Patents by Inventor Kanechika Kiyose

Kanechika Kiyose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210220874
    Abstract: Provided is an ultrasonic device including a substrate and a vibration plate provided on the substrate and having one or more vibrators configured to generate an ultrasonic wave by vibration. The vibration plate has a movable portion provided with the vibrator and configured to vibrate accompanying with the vibration of the vibrator, and a fixed portion fixed to the substrate. A vibration frequency of a reflected wave based on a wave transmitted from the movable portion and received by the movable portion is outside a vibration frequency band region of the vibrator.
    Type: Application
    Filed: January 19, 2021
    Publication date: July 22, 2021
    Inventors: Chikara KOJIMA, Koji OHASHI, Tomohiro SAYAMA, Seiji IZUO, Kanechika KIYOSE
  • Patent number: 11018291
    Abstract: An ultrasonic device includes a vibration portion, a first electrode, a piezoelectric body, and a second electrode which are laminated in this order in a laminate direction, in which an outer circumferential edge of the first electrode is larger than an outer circumferential edge of the piezoelectric body in a plan view across the laminate direction, in which the piezoelectric body includes an active portion that is provided in the vibration portion, and an extraction portion that is connected to the active portion and is provided over the inside and the outside of the vibration portion, in which a width dimension of the extraction portion is smaller than a width dimension of the active portion, and in which the second electrode is provided on the active portion and the extraction portion.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: May 25, 2021
    Inventors: Chikara Kojima, Koji Ohashi, Hikaru Iwai, Kanechika Kiyose
  • Patent number: 10919323
    Abstract: An ultrasonic sensor includes an ultrasonic transceiver that transmits and receives an ultrasonic wave, and that outputs a reception signal by receiving the ultrasonic wave, and a position detection unit that detects a position of a target facing the ultrasonic transceiver, based on the reception signal. A plurality of the ultrasonic transceivers are arranged along a first direction. The position detection unit detects inclination of the target with respect to the first direction, based on the reception signals output from a plurality of the ultrasonic transceivers.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: February 16, 2021
    Assignee: Seiko Epson Corporation
    Inventors: Ryoki Watanabe, Kanechika Kiyose
  • Publication number: 20200303618
    Abstract: An MEMS device includes: a first member; a second member forming a sealed space with the first member therebetween; and a third member disposed between the first member and the second member and joined to the first member and the second member, in which the third member has lower rigidity than rigidity of the first member and the second member, and the third member is provided with a communication portion that establishes communication between the sealed space and an external space.
    Type: Application
    Filed: March 19, 2020
    Publication date: September 24, 2020
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Chikara KOJIMA, Eiji OSAWA, Koji OHASHI, Kanechika KIYOSE, Tomohiro SAYAMA, Hironori SUZUKI, Katsuhiro IMAI, Yasuyuki MATSUMOTO, Takahiro KAMIJO
  • Publication number: 20200294692
    Abstract: A cable has a core line. The core line includes a signal line transmitting a signal, a ground line having a ground potential, and a shield line covering the signal line and the ground line. The ground line and the shield line are electrically coupled together.
    Type: Application
    Filed: March 10, 2020
    Publication date: September 17, 2020
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Yoshio ARAI, Mitsuru MIYASAKA, Masayoshi YAMADA, Kanechika KIYOSE
  • Publication number: 20200283252
    Abstract: A transport device includes: a medium support unit having a placement surface where a sheet-like medium is placed; a transport unit supplied with the medium placed at the placement surface and transporting the medium in a transport direction along a sheet surface of the medium; an ultrasonic transmitting unit provided at a part of the medium support unit and transmitting an ultrasonic wave; an ultrasonic receiving unit provided at another part of the medium support unit, and receiving the ultrasonic wave and outputting a received signal; and a floating detection unit determining whether a floating of the medium from the placement surface is present or not, based on the received signal.
    Type: Application
    Filed: March 3, 2020
    Publication date: September 10, 2020
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Kanechika KIYOSE, Tomohide ONOGI
  • Patent number: 10716541
    Abstract: An ultrasonic device includes an element substrate, an ultrasonic transducer array disposed on a rear surface of the element substrate, and having a plurality of ultrasonic transducers arranged in an array, an electrode line connected to the ultrasonic transducer on the rear surface of the element substrate, and drawn to a terminal region located outside the ultrasonic transducer array in a planar view of the element substrate viewed from a normal direction, a sealing plate bonded to the rear surface side of the element substrate, and a through electrode penetrating the sealing plate in a thickness direction and connected to an electrode pad of the electrode line at a position, which is located outside a region opposed to the ultrasonic transducer array of the sealing plate and is opposed to the electrode pad.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: July 21, 2020
    Assignee: Seiko Epson Corporation
    Inventors: Kanechika Kiyose, Nobuaki Hashimoto
  • Patent number: 10707407
    Abstract: An ultrasonic device includes a substrate having a first opening, a second opening and a wall part partitioning the first opening and the second opening; a first vibration film and a second vibration film which close the first opening and the second opening respectively; a first piezoelectric element and a second piezoelectric element which are formed on surfaces of the first vibration film and the second vibration film opposite to the substrate; an acoustic matching layer which is disposed within the first opening and the second opening so as to come into contact with the first vibration film and the second vibration film.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: July 7, 2020
    Assignee: Seiko Epson Corporation
    Inventor: Kanechika Kiyose
  • Publication number: 20200191618
    Abstract: A sensor unit includes a sensor device, a holder that holds the sensor device and includes a surface maintained at a reference potential, and a case that houses the holder, in which the case includes a mounting surface in contact with a mounting object, and the mounting surface is provided with a communication portion that causes an inside and an outside of the case to communicate with each other, and the holder includes a protrusion that protrudes from the communication portion and comes in contact with the mounting object.
