Patents by Inventor Jong-Youn Kim

Jong-Youn Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8912048
    Abstract: A method of fabricating a semiconductor device includes attaching a semiconductor substrate to a carrier using a carrier fixing layer, where the semiconductor substrate including a plurality of semiconductor chips. The method further includes forming gaps between adjacent ones of the chips. The gaps may be formed using one or more chemicals or light which act to remove portions of the semiconductor substrate to expose the carrier fixing layer. Additional portions of the carrier fixing layer are then removed to allow for removal of the chips from the carrier.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: December 16, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong-Youn Kim, Ji-Hwang Kim, Hae-Jung Yu, Cha-Jea Jo
  • Publication number: 20140299980
    Abstract: Semiconductor packages including a heat spreader and methods of forming the same are provided. The semiconductor packages may include a first semiconductor chip, a second semiconductor chip, and a heat spreader stacked sequentially. The semiconductor packages may also include a thermal interface material (TIM) layer surrounding the second semiconductor chip and directly contacting a sidewall of the second semiconductor chip. An upper surface of the TIM layer may directly contact a lower surface of the heat spreader, and a sidewall of the TIM layer may be substantially coplanar with a sidewall of the heat spreader. In some embodiments, a sidewall of the first semiconductor chip may be substantially coplanar with the sidewall of the TIM layer.
    Type: Application
    Filed: January 21, 2014
    Publication date: October 9, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Eun-Kyoung Choi, Jong-Youn Kim, Sang-Wook Park, Hae-Jung Yu, In-Young Lee, Sang-Uk Han, Ji-Seok Hong
  • Publication number: 20140239478
    Abstract: A semiconductor device includes a first semiconductor chip at least partially overlapping a second semiconductor chip. The first semiconductor chip is coupled to a substrate and has a first width, and the second semiconductor chip has a second width. The device also includes a heat sink coupled to the second semiconductor chip and having a third width different from at least one of the first width or the second width. A package molding section at least partially overlaps a first area of the heat sink and does not overlap a second area of the heat sink which includes a top surface of the heat sink.
    Type: Application
    Filed: March 14, 2013
    Publication date: August 28, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji-Seok HONG, Sang-Uk HAN, Eun-Kyoung CHOI, Jong-Youn KIM, Hae-Jung YU, Cha-Jea JO
  • Publication number: 20140213017
    Abstract: A method of fabricating a semiconductor device includes attaching a semiconductor substrate to a carrier using a carrier fixing layer, where the semiconductor substrate including a plurality of semiconductor chips. The method further includes forming gaps between adjacent ones of the chips. The gaps may be formed using one or more chemicals or light which act to remove portions of the semiconductor substrate to expose the carrier fixing layer. Additional portions of the carrier fixing layer are then removed to allow for removal of the chips from the carrier.
    Type: Application
    Filed: March 14, 2013
    Publication date: July 31, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-Youn KIM, Ji-Hwang KIM, Hae-Jung YU, Cha-Jea JO
  • Publication number: 20130344627
    Abstract: A method of fabricating a wafer level package includes preparing a wafer including a plurality of first semiconductor chips, mounting a plurality of second semiconductor chips on the wafer, disposing the wafer on a lower mold and disposing an upper mold so as to surround edges of a top surface of the wafer, dispensing a molding member on the wafer, and pressurizing the molding member by using a plunger so as to fabricate a wafer level package in which a top surface of each of the plurality of second semiconductor chips is exposed.
    Type: Application
    Filed: June 19, 2013
    Publication date: December 26, 2013
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sang-won Kim, Jong-youn Kim, Eun-kyoung Choi, Sang-uk Han, Ji-seok Hong
  • Patent number: 8454103
    Abstract: A refrigerator including left and right doors of rotating opening/closing type and a sliding door between the left and right doors. The left and right rotating opening/closing doors have an improved slim edge structure such that a door thickness is hidden. The sliding door includes door guards to accommodate food.
