Abstract: An ultrasonic measuring device includes an ultrasonic transducer device, and a processing device that performs processing based on a reception signal from the ultrasonic transducer device. The processing device includes a data acquisition unit that, based on the reception signal, acquires 1st to K-th (K being an integer greater than or equal to 2) A-mode waveform data groups that correspond to cases where the direction of the scanning plane relative to a measurement location surface is 1st to K-th directions; a selection unit that selects a measurement result A-mode waveform data piece based on the 1st to K-th A-mode waveform data groups; and a notification control unit that generates notification data based on the at least one of the measurement result A-mode waveform data piece and a measurement result A-mode waveform data group that corresponds to the measurement result A-mode waveform data piece, and outputs the generated notification data.

Abstract: An ultrasonic probe unit is provided with an ultrasonic probe, and a fixation section adapted to fix the ultrasonic probe to a living body, the ultrasonic probe includes an ultrasonic device adapted to perform transmission and reception of an ultrasonic wave, a probe-side magnet, and a displacement mechanism adapted to adjust a relative positional relationship between the ultrasonic device and the probe-side magnet, and the fixation section includes a fixation surface to be fixed to the living body, and a fixation section-side magnet a relative position of which to the probe-side magnet is fixed to thereby fix the ultrasonic probe to the living body.

Abstract: A piezoelectric device includes an element substrate that includes a first surface (operating surface) and a second surface (back surface) on a side opposite to the first surface, and includes a recessed opening provided on the first surface and a supporting portion surrounding the recessed opening, a piezoelectric body that is provided on the second surface of the recessed opening, a plurality of connection electrodes (lower connection electrode and upper connection electrode) that are connected to the piezoelectric body and are drawn to the second surface of the supporting portion from the piezoelectric body, a reinforcement plate that is bonded to the second surface side of the element substrate, and a plurality of through electrodes that are provided at a position of the reinforcement plate which faces the supporting portion, pass through the reinforcement plate in a thickness direction, and are respectively connected to the plurality of connection electrodes.

Abstract: A piezoelectric module includes an element substrate that includes a plurality of piezoelectric bodies (piezoelectric elements) arranged in an array, and a plurality of connection electrodes (lower connection electrode and upper connection electrode) that are connected to the piezoelectric body (piezoelectric element) and are drawn between the piezoelectric body (piezoelectric element) and an adjacent piezoelectric body (piezoelectric element), an input and output circuit that is provided on one surface side of the element substrate and independently inputs and outputs a signal from and to each of the connection electrodes (lower connection electrode and upper connection electrode), and columnar electrodes (first through electrode and second through electrode) each of which is provided between each of the connection electrodes (lower connection electrode and upper connection electrode) and the input and output circuit and connects each of the connection electrodes (lower connection electrode and upper connect

Abstract: An ultrasonic transducer element chip includes a substrate, a plurality of ultrasonic transducer elements and a plate-shaped member. The substrate includes a partition wall section defining a plurality of openings arranged in an array pattern. A wall thickness of the partition wall section is smaller than a wall height of partition wall section. Each of the ultrasonic transducer elements is provided in each of the openings. The plate-shaped member is fixed on a surface of the substrate opposite to a surface of the substrate on which the ultrasonic transducer elements are provided. The plate-shaped member covers at least one of the openings in a plan view seen along a thickness direction of the substrate.

Abstract: An ultrasonic transducer device includes a base, a first electrode film, a piezoelectric film, a second electrode film and a first conductive film. The base has a plurality of vibrating film portions arranged in an array pattern. The first electrode film is disposed on each of the vibrating film portions. The piezoelectric film is disposed on the first electrode film. The second electrode film is disposed on the piezoelectric film. The first conductive film is connected to the first electrode film. The first conductive film has a film thickness larger than a film thickness of the first electrode film.

Abstract: A projection display system includes: an image projection device projecting an image on a projection surface; an optical detecting device; and an attaching device, wherein the optical detecting device includes an irradiating section emitting an irradiation light toward a detection region which is set along the projection surface, a light receiving section receiving a reflected light generated as a result of the irradiation light being reflected from the object, and a detecting section detecting position information of the object based on the result of the light received by the light receiving section, and the attaching device includes a first attaching section attached to a support supporting the attaching device, a second attaching section attached to the image projection device, and a third attaching section attached to the optical detecting device.

Abstract: An ultrasonic transducer element chip includes a substrate defining an opening, an ultrasonic transducer element disposed at a position corresponding to the opening in a thickness direction of the substrate, and a reinforcing member connected to the substrate to cover the opening. The reinforcing member defines a ventilation passage from the opening to an outside of the substrate.

Abstract: An ultrasonic transducer element chip includes a substrate, a plurality of ultrasonic transducer elements and a plate-shaped member. The substrate includes a partition wall section defining a plurality of openings arranged in an array pattern. A wall thickness of the partition wall section is smaller than a wall height of partition wall section. Each of the ultrasonic transducer elements is provided in each of the openings. The plate-shaped member is fixed on a surface of the substrate opposite to a surface of the substrate on which the ultrasonic transducer elements are provided. The plate-shaped member covers at least one of the openings in a plan view seen along a thickness direction of the substrate.

