Abstract: A waveguide fed planar antenna array with enhanced circular polarization (“WFAECP”) is disclosed. The WFAECP includes a plurality of dielectric layers forming a dielectric structure, an inner conductor formed within the dielectric structure, a first patch antenna element (“PAE”), a second PAE, a bottom and top conductor, a conductive via in signal communication with the bottom and top conductor, a first and second antenna slot within the first PAE and second PAE, and a waveguide. The dielectric layers includes top and bottom dielectric layers, where the top dielectric layer includes a top surface and the bottom dielectric layer includes a bottom surface. The first PAE is formed on the top surface of the top dielectric layer and the second PAE is formed on the bottom surface of the bottom dielectric layer. The waveguide includes a waveguide wall, backend, and cavity. The second PAE is located within the waveguide cavity.

Abstract: A conformal antenna with enhanced circular polarization (“CAECP”) is disclosed. The CAECP includes a plurality of dielectric layers forming a dielectric structure, where a top dielectric layer, of the plurality of dielectric layers, includes a top surface. The CAECP further includes an inner conductor, a coupling element (“CE”), a patch antenna element (“PAE”), a bottom conductor, and an antenna slot. The inner conductor is formed within the dielectric structure, the CE is formed within the dielectric structure above the inner conductor, the PAE is formed on the top surface, and the antenna slot is formed within PAE. The PAE is a conductor and the CAECP is configured to support a transverse electromagnetic (“TEM”) signal within the dielectric structure.

Abstract: An apparatus for measuring pressure is disclosed. The apparatus can be used to measure static pressures or dynamic pressures as would a conventional microphone, but can be integrated with antenna elements, and can be implemented without need for conductive elements in the array itself to provide the sensed pressure signal for processing. Instead, diaphragm movement is remotely and wirelessly sensed and used to determine pressure.

Abstract: A pressure sensing system and method for an engine of an aircraft include a transceiver assembly coupled to a portion of the engine, and a pressure sensor assembly coupled to a fan blade of the engine. The transceiver assembly is configured to transmit a first signal at a first frequency and a second signal at a second frequency that differs from the first frequency. The pressure sensor assembly is configured to receive the first signal and the second signal and transmit a third signal at a third frequency that is a difference between the first frequency of the first signal and the second frequency of the second signal. The transceiver assembly is configured to receive the third signal at the third frequency. A pressure in relation to the engine is determined based on the third signal.

Abstract: An antenna assembly and method of forming the same includes a dielectric support base including an antenna element layer having one or more antenna elements, and a cavity layer coupled to the dielectric support base. The cavity layer includes a main body having one or more cavities. The one or more antenna elements are disposed within the one or more cavities.

Abstract: A transceiver assembly is configured to detect an object. The transceiver assembly includes a first transmit antenna array configured to transmit a first signal at a first frequency, a second transmit antenna array configured to transmit a second signal at a second frequency that differs from the first frequency, and a receive antenna array configured to receive a third signal at a third frequency that is a difference between the first frequency and the second frequency. The transceiver assembly detects the object in response to reception of the third signal by the receive antenna array.

Abstract: A pressure sensor assembly and pressure sensing method include a first receive antenna array configured to receive a first signal at a first frequency, a second receive antenna array configured to receive a second signal at a second frequency that differs from the first frequency, and a diode coupled to the first receive antenna array and the second receive antenna array. The diode is configured to receive the first signal at the first frequency and the second signal at the second frequency and output a third signal at a third frequency that is a difference between the first frequency and the second frequency. A transmit antenna array is coupled to the diode. The transmit antenna array is configured to receive the third signal at the third frequency and output the third signal at the third frequency.

Abstract: A waveguide antenna and a method for producing same is disclosed. In one embodiment, The waveguide-fed surface integrated antenna array comprises an aperture coupled waveguide (WG) antenna element with inclusive slot on a first metal layer, a first ground plane as part of a surface integrated waveguide (SIW) on a first metal layer, an embedded microstrip feed on a second metal layer, a second ground plane as part of a SIW with one or more apertures formed within the ground plane on a third metal layer, and a waveguide enclosing the antenna element on the first metal layer. The SIW is formed on the first and third metal layers of the composite RF board along with one or more shorting conductors electrically shorting the first and second ground planes.