    Type: Grant
    Filed: August 15, 2011
    Date of Patent: June 4, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong Su Jeon, Sei Ill Jeon, Jong Youn Kim, Jang Won Kim, Tai Kyung Kim, Yoo Jin Jung
  • Publication number: 20120043873
    Abstract: A refrigerator including left and right doors of rotating opening/closing type and a sliding door between the left and right doors. The left and right rotating opening/closing doors have an improved slim edge structure such that a door thickness is hidden. The sliding door includes door guards to accommodate food.
    Type: Application
    Filed: August 15, 2011
    Publication date: February 23, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong Su Jeon, Sei Ill Jeon, Jong Youn Kim, Jang Won Kim, Tai Kyung Kim, Yoo Jin Jung
  • Patent number: 7136366
    Abstract: In the preferred embodiment, the transmission length of the non-full rate frame is shortened frame in order for the mobile terminal 100 to monitor other frequencies with a single receiver. Modulated symbols of non-full rate frame are transmitted with reduced repetition maintaining the sum of repeated symbol energy. Generally, for 1/n (n=2,4,8) length transmission, 1/m (m?n) rate frame repeated m/n times and transmitted with n/m symbol energy of the full rate frame. The system may use rate limitation to generate a non-full rate frame. A position of the transmitted symbols may be randomized by a mobile specific predetermined random code to minimize interference between terminals different from each other. For intensive frequency scanning and synchronization signal transmission, non-transmitting period can be assigned for successive frames of some interval. For 1/n (n=2,4,8) length successive transmission, the starting position of the transmitted symbols are staggered by 1/n frame time in each frame.
    Type: Grant
    Filed: December 18, 2001
    Date of Patent: November 14, 2006
    Assignee: LG Electronics Inc.
    Inventor: Jong-Youn Kim
  • Patent number: 6665281
    Abstract: In the preferred embodiment, the transmission length of the non-full rate frame is shortened frame in order for the mobile terminal to monitor other frequencies with a single receiver. Modulated symbols of non-full rate frame are transmitted with reduced repetition maintaining the sum of repeated symbol energy. Generally, for 1/n (n=2,4,8) length transmission, 1/m (m≧n) rate frame repeated m/n times and transmitted with n/m symbol energy of the full rate frame. The system may use rate limitation to generate a non-full rate frame. A position of the transmitted symbols may be randomized by a mobile specific predetermined random code to minimize interference between terminals different from each other. For intensive frequency scanning and synchronization signal transmission, non-transmitting period can be assigned for successive frames of some interval.
    Type: Grant
    Filed: February 10, 1999
    Date of Patent: December 16, 2003
    Assignee: LG Information & Communications, Ltd.
    Inventor: Jong-Youn Kim
  • Patent number: 6563807
    Abstract: An inter-frequency handoff execution method in a mobile communication system according to the present invention includes the steps of: transmitting from a base station a data frame in which a data transmission section and a frequency search section exist to an arbitrary mobile terminal; executing data transmission in the data transmission section; searching a frequency of other base station in the frequency search section; and determining whether or not handoff is executed in accordance with the searched result.
    Type: Grant
    Filed: December 16, 1998
    Date of Patent: May 13, 2003
    Assignee: LG Information & Communications, Ltd.
    Inventors: Jong Heon Kim, Jong Youn Kim
  • Patent number: 6504816
    Abstract: A baseband signal demodulating apparatus in a mobile radio communication system capable of solving the channel increase problem due to the increase of subscribers by sharing correlators and accumulators used in a base station receiver by a time division multiplexing method. The apparatus includes a plurality of front end rake receivers for demodulating oversampled baseband signals to restore the original signal, buses for sharing demodulated signals from the front end rake receivers by the time division multiplexing method, and a despreding section for despreding the signals from the buses.
    Type: Grant
    Filed: December 18, 1998
    Date of Patent: January 7, 2003
    Assignee: LG Information & Communications, Ltd.
