Abstract: A light source assembly includes a light source which emits light; a detector which detects the light and generates a light signal based on a property of the light; an operator operably connected to the detector and which receives the light signal and calculates a color coordinate of the light source based on the light signal; a comparator operably connected to the operator and which compares the color coordinate of the light source to a predetermined reference color coordinate; and a control unit operably connected to the comparator and which controls a pulse width modulation signal transmitted to the light source based on a result of the comparison of the comparator.

Abstract: A test socket is provided that includes a socket body to receive an object to be tested, a lid disposed on the socket body, one or more pushers coupled to a first surface of lid to apply force to a first surface of the object toward the socket body, and a temperature controlling member to provide a temperature to the object. A semiconductor package may be tested in a test apparatus that includes the test socket, the methods of testing including receiving a semiconductor package in a socket in a test chamber, applying a first temperature to the test chamber to test the semiconductor package at a first test temperature, and applying a second temperature to the semiconductor package to test the semiconductor package at a second test temperature by controlling the application of the second temperature with the socket.

Abstract: A data line layout includes column selection lines arranged in a first direction at a layer on a memory cell array region, and data lines arranged in the first direction at the layer, the data lines being connected between I/O sense amplifiers and I/O pads.

Abstract: A folding type package includes a body including first and second parts to face each other when the body is folded to enclose a product, at least one product housing part formed at the body, and a buffer part extending from the product housing part to secure a buffer space to buffer a shock applied to the product.

Abstract: A method to compress exposure data may include converting image data into a plurality of exposure data, generating new exposure data by combining part of the plurality of exposure data or by excluding part of the plurality of exposure data, and compressing the new exposure data. An exposure apparatus may include a conversion unit that converts image data into a plurality of exposure data, a control unit that generates new exposure data by combining part of the plurality of exposure data or by excluding part of the plurality of exposure data, and a compression unit that compresses the new exposure data.

Abstract: A casing to support a solid state device SSD therein and super capacitors therein to be electronically connected together.

Abstract: A damper including a cylinder, a piston inserted in the cylinder, a movable member disposed in the piston to be movable in the cylinder in a length direction of the cylinder, and a weight sensor mounted on an inner surface of the cylinder, facing an end of the piston, to perceive weight loaded on the piston through contact with the movable member. When applied to a washing machine, the damper is capable of perceiving accurate weight of the laundry supplied in the washing machine.

Abstract: Provided are method and apparatus for encoding and decoding an image by using a bit plane-based image encoding method and a block-based image encoding method respectively on bit planes based on the n-m most significant bits of an input image including n-bit pixel values and an image based on the m least significant bits of the input image.

Abstract: A liquid crystal display includes; first and second substrates facing each other, a liquid crystal layer interposed between the first and second substrates and including liquid crystal molecules, a first subpixel electrode disposed on the first substrate, the first subpixel electrode receiving a first data voltage, a second subpixel electrode disposed on the first substrate, the second subpixel electrode receiving a second data voltage; and a short protrusion disposed on the second substrate and simultaneously facing the first and second subpixel electrodes, wherein the liquid crystal layer is vertically aligned and has positive dielectric anisotropy.

Abstract: Disclosed are a hinge unit which couples a first member and a second member, the hinge unit including: a conic shaft which is coupled to the first member, and comprises a hinge pivot, a conic unit of a truncated cone shape, the radius of which is extended in an end area of the hinge pivot, and a first rocking unit formed to an outer surface of the conic unit; and a conic sleeve which is coupled to the second member, and comprises a sleeve main body formed with a conic accommodating unit having a shape corresponding to the conic unit in an inner part of the conic accommodating unit, and a second rocking unit formed to an inner surface of the conic accommodating unit to be coupled with the first rocking unit.

Abstract: One embodiment exemplarily described herein can be generally characterized as a heat sink for an electronic component. The heat sink may include a main body thermally contactable to an electronic component; at least one fin thermally contacted with the main body; and a confining member. The at least one fin and the confining member may be cooperatively engaged such that the at least one fin is moveable between a first position relative to a longitudinal axis of the main body and a second position relative to the longitudinal axis of the relative to the main body.

Abstract: A semiconductor manufacturing apparatus and a wafer loading/unloading method thereof increase productivity.