Abstract: A pressure sensing method includes providing a first receive antenna array that receives a first signal at a first frequency, providing a second receive antenna array that receives a second signal at a second frequency that differs from the first frequency, coupling a diode to the first receive antenna array and the second receive antenna array, coupling a transmit antenna array to the diode, receiving, by the diode, the first signal at the first frequency and the second signal at the second frequency, outputting, by the diode, a third signal at a third frequency that is a difference between the first frequency and the second frequency, receiving, by the transmit antenna array from the diode, the third signal at the third frequency, and outputting, by the transmit antenna array, the third signal at the third frequency.

Abstract: An apparatus may include a substrate assembly having a first side and a second side. The apparatus may further include a waveguide antenna element positioned on the first side of the substrate assembly. The apparatus may also include a first reference ground plane positioned on the first side of the substrate assembly and enclosing the waveguide antenna. The apparatus may include a stripline positioned within the substrate assembly. The apparatus may further include a second reference ground plane positioned on the second side of the substrate assembly.

Abstract: An apparatus may include a substrate assembly having a first side and a second side. The apparatus may further include a waveguide antenna element positioned on the first side of the substrate assembly. The apparatus may also include a first reference ground plane positioned on the first side of the substrate assembly. The apparatus may include a microstrip line positioned within the substrate assembly. The apparatus may further include a stripline positioned within the substrate assembly and electrically coupled to the microstrip line, the first reference ground plane overlapping the stripline. The apparatus may also include a second reference ground plane positioned on the second side of the substrate assembly and overlapping both the microstrip line and the stripline. The apparatus may include a stripline antenna element positioned on the second side of the substrate assembly and enclosed by the second reference ground plane.

Abstract: A low-profile apparatus for transitioning circular polarized electromagnetic waves to linear polarized electromagnetic waves when moving in a first direction and transitioning linear polarized electromagnetic waves to circular polarized electromagnetic waves when moving in a second direction. The apparatus includes a substrate with an electrical path positioned within the substrate. A first antenna element attached to the substrate is capacitively coupled to the electrical path and a second antenna element attached to the substrate is capacitively coupled to the electrical path. The apparatus includes a ground plane and electromagnetic waves propagate along the electrical path in a transverse electromagnetic mode. The first antenna element may be positioned within an interior of a first waveguide and the second antenna element may be positioned within an interior of a second waveguide. The first waveguide may have a circular cross-section and the second waveguide may have a rectangular cross-section.

Abstract: A radio frequency (RF) printed circuit board (PCB) including a ground plane, a microstrip transmission line, a patch antenna element, a waveguide, and a dielectric lens. The RF PCB includes a first substrate having a top surface on which the patch antenna element is disposed, the patch antenna element including a slot aperture. The microstrip transmission line is disposed between the first substrate and a second substrate, and is configured to be electromagnetically coupled to the patch antenna element through the slot aperture. The ground plane is disposed on a third substrate and is electromagnetically coupled to the microstrip transmission line. The waveguide includes an aperture attached to the top surface and encloses the patch antenna element. The waveguide is configured to be electromagnetically coupled to the patch antenna element. The dielectric lens is disposed on the patch antenna element and extends into the aperture of the waveguide.

Abstract: An apparatus may include a substrate assembly having a first side and a second side. The apparatus may further include a waveguide antenna element positioned on the first side of the substrate assembly. The apparatus may also include a first reference ground plane positioned on the first side of the substrate assembly. The apparatus may include a microstrip line positioned within the substrate assembly. The apparatus may further include a stripline positioned within the substrate assembly and electrically coupled to the microstrip line, the first reference ground plane overlapping the stripline. The apparatus may also include a second reference ground plane positioned on the second side of the substrate assembly and overlapping both the microstrip line and the stripline. The apparatus may include a stripline antenna element positioned on the second side of the substrate assembly and enclosed by the second reference ground plane.

