate assembly having a first side and a second side. The apparatus may further include a waveguide antenna element positioned on the first side of the substrate assembly. The apparatus may also include a first reference ground plane positioned on the first side of the substrate assembly and enclosing the waveguide antenna. The apparatus may include a stripline positioned within the substrate assembly. The apparatus may further include a second reference ground plane positioned on the second side of the substrate assembly.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: January 11, 2022
    Assignee: The Boeing Company
    Inventor: John E. Rogers
  • Patent number: 11216714
    Abstract: A method and apparatus for identifying a location of a radio-frequency identification tag. A hand-held locator device is configured to transmit a first signal and a second signal. A frequency of the first signal changes through a first range of frequencies and is transmitted in a range of directions corresponding to the first range of frequencies. A frequency of the second signal changes through a second range of frequencies and is transmitted in the range of directions corresponding to the second range of frequencies. A difference frequency signal, having a frequency that is a difference between the frequency of the first signal and the frequency of the second signal, is received from the radio-frequency identification tag. The difference frequency signal is processed to determine and display a direction of the radio-frequency identification tag from the locator device.
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: January 4, 2022
    Assignee: The Boeing Company
    Inventors: John E. Rogers, Robert A. Smith
  • Publication number: 20210389200
    Abstract: A pressure sensor includes an input terminal configured to receive an electrical input signal and an output terminal configured to provide an electrical output signal in response to the electrical input signal. The pressure sensor also includes an acousto-mechanical diaphragm and an electrically conductive element formed on the acousto-mechanical diaphragm. The pressure sensor further includes a distributed element filter configured to capacitively couple the input terminal to the output terminal. The distributed element filter is spaced from the electrically conductive element by an air gap. The air gap changes in response to a deflection of the acousto-mechanical diaphragm caused by a change in pressure on the acousto-mechanical diaphragm.
    Type: Application
    Filed: June 15, 2020
    Publication date: December 16, 2021
    Inventor: John E. Rogers
  • Patent number: 11197376
    Abstract: A method of forming an electronics assembly includes providing a substrate, attaching an electronics component to the substrate, disposing one or more dielectric ramps on the substrate along at least a portion of a perimeter of the electronics component, disposing a first ground plane over the substrate and the dielectric ramp(s), disposing a first dielectric over the first ground plane, disposing a stripline over the first dielectric, disposing a second dielectric over the stripline and the first dielectric, and disposing a second ground plane over the second dielectric.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: December 7, 2021
    Assignee: THE BOEING COMPANY
    Inventor: John E. Rogers
  • Publication number: 20210376488
    Abstract: An electromagnetic radiator with ground plane having discontinuities is disclosed. A disclosed example antenna includes an antenna element, including a first conductive material adjacent to a first dielectric material, to transmit a signal. The disclosed example antenna further includes a microstrip feed network, including a second conductive material adjacent to a second dielectric material, to transmit power to the antenna element, the antenna element proximity coupled to the microstrip feed network. The disclosed example antenna further includes a ground plane, including a third conductive material adjacent to a third dielectric material, to provide a signal return path, the ground plane including gaps regularly spaced in the third conductive material.
    Type: Application
    Filed: May 28, 2020
    Publication date: December 2, 2021
    Inventor: John E. Rogers
  • Publication number: 20210356301
    Abstract: A gas sensor for detecting a gas in an environment is disclosed. The gas sensor comprises a housing having a cavity and a vent hole within the housing and a distributed element resonator within the cavity. The cavity includes a bottom surface and a top surface, and the housing is configured to receive the gas from the environment into the cavity through the vent hole. The distributed element resonator has an input terminal configured to receive a radio frequency input signal and an output terminal configured to produce an output signal.