    Type: Application
    Filed: December 13, 2019
    Publication date: June 18, 2020
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Masayoshi YAMADA, Hikaru IWAI, Kanechika KIYOSE
  • Publication number: 20200168784
    Abstract: A piezoelectric device includes a substrate having opening portions, a vibrating plate provided to overlap with the substrate and having a plurality of vibrating regions overlapping with the opening portions in a plan view as seen from a thickness direction of the substrate, piezoelectric elements provided in the vibrating regions, and bypass wires provided outside of the vibrating regions of the vibrating plate and electrically coupled to the plurality of piezoelectric elements, wherein slits penetrating the bypass wires in the thickness direction are provided in the bypass wires.
    Type: Application
    Filed: November 21, 2019
    Publication date: May 28, 2020
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Chikara KOJIMA, Koji OHASHI, Hironori SUZUKI, Kanechika KIYOSE, Katsuhiro IMAI, Yasuyuki MATSUMOTO, Takahiro KAMIJO
  • Patent number: 10653390
    Abstract: An ultrasonic device includes: a substrate on which ultrasonic elements configured to transmit and receive ultrasound and a cable electrically connected to the ultrasonic elements are installed; an acoustic lens having a plurality of projecting portions connected to one of the substrate and the cable; and an acoustic matching unit located between the substrate and the acoustic lens, wherein the projecting portions extend along an outer perimeter of the substrate, and the projecting portions are provided at a lower ratio per unit length in a direction in which the projecting portions extend in a place where the cable is installed than in a place where the cable is not installed.
    Type: Grant
    Filed: December 24, 2014
    Date of Patent: May 19, 2020
    Assignee: Seiko Epson Corporation
    Inventor: Kanechika Kiyose
  • Patent number: 10605915
    Abstract: An ultrasonic device includes an element substrate provided with an ultrasonic transducer array having a plurality of ultrasonic transducers arranged in an array, and having a first surface and a second surface located on an opposite side to the first surface, a terminal part disposed on the first surface of the element substrate, and outside the ultrasonic transducer array in a planar view viewed from a normal direction of the first surface, and electrically connected to the ultrasonic transducers, and a reinforcing plate disposed on the second surface of the element substrate in an area overlapping the terminal part in the planar view, and higher in bending rigidity than the element substrate.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: March 31, 2020
    Assignee: Seiko Epson Corporation
    Inventors: Kanechika Kiyose, Hikaru Iwai
  • Publication number: 20200039774
    Abstract: An ultrasonic device includes an ultrasonic element that performs at least one of transmitting an ultrasonic wave along a first axis and receiving the ultrasonic wave input along the first axis, and a protective member that is provided on the first axis and covers the ultrasonic element, in which the protective member has a plurality of pores through which the ultrasonic wave traveling along the first axis passes.
    Type: Application
    Filed: July 31, 2019
    Publication date: February 6, 2020
    Inventors: Masayoshi YAMADA, Hikaru IWAI, Kanechika KIYOSE
  • Patent number: 10524764
    Abstract: An ultrasonic device includes a base, a plurality of ultrasonic transducer elements, and a reinforcing body. The base defines a plurality of openings arranged in an array form. The ultrasonic transducer elements are arranged respectively corresponding to the openings with a plurality of vibration films being respectively provided for the ultrasonic transducer elements. The reinforcing body is fixed to the base in an area between adjacent ones of the vibration films when viewed in a plan view along a thickness direction of the base. The reinforcing body has Young's modulus greater than Young's modulus of the base.
    Type: Grant
    Filed: September 29, 2014
    Date of Patent: January 7, 2020
    Assignee: Seiko Epson Corporation
    Inventors: Kanechika Kiyose, Hironori Suzuki, Hiroshi Matsuda
  • Patent number: 10517566
    Abstract: An ultrasonic device includes a base, a plurality of ultrasonic transducer elements, an acoustic adjustment layer, and a wall part. The ultrasonic transducer elements are arranged in an array form on the base, each of the ultrasonic transducer elements having a vibration film. The acoustic adjustment layer is disposed on each of the ultrasonic transducer elements. The wall part is arranged between adjacent ones of the ultrasonic transducer elements when viewed in a plan view along a thickness direction of the base such that the acoustic adjustment layer on the adjacent ones of the ultrasonic transducer elements are separated by the wall part in a range of at least a portion of a height of the acoustic adjustment layer measured from the base. The wall part has an acoustic impedance that is higher than an acoustic impedance of the acoustic adjustment layer.