Abstract: A low-profile apparatus for transitioning circular polarized electromagnetic waves to linear polarized electromagnetic waves when moving in a first direction and transitioning linear polarized electromagnetic waves to circular polarized electromagnetic waves when moving in a second direction. The apparatus includes a substrate with an electrical path positioned within the substrate. A first antenna element attached to the substrate is capacitively coupled to the electrical path and a second antenna element attached to the substrate is capacitively coupled to the electrical path. The apparatus includes a ground plane and electromagnetic waves propagate along the electrical path in a transverse electromagnetic mode. The first antenna element may be positioned within an interior of a first waveguide and the second antenna element may be positioned within an interior of a second waveguide. The first waveguide may have a circular cross-section and the second waveguide may have a rectangular cross-section.

Abstract: A radio frequency (RF) antenna including a patch antenna element, a microstrip transmission line, a ground plane, a waveguide, and a dielectric lens. The patch antenna element is disposed on a top surface of a first substrate of the RF antenna, and includes a slot aperture through which the patch antenna element is configured to be electromagnetically coupled to the microstrip transmission line. The microstrip transmission line is disposed between the first substrate and a second substrate. The ground plane is disposed on a third substrate. The microstrip transmission line is configured to be electromagnetically coupled to the ground plane. The waveguide includes a proximal aperture attached to the top surface and enclosing the patch antenna element. The waveguide includes a distal aperture opposite the proximal aperture, and the waveguide is configured to be electromagnetically coupled to the patch antenna element. The dielectric lens is disposed in the distal aperture.

Abstract: Systems and methods for measuring air gaps between opposing surfaces of two structural components. In one application, such measurements are used to fabricate a shim that fills the air gap between two structural members, such as parts of an aircraft. The resonant inductive coupling-based sensing system has the capability to remotely measure an air gap using an on-board transmit system. Furthermore, the system has the capability to switch between multiple inductor-capacitor sets such as to simultaneously measure air gaps across an area so that a better profile of the air gap can be determined. The resonant inductive coupling-based gap sensor is configured as signal generating and signal sensing electronics printed or mounted on respective flexible substrates to provide a flexible and portable measurement solution.

Abstract: A semiconductor device assembly and method of providing a semiconductor device assembly. The method includes providing a flexible interposer, providing a first redistribution layer on the flexible interposer, and providing a second redistribution layer on a portion of the first redistribution layer. The second redistribution layer is provided by additive manufacturing. The first redistribution layer may be deposited in a clean room environment. The first redistribution layer may be deposited via chemical deposition or physical deposition. A semiconductor device is attached to the first redistribution layer. The flexible interposer may be attached to a board with the semiconductor device being electrically connected to the board via the first redistribution layer, the flexible interposer, and the second redistribution layer. The flexible interposer may be attached to a flexible hybrid electronic (FHE) board.

Abstract: A radio frequency (RF) antenna including a patch antenna element, a microstrip transmission line, a ground plane, a waveguide, and a dielectric lens. The patch antenna element is disposed on a top surface of a first substrate of the RF antenna, and includes a slot aperture through which the patch antenna element is configured to be electromagnetically coupled to the microstrip transmission line. The microstrip transmission line is disposed between the first substrate and a second substrate. The ground plane is disposed on a third substrate. The microstrip transmission line is configured to be electromagnetically coupled to the ground plane. The waveguide includes a proximal aperture attached to the top surface and enclosing the patch antenna element. The waveguide includes a distal aperture opposite the proximal aperture, and the waveguide is configured to be electromagnetically coupled to the patch antenna element. The dielectric lens is disposed in the distal aperture.

Abstract: A radio frequency (RF) printed circuit board (PCB) including a ground plane, a microstrip transmission line, a patch antenna element, a waveguide, and a dielectric lens. The RF PCB includes a first substrate having a top surface on which the patch antenna element is disposed, the patch antenna element including a slot aperture. The microstrip transmission line is disposed between the first substrate and a second substrate, and is configured to be electromagnetically coupled to the patch antenna element through the slot aperture. The ground plane is disposed on a third substrate and is electromagnetically coupled to the microstrip transmission line. The waveguide includes an aperture attached to the top surface and encloses the patch antenna element. The waveguide is configured to be electromagnetically coupled to the patch antenna element. The dielectric lens is disposed on the patch antenna element and extends into the aperture of the waveguide.