Abstract: An ultrasonic transducer device includes a base, a first electrode film, a piezoelectric film, a second electrode film and a first conductive film. The base has a plurality of vibrating film portions arranged in an array pattern. The first electrode film is disposed on each of the vibrating film portions. The piezoelectric film is disposed on the first electrode film. The second electrode film is disposed on the piezoelectric film. The first conductive film is connected to the first electrode film. The first conductive film has a film thickness larger than a film thickness of the first electrode film.

Abstract: An ultrasonic device includes an element substrate provided with an ultrasonic transducer array in which a plurality of ultrasonic transducers are arranged in an array, a sealing plate (array counter plate) that is bonded to the element substrate and covers at least the ultrasonic transducer array, and a support substrate that supports at least one of the element substrate and the sealing plate, and the support substrate has a through hole (insertion section) into which at least part of the sealing plate is inserted.

Abstract: An ultrasonic device includes an element substrate provided with an ultrasonic transducer array having a plurality of ultrasonic transducers arranged in an array, and having a first surface and a second surface located on an opposite side to the first surface, a terminal part disposed on the first surface of the element substrate, and outside the ultrasonic transducer array in a planar view viewed from a normal direction of the first surface, and electrically connected to the ultrasonic transducers, and a reinforcing plate disposed on the second surface of the element substrate in an area overlapping the terminal part in the planar view, and higher in bending rigidity than the element substrate.

Abstract: An ultrasonic probe includes a housing shaped like a thin plate and having a sensor surface as a transmitting/receiving surface for an ultrasonic wave, and a hand part having an axial direction, and connected to a side surface of the housing at one end in the axial direction, the side surface crossing the sensor surface of the housing. Thus, it is possible to pick up the hand part to dispose the ultrasonic probe to a desired position, and it becomes possible to check an internal tomographic image of the object viewed from an arbitrary direction without suspending the operation.

Abstract: An ultrasonic transducer element chip includes a substrate defining an opening, an ultrasonic transducer element disposed at a position corresponding to the opening in a thickness direction of the substrate, and a reinforcing member connected to the substrate to cover the opening. The reinforcing member defines a ventilation passage from the opening to an outside of the substrate.

Abstract: An ultrasonic device includes an element substrate, an ultrasonic transducer array disposed on a rear surface of the element substrate, and having a plurality of ultrasonic transducers arranged in an array, an electrode line connected to the ultrasonic transducer on the rear surface of the element substrate, and drawn to a terminal region located outside the ultrasonic transducer array in a planar view of the element substrate viewed from a normal direction, a sealing plate bonded to the rear surface side of the element substrate, and a through electrode penetrating the sealing plate in a thickness direction and connected to an electrode pad of the electrode line at a position, which is located outside a region opposed to the ultrasonic transducer array of the sealing plate and is opposed to the electrode pad.

Abstract: A living body testing probe includes a living body contact part, a grip part, a non-mechanical switch part and a notification part. The living body contact part is configured and arranged to contact a living body. The non-mechanical switch part is configured and arranged to receive an operation input for changing test conditions upon being touched or approached. The notification part is configured and arranged to output information indicative of a change in the test conditions based on the operation input received by the non-mechanical switch part.

Abstract: An ultrasonic transducer element unit includes a substrate, a first ultrasonic transducer element, and a projecting portion. The substrate includes openings being arranged in an array pattern and a main surface. The first ultrasonic transducer element is configured at a first opening of the openings on the main surface of the substrate and has a first height in a vertical direction from the main surface. The projecting portion is configured not to overlap with the first ultrasonic transducer element in a planar view in a thickness direction of the substrate on the main surface and having a second height which is greater than the first height in the vertical direction.

Abstract: An ultrasonic probe is provided that makes it possible to increase the shock resistance of a board of an ultrasonic device unit. An ultrasonic probe includes a housing. The housing defines an opening and an accommodation space that is continuous with the opening. An ultrasonic device unit is disposed in the accommodation space. A board has on its first surface an ultrasonic transducer that faces the opening. A rigid body is in contact with a second surface of the board and the housing. The rigid body has higher stiffness than the board.

Abstract: An ultrasonic device includes an element substrate and a wiring substrate. The element substrate includes an ultrasonic element and an element interconnect terminal connected to the ultrasonic element. The wiring substrate includes a wiring terminal and an opening portion that defines an opening extending through the wiring substrate. The element interconnect terminal and the wiring terminal are connected so as to oppose each other. The opening portion encloses the ultrasonic element in plan view as seen from a thickness direction of the wiring substrate.

Abstract: A first mold has a recessed surface portion. A second mold that has a protruding surface portion and a flat surface portion is laid on top of the first mold, thereby forming a first cavity between the recessed surface portion and the protruding surface portion and a second cavity between the first mold and the flat surface portion. The first cavity and the second cavity are filled with a first resin material. A third mold having a flat inner wall surface is laid on top of the first mold and the first resin, thereby forming a space between the inner wall surface and the first resin so as to correspond to the protruding surface portion. This space is filled with a second resin material, and thus an acoustic coupling member is molded.