Abstract: A fan-out unit which can control a resistance difference among channels with efficient space utilization and a thin-film transistor (TFT) array substrate having the fan-out unit are presented. The fan-out unit includes: an insulating substrate; a first wiring layer which is formed on the insulating substrate and connected to a pad; a second wiring layer which is formed on the insulating substrate and connected to a TFT; and a resistance controller which is connected between the first wiring layer and the second wiring layer and includes a plurality of first resistors extending parallel to the first wiring layer and a plurality of second resistors extending perpendicular to the first resistors and alternately connecting to the first resistors, wherein the first resistors are longer than the second resistors.

Abstract: A reworkable passive element embedded printed circuit board (PCB) including a board member, first and second fillings, and a first passive element. The board member has first and second through holes which are spaced apart from each other. The first and second fillings are buried in the first and second through holes, respectively, and formed of a reflowable conductive material. The first passive element includes first and second electrodes. A first insertion groove is formed in a portion of a surface of the board member between the first and second through holes and portions of the first and second fillings. The first passive element is mounted on the first insertion groove. The first electrode includes a bottom surface and a side contacting the first filling and an exposed upper surface. The second electrode comprises a bottom surface and a side contacting the second filling and an exposed upper surface.

Abstract: Provided are methods of forming a phase change memory device. A semiconductor device having a lower electrode and an interlayer insulating layer may be prepared. The lower electrode may be surrounded by the interlayer insulating layer. Source gases, a reaction gas and a purge gas may be injected into a process chamber of a semiconductor fabrication device to form a phase change material layer on a semiconductor substrate. The source gases may be simultaneously injected into the process chamber. The phase change material layer may be in contact with the lower electrode through the interlayer insulating layer. The phase change material layer may be etched to form a phase change memory cell in the interlayer insulating layer. An upper electrode may be formed on the phase change memory cell.

Abstract: A liquid crystal display and control method thereof, having a liquid crystal display panel, a light emitting diode device which is disposed on the rear of the liquid crystal display panel and which is divided into a plurality of partitioned areas that are capable of being driven independently, a light guide part disposed for each of the partitioned areas, an image calculating part for dividing the liquid crystal display panel into a plurality of regions and calculating the brightness of each region by using image data, and an inverter and an inverter controller to provide differentiated power to the partitioned areas based on the calculated brightness.

Abstract: An injection preform having a pattern on a surface thereof and realizing a transparent pattern paint layer for forming a crack pattern in a transparent or semi-transparent substrate, and a method of manufacturing the same. The injection preform preferably includes: a substrate injection molded so as to be transparent or semi-transparent; a primer layer painted on a rear surface of the substrate; a transparent pattern paint layer painted on a rear surface of the primer layer, a surface of the transparent pattern paint layer being dried with hot air in an oven such that a pattern is formed; a deposition layer deposited on a rear surface of the transparent pattern paint layer; a finishing layer painted on a rear surface of the deposition layer; and a clear coating layer painted on a front surface of the substrate.

Abstract: An outdoor unit for an air conditioner is disclosed. The outdoor unit according to the present invention comprises a housing which has an air inlet and an air outlet, a ventilation fan rotatably mounted in the housing, and a fan guard connected to the housing to cover the air outlet. Here, the fan guard comprises a plurality of closed ribs arranged sequentially and concentrically between a center and an outline thereof, and a plurality of radial ribs arranged in radial directions to interconnect the plurality of closed ribs, in such a manner that some of the closed ribs, which are disposed at intermediate positions near tips of the ventilation fan, are at a further distance from the ventilation fan than the other closed ribs, which are disposed near the center and the outline.

Abstract: A semiconductor memory device includes a sub memory cell array region having memory cells each connected between word lines extending in a first direction and bit lines extending in a second direction that is orthogonal to the first direction of extension of the word lines and a sub word line driver region disposed at a side of the sub memory cell array region in the first direction and including sub word line drivers that activate the word lines. A sensing region is disposed at a side of the sub memory cell array region in the second direction and including an equalizer that precharges the bit line in response to a signal transferred through a drive signal line and at least one first control signal driver that activates an inverted control signal line in response to a signal transferred through a control signal line. A conjunction region disposed at an intersection between the sub word line driver region and the sensing region, in which the inverted control signal line is connected to the drive signal line.

Abstract: A collection unit includes an exhaust conduit providing a path through which a process gas flows, a trap installed in the exhaust conduit, and a collection line connected to the trap. The trap has an inlet through which particles in the process are introduced into the trap, and the collection line penetrates a portion of the exhaust conduit to extend toward an outside region of the exhaust conduit. An apparatus including the collection unit and a method for collecting particles using the same are also provided.