Abstract: A semiconductor memory device is operated by, inter alia, performing least significant bit programs for pages in a first page group, performing least significant bit programs for pages in a second page group, and performing most significant bit programs for the pages in the first page group. The distance between the second page group and the common source line is greater than that between the first page group and the common source line.

Abstract: An operating method of a semiconductor memory device includes performing a first read operation on main cells of a first page with an initial read voltage, performing a second read operation on the main cells of the first page with a read voltage corresponding to a read retry number when the number of error bits generated as results of performing the first read operation exceeds the number of error-correctable bits, and storing the read retry number in spare cells of the first page while the second read operation is performed, and repeatedly performing the second read operation and repeatedly storing the read retry number until the number of error bits generated as results of performing the second read operation becomes the number of error-correctable bits or less.

Abstract: A semiconductor memory device and a method of manufacturing the same are provided. The device includes a semiconductor substrate in which active regions and isolation regions are alternately defined, and a support region is defined in a direction crossing the active regions and the isolation regions, first trenches formed in the isolation regions, second trenches formed under the first trenches in the active regions and the isolation regions; and a support layer formed under the first trenches in the support region.

Abstract: A nonvolatile memory device includes a stacked structure disposed over a substrate and having a plurality of interlayer dielectric layers and conductive layers that are alternately stacked, a plurality of holes formed to pass through the stacked structure to expose the substrate, a first memory layer and a second memory layer formed separately in a circumference of each hole, and a first channel layer and a second channel layer formed respectively on the first and second memory layers.

Abstract: A method of operating a semiconductor memory device includes a memory array having memory cell strings including a first and a second memory cell groups having memory cells, a first and a second dummy elements, a drain select transistor and a source select transistor, wherein the first memory cell group and the second memory cell group are arranged between the drain select transistor and the source select transistor; connecting electrically the first memory cell group to the second memory cell group during a program operation or a read operation of the first memory cell group or the second memory cell group; and performing separately an erase operation of the first memory cell group and an erase operation of the second memory cell group, selecting simultaneously one of the first dummy element and the second dummy element during the erase operation of the selected memory cell group.

Abstract: A three-dimensional (3-D) non-volatile memory device according to embodiment of the present invention includes a plurality of bit lines, at least one string row extending in a first direction coupled to the bit lines and including 2N strings, wherein the N includes a natural number, a common source selection line configured to control source selection transistors of the 2N strings included in a memory block, a first common drain selection line configured to control drain selection transistors of a first string and a 2N-th string among the 2N strings included in a memory block, and N?1 second common drain selection lines configured to control drain selection transistors of adjacent strings in the first direction among remaining strings other than the first string and the 2N-th string.

Abstract: A three-dimensional (3-D) non-volatile memory device according to an embodiment of the present invention includes a plurality of vertical channel layers protruding from a substrate, a plurality of interlayer insulating layers and a plurality of memory cells stacked alternately along the plurality of vertical channel layers, and an air gap formed in the plurality of interlayer insulating layers disposed between the plurality of memory cells, so that capacitance between word lines is reduced to thus improve a program speed.

Abstract: A semiconductor device includes isolation layers formed at isolation regions of a semiconductor substrate, silicon patterns formed over the semiconductor substrate between the isolation layers, insulating layers formed between the silicon patterns and the semiconductor substrate, and junctions formed in the semiconductor substrate between the silicon patterns, wherein each of the silicon patterns has a sloped top surface.

Abstract: A semiconductor device includes a plurality of first trenches having a first depth formed in a semiconductor substrate, a plurality of second trenches having a second depth formed in the semiconductor substrate, wherein the second depth is different from the first depth and the second trenches are formed between the first trenches, a plurality of isolation layers formed at the plurality of first trenches and the plurality of second trenches, wherein the isolation layers have upper portions formed above the semiconductor substrate, and a plurality of memory cells formed over the semiconductor substrate between the isolation layers.

Abstract: A semiconductor device includes a semiconductor substrate divided into a cell region and a peripheral circuit region defined in a first direction, wherein the peripheral circuit region is divided into a first region and a second region defined in a second direction substantially orthogonal to the first direction; gate lines formed over the semiconductor substrate in the cell region and arranged in the second direction; and a capacitor including lower electrodes over the semiconductor substrate, a dielectric layer and an upper electrode, wherein the lower electrodes in the first and second regions, separated from each other in the first direction and coupled to each other in the first region, the dielectric layer is formed along surfaces of the lower electrodes in the second region, and the upper electrode is formed over the dielectric layer.

Abstract: A non-volatile memory device includes a plurality of gate electrodes stacked over a semiconductor substrate and stretched in a first direction along the semiconductor substrate and a plurality of junction layers having a first region protruding from the semiconductor substrate and crossing the gate electrodes and a second region formed between the gate electrodes.

