Abstract: A stripline conformal patch antenna is disclosed. The antenna comprises circuit board that includes a composite dielectric which has a bottom surface and a top surface. The bottom surface comprises a bottom surface conductive ground plane. The top surface comprises an array of a plurality of conductive antenna elements and a top surface conductive ground plane disposed around the plurality of antenna elements. The stripline conformal antenna also includes a conductor, extending from an antenna input through the composite dielectric, the conductor forming a stripline between the top surface conductive ground plane and the bottom surface conductive ground plane. A plurality of electrical vias extend through the composite dielectric, electrically shorting the bottom surface conductive ground plane and the top surface conductive ground plane.

Abstract: A pressure sensor assembly and pressure sensing method include a first receive antenna array configured to receive a first signal at a first frequency, a second receive antenna array configured to receive a second signal at a second frequency that differs from the first frequency, and a diode coupled to the first receive antenna array and the second receive antenna array. The diode is configured to receive the first signal at the first frequency and the second signal at the second frequency and output a third signal at a third frequency that is a difference between the first frequency and the second frequency. A transmit antenna array is coupled to the diode. The transmit antenna array is configured to receive the third signal at the third frequency and output the third signal at the third frequency.

Abstract: An electrically small low profile antenna is disclosed. The antenna comprises circuit board comprising a composite laminate, formed of a magnetic material and having at least one antenna element disposed on a top surface of the composite laminate, a conductive ground plane disposed on a bottom surface of the composite laminate, and a conductor, extending through the composite laminate between the top surface and the bottom surface of the composite laminate, the conductor forming a microstrip feed extending from an antenna input to the antenna element.

Abstract: A method and apparatus for identifying a location of a radio-frequency identification tag. A hand-held locator device is configured to transmit a first signal and a second signal. A frequency of the first signal changes through a first range of frequencies and is transmitted in a range of directions corresponding to the first range of frequencies. A frequency of the second signal changes through a second range of frequencies and is transmitted in the range of directions corresponding to the second range of frequencies. A difference frequency signal, having a frequency that is a difference between the frequency of the first signal and the frequency of the second signal, is received from the radio-frequency identification tag. The difference frequency signal is processed to determine and display a direction of the radio-frequency identification tag from the locator device.

Abstract: Methods and systems for a steerable antenna array are disclosed. The antenna array includes an array of antenna elements aligned in rows and columns on a substrate. Additionally, the antenna array includes a microstrip feed within the substrate, where the feed is configured to electromagnetically couple to each antenna element of the array of antenna elements. The antenna array further includes a ground plane within the substrate. Additionally, for each antenna element, the antenna array includes a first cavity disposed between the ground plane and feed, and a second cavity disposed on the other side of the ground plane from the first cavity. The antenna array further includes a plurality of fluid lines configured to selectively add or remove fluid from the cavities coupled to the fluid line and cause a deflection of the ground plane in a region of the cavities coupled to the fluid line.

Abstract: An electronically configurable antenna is disclosed. In one embodiment, the antenna comprises a circuit board having a composite dielectric that has a top surface and a bottom surface. An inner antenna element and a coupling element are disposed on the top surface, with the coupling element disposed about a periphery of and substantially coplanar with the antenna element. The coupling element is selectably electrically shorted to the inner antenna element to configure the antenna. The electronically configurable antenna further has a conductor extending through the composite dielectric between the top surface and the bottom surface and a lower electrical ground plane on the bottom surface to minimize any change in the antenna's electrical behavior due to the conductivity of the surfaces to which they are mounted.

Abstract: Systems and methods for a conformal planar dipole antenna is described herein. In one example, the antenna can include a first dipole layer, a second dipole layer, a microstrip layer, and a ground plane. The first dipole layer can include a first antenna element. The second dipole layer can include a second antenna element. The microstrip layer can include a microstrip. The first antenna element, the second antenna element, and the microstrip can be electrically coupled to each other.

Abstract: A semiconductor device assembly and method of providing a semiconductor device assembly. The method includes providing a flexible interposer, providing a first redistribution layer on the flexible interposer, and providing a second redistribution layer on a portion of the first redistribution layer. The second redistribution layer is provided by additive manufacturing. The first redistribution layer may be deposited in a clean room environment. The first redistribution layer may be deposited via chemical deposition or physical deposition. A semiconductor device is attached to the first redistribution layer. The flexible interposer may be attached to a board with the semiconductor device being electrically connected to the board via the first redistribution layer, the flexible interposer, and the second redistribution layer. The flexible interposer may be attached to a flexible hybrid electronic (FHE) board.

Abstract: An antenna device includes a conductive patch antenna element and a conductive feed line. The conductive feed line and the conductive patch antenna element are separated by one or more first dielectric layers. The antenna device also includes a ground plane. The ground plane is separated from the conductive feed line by a spacer structure that defines one or more walls of a cavity between the conductive feed line and the ground plane.