    Type: Application
    Filed: May 14, 2020
    Publication date: November 18, 2021
    Inventor: John E. Rogers
  • Patent number: 11162863
    Abstract: A pressure sensing system and method for an engine of an aircraft include a transceiver assembly coupled to a portion of the engine, and a pressure sensor assembly coupled to a fan blade of the engine. The transceiver assembly is configured to transmit a first signal at a first frequency and a second signal at a second frequency that differs from the first frequency. The pressure sensor assembly is configured to receive the first signal and the second signal and transmit a third signal at a third frequency that is a difference between the first frequency of the first signal and the second frequency of the second signal. The transceiver assembly is configured to receive the third signal at the third frequency. A pressure in relation to the engine is determined based on the third signal.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: November 2, 2021
    Assignee: THE BOEING COMPANY
    Inventors: John E. Rogers, David K. Mefford
  • Publication number: 20210315099
    Abstract: A flexible electronics assembly including a substrate including one or more dielectrics. A cavity is formed within the substrate. A first ground plane is secured to the substrate. One or more stress channels are formed through one or more portions of the substrate and the first ground plane. An electronics component is disposed within the cavity.
    Type: Application
    Filed: April 3, 2020
    Publication date: October 7, 2021
    Applicant: THE BOEING COMPANY
    Inventors: John E. Rogers, John D. Williams
  • Publication number: 20210305704
    Abstract: An apparatus for vialess transitions can include a first dielectric layer. The apparatus can also include a first conductor forming a first coupling element on the top surface of the first dielectric layer. The apparatus can further include a second dielectric layer positioned below the first dielectric layer and above a third dielectric layer, wherein the second dielectric layer is vialess. The apparatus can include a second conductor forming a second coupling element, wherein the second conductor is on the top surface of the third dielectric layer, and a portion of the first coupling element is directly above a portion of the second coupling element.
    Type: Application
    Filed: March 30, 2020
    Publication date: September 30, 2021
    Inventor: John E. Rogers
  • Patent number: 11128059
    Abstract: An antenna assembly and method of forming the same includes a dielectric support base including an antenna element layer having one or more antenna elements, and a cavity layer coupled to the dielectric support base. The cavity layer includes a main body having one or more cavities. The one or more antenna elements are disposed within the one or more cavities.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: September 21, 2021
    Assignee: THE BOEING COMPANY
    Inventor: John E. Rogers
  • Patent number: 11128056
    Abstract: A novel planar antenna array fed by an integrated waveguide and a method for producing same is presented. The antenna array is an aperture coupled array fed by an embedded microstrip line. The embedded microstrip line transitions to a stripline feed then back to a microstrip line such that the lower ground plane of the antenna array becomes the upper ground plane with the waveguide placed on the backside of the array. The microstrip feed then couples to the waveguide for signal transmission and reception. With the exception of the waveguide itself, the elements can be simultaneously fabricated on the same RF board, using subtractive (e.g., milling, etching) and additive (e.g., deposition, 3D printing) methods.
    Type: Grant
    Filed: April 9, 2018
    Date of Patent: September 21, 2021
    Assignee: THE BOEING COMPANY
    Inventor: John E. Rogers
  • Publication number: 20210288408
    Abstract: Aspects of the disclosure are directed to an antenna assembly having a first conductive element having a bowtie shape, the first conductive element on a dielectric material at a first layer; a feed point within the bowtie; a second conductive element as a feed line, at a second layer, wherein the second conductive element is electrically coupled to the first conductive element at least at the feed point, independently of direct electrical contact between the first conductive element and the second conductive element; and a ground plane. In some implementations, the second conductive element has no direct electrical contact with the first conductive element, and electrical coupling of the conductive elements comprises electric fields within the dielectric. This reduces the risk of electrical performance degradation caused by mechanical damage at the feed point, such as when the antenna assembly is installed to conform to a non-planar surface.
    Type: Application
    Filed: March 16, 2020
    Publication date: September 16, 2021
    Inventors: John E. Rogers, Ted R. Dabrowski
  • Patent number: 11114734
    Abstract: An apparatus may include a substrate assembly having a first side and a second side. The apparatus may further include a waveguide antenna element positioned on the first side of the substrate assembly. The apparatus may also include a microstrip line positioned within the substrate assembly, where the waveguide antenna element overlaps the microstrip line. The apparatus may include a first conductive plane positioned on the first side of the substrate assembly. The apparatus may further include a second conductive plane positioned on the second side of the substrate assembly. The first conductive plane and the second conductive plane may define at least a portion of a planar surface integrated waveguide or a planar stripline.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: September 7, 2021
    Assignee: THE BOEING COMPANY
    Inventor: John E. Rogers