    Inventors: Sang Woo Lee, Jong Youn Kim
  • Publication number: 20020041577
    Abstract: In the preferred embodiment, the transmission length of the non-full rate frame is shortened frame in order for the mobile terminal 100 to monitor other frequencies with a single receiver. Modulated symbols of non-full rate frame are transmitted with reduced repetition maintaining the sum of repeated symbol energy. Generally, for 1/n (n=2,4,8) length transmission, 1/m (m≧n) rate frame repeated m/n times and transmitted with n/m symbol energy of the full rate frame. The system may use rate limitation to generate a non-full rate frame. A position of the transmitted symbols may be randomized by a mobile specific predetermined random code to minimize interference between terminals different from each other. For intensive frequency scanning and synchronization signal transmission, non-transmitting period can be assigned for successive frames of some interval.
    Type: Application
    Filed: December 18, 2001
    Publication date: April 11, 2002
    Applicant: LG Information & Communications, Ltd.
    Inventor: Jong-Youn Kim
  • Patent number: 6351839
    Abstract: An apparatus and method of a state metric memory for a viterbi decoder is disclosed including generating survival path metrics from the current-state metrics and simultaneously storing at least two next-state metrics designated by control signals. The present invention includes a plurality of submemories in a memory unit wherein each submemory stores both the current-state metrics and the next-state metrics.
    Type: Grant
    Filed: December 29, 1998
    Date of Patent: February 26, 2002
    Assignee: LG Information & Communications, Ltd.
    Inventors: Seung Hwan Lee, Jong Youn Kim
  • Patent number: 6339590
    Abstract: In the preferred embodiment, the transmission length of the non-full rate frame is shortened frame in order for the mobile terminal 100 to monitor other frequencies with a single receiver. Modulated symbols of non-full rate frame are transmitted with reduced repetition maintaining the sum of repeated symbol energy. Generally, for 1/n (n=2,4,8) length transmission, 1/m (m≧n) rate frame repeated m/n times and transmitted with n/m symbol energy of the full rate frame. The system may use rate limitation to generate a non-full rate frame. A position of the transmitted symbols may be randomized by a mobile specific predetermined random code to minimize interference between terminals different from each other. For intensive frequency scanning and synchronization signal transmission, non-transmitting period can be assigned for successive frames of some interval.
    Type: Grant
    Filed: February 6, 1998
    Date of Patent: January 15, 2002
    Assignee: LG Information & Communications, Ltd.
    Inventor: Jong-Youn Kim
  • Publication number: 20010046217
    Abstract: In the preferred embodiment, the transmission length of the non-full rate frame is shortened frame in order for the mobile terminal 100 to monitor other frequencies with a single receiver. Modulated symbols of non-full rate frame are transmitted with reduced repetition maintaining the sum of repeated symbol energy. Generally, for 1/n (n=2,4,8) length transmission, 1/m (m≧n) rate frame repeated m/n times and transmitted with n/m symbol energy of the full rate frame. The system may use rate limitation to generate a non-full rate frame. A position of the transmitted symbols may be randomized by a mobile specific predetermined random code to minimize interference between terminals different from each other. For intensive frequency scanning and synchronization signal transmission, non-transmitting period can be assigned for successive frames of some interval.
    Type: Application
    Filed: February 6, 1998
    Publication date: November 29, 2001
    Applicant: LG Information & Communications, Ltd.
    Inventor: JONG-YOUN KIM
  • Patent number: 6148009
    Abstract: A timing signal supplying device in a doubled timing synchronous system includes: a timing signal adjusting portion which feeds back a timing signal of a timing signal receiving circuit and a frequency signal of a transmitting buffer to regenerate a timing signal and compares the timing signal with an external input timing signal to detect and correct an error of the timing signal; and a timing signal transmitting portion which sequentially transmits the corrected signal of the timing signal adjusting portion and the regenerated timing signal to the timing signal receiving circuit.
    Type: Grant
    Filed: November 20, 1997
    Date of Patent: November 14, 2000
    Assignee: LG Information & Communications, Ltd.
    Inventor: Jong-Youn Kim
  • Patent number: D649985
    Type: Grant
    Filed: October 18, 2010
    Date of Patent: December 6, 2011
    Assignee: Samsung Electronics, Co., Ltd.
    Inventors: Sang Woon Jeon, Jong Youn Kim