    Type: Grant
    Filed: September 29, 2014
    Date of Patent: December 31, 2019
    Assignee: Seiko Epson Corporation
    Inventors: Kanechika Kiyose, Hironori Suzuki, Hiroshi Matsuda
  • Patent number: 10514449
    Abstract: An ultrasonic device includes a substrate having an ultrasonic element arranged on a first face of the substrate, an acoustic lens provided on a first face side of the substrate via an acoustic matching layer, and a frame having a first fixing portion and a second fixing portion. The first fixing portion and the second fixing portion being disposed between the substrate and the acoustic lens. The first fixing portion and the second fixing portion protrude toward each other in a direction generally along the first face of the substrate. The first fixing portion and the second fixing portion are separated by a perforated portion therebetween through which the acoustic matching layer penetrates. The first fixing portion and the second fixing portion are connected to the substrate and in contact with the acoustic lens.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: December 24, 2019
    Assignee: Seiko Epson Corporation
    Inventor: Kanechika Kiyose
  • Publication number: 20190343492
    Abstract: An ultrasonic device includes: a substrate provided with a first opening and a second opening; a support film that is provided on the substrate and blocks the first opening and the second opening; a transmitting piezoelectric film that is provided on the support film at a position which overlaps the first opening when viewed in a thickness direction of the substrate and is interposed between a pair of electrodes in the thickness direction of the substrate; and a receiving piezoelectric film that is provided on the support film at a position which overlaps the second opening when viewed in the thickness direction of the substrate and is interposed between a pair of electrodes in the thickness direction of the substrate. In the thickness direction of the substrate, a thickness dimension of the transmitting piezoelectric film is smaller than a thickness dimension of the receiving piezoelectric film.
    Type: Application
    Filed: April 18, 2017
    Publication date: November 14, 2019
    Inventors: Hiromu MIYAZAWA, Hiroshi ITO, Tomoaki NAKAMURA, Masayoshi YAMADA, Kanechika KIYOSE, Tsukasa FUNASAKA
  • Patent number: 10458957
    Abstract: An ultrasonic device includes: a substrate provided with a first opening and a second opening; a support film that is provided on the substrate and closes the first opening and the second opening; a transmitting piezoelectric film that is provided on the support film at a position which overlaps the first opening when viewed in a thickness direction of the substrate and that is sandwiched between a pair of electrodes in the thickness direction of the substrate; and a receiving piezoelectric film that is provided on the support film at a position which overlaps the second opening when viewed in the thickness direction of the substrate and that is sandwiched between a pair of electrodes in an intersecting direction intersecting with the thickness direction of the substrate.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: October 29, 2019
    Assignee: Seiko Epson Corporation
    Inventors: Hiromu Miyazawa, Hiroshi Ito, Tomoaki Nakamura, Masayoshi Yamada, Kanechika Kiyose, Tsukasa Funasaka
  • Patent number: 10424719
    Abstract: A piezoelectric module includes an element substrate that includes a plurality of piezoelectric bodies (piezoelectric elements) arranged in an array, and a plurality of connection electrodes (lower connection electrode and upper connection electrode) that are connected to the piezoelectric body (piezoelectric element) and are drawn between the piezoelectric body (piezoelectric element) and an adjacent piezoelectric body (piezoelectric element), an input and output circuit that is provided on one surface side of the element substrate and independently inputs and outputs a signal from and to each of the connection electrodes (lower connection electrode and upper connection electrode), and columnar electrodes (first through electrode and second through electrode) each of which is provided between each of the connection electrodes (lower connection electrode and upper connection electrode) and the input and output circuit and connects each of the connection electrodes (lower connection electrode and upper connect
    Type: Grant
    Filed: November 11, 2016
    Date of Patent: September 24, 2019
    Assignee: Seiko Epson Corporation
    Inventor: Kanechika Kiyose
  • Patent number: 10424720
    Abstract: A piezoelectric device includes an element substrate that includes a first surface (operating surface) and a second surface (back surface) on a side opposite to the first surface, and includes a recessed opening provided on the first surface and a supporting portion surrounding the recessed opening, a piezoelectric body that is provided on the second surface of the recessed opening, a plurality of connection electrodes (lower connection electrode and upper connection electrode) that are connected to the piezoelectric body and are drawn to the second surface of the supporting portion from the piezoelectric body, a reinforcement plate that is bonded to the second surface side of the element substrate, and a plurality of through electrodes that are provided at a position of the reinforcement plate which faces the supporting portion, pass through the reinforcement plate in a thickness direction, and are respectively connected to the plurality of connection electrodes.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: September 24, 2019
    Assignee: Seiko Epson Corporation
    Inventor: Kanechika Kiyose