Abstract: An antenna assembly includes a composite substrate. One or more first antenna elements are secured to the composite substrate. A microstrip feed network is secured to the composite substrate. The first antenna elements are electrically coupled to the microstrip feed network. A switch is electrically connected to the microstrip feed network. The switch is configured to selectively control the first antenna element(s). A dielectric lens may be disposed on the composite substrate over the first antenna element(s).

Abstract: A method of forming an electronics assembly includes providing a substrate, attaching an electronics component to the substrate, disposing one or more dielectric ramps on the substrate along at least a portion of a perimeter of the electronics component, disposing a first ground plane over the substrate and the dielectric ramp(s), disposing a first dielectric over the first ground plane, disposing a stripline over the first dielectric, disposing a second dielectric over the stripline and the first dielectric, and disposing a second ground plane over the second dielectric.

Abstract: An apparatus may include a substrate assembly having a first side and a second side. The apparatus may further include a waveguide antenna element positioned on the first side of the substrate assembly. The apparatus may also include a microstrip line positioned within the substrate assembly, where the waveguide antenna element overlaps the microstrip line. The apparatus may include a first conductive plane positioned on the first side of the substrate assembly. The apparatus may further include a second conductive plane positioned on the second side of the substrate assembly. The first conductive plane and the second conductive plane may define at least a portion of a planar surface integrated waveguide or a planar stripline.

Abstract: A broadband conformal antenna (“BCA”) is disclosed. The BCA includes a narrow approximately rectangular outer conductive (“NARO”) housing, a plurality of dielectric layers within the NARO housing forming a laminated dielectric structure, and an inner conductor formed within the laminated dielectric structure. The NARO housing includes a top broad wall and the BCA further includes an antenna slot within the top broad wall. The BCA is configured to support a transverse electromagnetic signal within the NARO housing.

Abstract: An antenna assembly includes a composite substrate. One or more first antenna elements are secured to the composite substrate. A microstrip feed network is secured to the composite substrate. The first antenna elements are electrically coupled to the microstrip feed network. A switch is electrically connected to the microstrip feed network. The switch is configured to selectively control the first antenna element(s). A dielectric lens may be disposed on the composite substrate over the first antenna element(s).

Abstract: An antenna assembly includes a plurality of antenna elements, a microstrip feed network that is configured to supply power to the plurality of antenna elements, and one or more resistors disposed within the microstrip feed network proximate to one or more of the plurality of antenna elements. The resistors are configured to control sidelobes of the antenna assembly.

Abstract: An integrated antenna assembly includes one or more antenna elements, one or more electronics components, and one or both of a static discharge element disposed between the antenna element(s) and the electronics component(s) and/or one or more thermal dissipators.

Abstract: A waveguide antenna and a method for producing same is disclosed. In one embodiment, The waveguide-fed surface integrated antenna array comprises an aperture coupled waveguide (WG) antenna element with inclusive slot on a first metal layer, a first ground plane as part of a surface integrated waveguide (SIW) on a first metal layer, an embedded microstrip feed on a second metal layer, a second ground plane as part of a SIW with one or more apertures formed within the ground plane on a third metal layer, and a waveguide enclosing the antenna element on the first metal layer. The SIW is formed on the first and third metal layers of the composite RF board along with one or more shorting conductors electrically shorting the first and second ground planes.

Abstract: A feed line to waveguide lateral transition is described consisting of: a proximity coupled antenna element on the top surface of a composite RF board, an embedded microstrip or stripline feed line, a ground plane on the bottom surface of the RF board, and a waveguide with an aperture enclosing the antenna element with a signal propagation through the waveguide being perpendicular to the antenna element.

Abstract: A planar antenna with an integrated receiver based on aperture coupled antenna elements with inclusive slots electrically coupled to a microstrip feed network residing above a lower ground plane is disclosed. The use of aperture coupled feed elements eliminate the need for vias, which simplifies fabrication. Further, the antenna has integrated electronics located on the same layer as the microstrip feed network to minimize any noise or unwanted parasitic effects.

Abstract: An aperture coupled microstrip-to-waveguide transition (“ACMWT”) is disclosed that includes a plurality of dielectric layers forming a dielectric structure and an inner conductor formed within the dielectric structure. The plurality of dielectric layers includes a top dielectric layer that has a top surface. The (“ACMWT”) further includes a patch antenna element (“PAE”) formed on the top surface, a bottom conductor, an antenna slot within the PAE, a coupling element (“CE”) formed above the inner conductor and below the PAE, and a waveguide. The waveguide includes at least one waveguide wall and a waveguide backend, where the waveguide backend has a waveguide backend surface that's a portion of the top surface of the top dielectric layer and where the waveguide backend surface and the at least one waveguide wall form a waveguide cavity within the waveguide. The PAE is a conductor located within the waveguide cavity at the waveguide backend surface.