Abstract: The semiconductor device includes a semiconductor substrate having a cell region and a peripheral circuit region defined therein, semiconductor memory elements formed over the semiconductor substrate in the cell region, an interlayer insulating layer formed over the semiconductor substrate in the peripheral circuit region, first conductive layers substantially vertically passing through the interlayer insulating layer, and arranged in a matrix, and second conductive layers coupling the first conductive layers in rows or columns, each pair of the second conductive layers and the first conductive layers coupled to the each pair of the second conductive layers, respectively, forming electrodes of a capacitor.

Abstract: A nonvolatile memory device and a method of programming the device includes storing first data in first main and sub-registers and storing second data in second main and sub-registers, performing first program and verification operations on first memory cells based on the first data stored in the first main register, storing a result of the first verification operation in the first main register, performing a second program operation on second memory cells based on the second data stored in the second main register, changing the result of the first verification operation, stored in the first main register, into the first data stored in the first sub-register, performing an additional verification operation on the first memory cells on which the first verification operation has been completed, storing a result of the additional verification operation in the first main register, and performing a second verification operation on the second memory cells.

Abstract: A method for fabricating a vertical channel type non-volatile memory device including forming a source region, alternately forming a plurality of interlayer dielectric layers and a plurality of conductive layers for a gate electrode over a substrate with the source region formed therein, forming a trench exposing the source region by etching the plurality of interlayer dielectric layers and the plurality of conductive layers for a gate electrode, and siliciding the conductive layers for a gate electrode and the source region that are exposed through the trench.

Abstract: A method for fabricating a non-volatile memory device includes: providing a substrate which includes a cell region where a plurality of memory cells are to be formed and a peripheral circuit region where a plurality of peripheral circuit devices are to be formed; forming the memory cells that are stacked perpendicularly to the substrate of the cell region; and forming a first conductive layer for forming a gate electrode of a selection transistor over the memory cells while forming the first conductive layer in the peripheral circuit region simultaneously, wherein the first conductive layer of the peripheral circuit region functions as a resistor body of at least one peripheral circuit device of the peripheral circuit devices.

Abstract: A non-volatile memory device includes a channel structure extended in a first direction that includes a plurality of inter-layer dielectric layers and a plurality of channel layers alternately stacked over a substrate such that each inter-layer dielectric layer is adjacent to a corresponding one of the plurality of channel layers. A word line extends in a second direction crossing the first direction over the channel structure, and a gate electrode protrudes from the word line in a downward direction to contact a sidewall of the channel structure. A memory gate insulation layer is interposed between the gate electrode and the channel structure, where sidewalls of the channel layers contacting the gate electrode are protruded toward the gate electrode, compared with sidewalls of the inter-layer dielectric layers.

Abstract: A method of operating a semiconductor memory device includes a memory array having memory cell strings including a first and a second memory cell groups having memory cells, a first and a second dummy elements, a drain select transistor and a source select transistor, wherein the first memory cell group and the second memory cell group are arranged between the drain select transistor and the source select transistor; connecting electrically the first memory cell group to the second memory cell group during a program operation or a read operation of the first memory cell group or the second memory cell group; and performing separately an erase operation of the first memory cell group and an erase operation of the second memory cell group, selecting simultaneously one of the first dummy element and the second dummy element during the erase operation of the selected memory cell group.

Abstract: A nonvolatile memory device and a method of programming the device includes storing first data in first main and sub-registers and storing second data in second main and sub-registers, performing first program and verification operations on first memory cells based on the first data stored in the first main register, storing a result of the first verification operation in the first main register, performing a second program operation on second memory cells based on the second data stored in the second main register, changing the result of the first verification operation, stored in the first main register, into the first data stored in the first sub-register, performing an additional verification operation on the first memory cells on which the first verification operation has been completed, storing a result of the additional verification operation in the first main register, and performing a second verification operation on the second memory cells.

Abstract: A method for fabricating a vertical channel type non-volatile memory device including forming a source region, alternately forming a plurality of interlayer dielectric layers and a plurality of conductive layers for a gate electrode over a substrate with the source region formed therein, forming a trench exposing the source region by etching the plurality of interlayer dielectric layers and the plurality of conductive layers for a gate electrode, and siliciding the conductive layers for a gate electrode and the source region that are exposed through the trench.

Abstract: A nonvolatile memory device and a method of programming the device includes storing first data in first main and sub-registers and storing second data in second main and sub-registers, performing first program and verification operations on first memory cells based on the first data stored in the first main register, storing a result of the first verification operation in the first main register, performing a second program operation on second memory cells based on the second data stored in the second main register, changing the result of the first verification operation, stored in the first main register, into the first data stored in the first sub-register, performing an additional verification operation on the first memory cells on which the first verification operation has been completed, storing a result of the additional verification operation in the first main register, and performing a second verification operation on the second memory cells.