Patents by Inventor Kanechika Kiyose

Kanechika Kiyose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190283466
    Abstract: An ultrasonic sensor includes an ultrasonic transceiver that transmits and receives an ultrasonic wave, and that outputs a reception signal by receiving the ultrasonic wave, and a position detection unit that detects a position of a target facing the ultrasonic transceiver, based on the reception signal. A plurality of the ultrasonic transceivers are arranged along a first direction. The position detection unit detects inclination of the target with respect to the first direction, based on the reception signals output from a plurality of the ultrasonic transceivers.
    Type: Application
    Filed: March 18, 2019
    Publication date: September 19, 2019
    Inventors: Ryoki WATANABE, Kanechika KIYOSE
  • Publication number: 20190271624
    Abstract: A sonic speed measurement device includes a reception array in which a plurality of reception elements which output reception signals in response to reception of an ultrasonic wave are disposed in one direction, a phase difference detection portion that detects a phase difference between the reception signals output from the reception elements adjacent to each other in a case where the plurality of reception elements receive the ultrasonic wave which propagates in a spherical wave shape from a target point, and a sonic speed calculation portion that calculates a sonic speed of the ultrasonic wave on the basis of the phase difference.
    Type: Application
    Filed: March 4, 2019
    Publication date: September 5, 2019
    Inventors: Ryoki WATANABE, Kanechika KIYOSE
  • Publication number: 20190255568
    Abstract: An ultrasonic sensor includes a vibration plate that includes a vibration portion and is formed of a resin; a wall portion that is provided on the vibration plate, surrounds the vibration portion and is formed of a resin; and a piezoelectric element that is provided in the vibration portion of the vibration plate. Accordingly, the wall portion surrounding the vibration portion can suppress a frequency variation of an ultrasonic wave output from the ultrasonic sensor and can deform the ultrasonic sensor into a shape corresponding to a surface of an object having various shapes.
    Type: Application
    Filed: February 20, 2019
    Publication date: August 22, 2019
    Inventors: Chikara KOJIMA, Hironori SUZUKI, Kanechika KIYOSE
  • Patent number: 10350639
    Abstract: An ultrasonic device includes an element substrate provided with an ultrasonic transducer array in which a plurality of ultrasonic transducers are arranged in an array, a sealing plate (array counter plate) that is bonded to the element substrate and covers at least the ultrasonic transducer array, and a support substrate that supports at least one of the element substrate and the sealing plate, and the support substrate has a through hole (insertion section) into which at least part of the sealing plate is inserted.
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: July 16, 2019
    Assignee: Seiko Epson Corporation
    Inventor: Kanechika Kiyose
  • Publication number: 20190196009
    Abstract: An ultrasonic device includes an ultrasonic transceiver that transmits an ultrasonic wave to a target at a predetermined interval, and that receives the ultrasonic wave reflected on the target so as to output a reception signal, a signal integration unit that outputs an integrated signal obtained by integrating the reception signals output within a predetermined period, and a position detection unit that detects a position of the target, based on a magnitude relationship between signal intensity of the integrated signal and a predetermined reference value.
    Type: Application
    Filed: December 20, 2018
    Publication date: June 27, 2019
    Inventors: Ryoki WATANABE, Kanechika KIYOSE
  • Patent number: 10172591
    Abstract: An ultrasonic device includes a substrate, a first piezoelectric body, a second piezoelectric body, and an acoustic matching section. The substrate has a first surface that is a flat surface. The first piezoelectric body is disposed on the first surface of the substrate. The second piezoelectric body is disposed on the first surface of the substrate. The second piezoelectric body has a different thickness from a thickness of the first piezoelectric body as measured from the first surface of the substrate. The acoustic matching section is disposed on the first piezoelectric body and the second piezoelectric body. The acoustic matching section has a first side facing the first piezoelectric body and the second piezoelectric body, and a second side opposite from the first side. A surface of the acoustic matching section on the second side is a flat surface parallel with the first surface of the substrate.
    Type: Grant
    Filed: October 10, 2014
    Date of Patent: January 8, 2019
    Assignee: Seiko Epson Corporation
    Inventors: Kanechika Kiyose, Toshikazu Uchiyama
  • Patent number: 10085720
    Abstract: An ultrasonic device includes an element substrate and a wiring substrate. The element substrate includes an ultrasonic element and an element interconnect terminal connected to the ultrasonic element. The wiring substrate includes a wiring terminal and an opening portion that defines an opening extending through the wiring substrate. The element interconnect terminal and the wiring terminal are connected so as to oppose each other. The opening portion encloses the ultrasonic element in plan view as seen from a thickness direction of the wiring substrate.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: October 2, 2018
    Assignee: Seiko Epson Corporation
    Inventors: Kanechika Kiyose, Nobuaki Hashimoto
  • Patent number: 10074795
    Abstract: An ultrasonic probe is provided that makes it possible to increase the shock resistance of a board of an ultrasonic device unit. An ultrasonic probe includes a housing. The housing defines an opening and an accommodation space that is continuous with the opening. An ultrasonic device unit is disposed in the accommodation space. A board has on its first surface an ultrasonic transducer that faces the opening. A rigid body is in contact with a second surface of the board and the housing. The rigid body has higher stiffness than the board.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: September 11, 2018
    Assignee: Seiko Epson Corporation
    Inventor: Kanechika Kiyose
  • Patent number: 10042044
    Abstract: An ultrasonic device includes a base in which a base layer of a vibrating film is formed in every opening that is disposed in an array; an interconnect layer, which is a conductor, formed on the base layer; an insulating film that is formed on the interconnect layer, and forms a laminated structure with respect to the base layer; a plurality of piezoelectric elements that are separated from the interconnect layer by the insulating film, the piezoelectric elements each including a first electrode and a second electrode that sandwich a piezoelectric film on the insulating film; and a through conductor that passes through the insulating film, and connects at least one of the first electrode and the second electrode to the conductor constituting the interconnect layer.
    Type: Grant
    Filed: September 24, 2014
    Date of Patent: August 7, 2018
    Assignee: Seiko Epson Corporation
    Inventors: Kanechika Kiyose, Hiroshi Matsuda, Daisuke Nakanishi
  • Patent number: 10040098
    Abstract: An ultrasonic transducer element chip includes a substrate defining an opening, an ultrasonic transducer element disposed at a position corresponding to the opening in a thickness direction of the substrate, and a reinforcing member connected to the substrate to cover the opening. The reinforcing member defines a ventilation passage from the opening to an outside of the substrate.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: August 7, 2018
    Assignee: Seiko Epson Corporation
    Inventors: Tomoaki Nakamura, Jiro Tsuruno, Kanechika Kiyose
  • Publication number: 20180182949
    Abstract: An ultrasonic device includes a vibration portion, a first electrode, a piezoelectric body, and a second electrode which are laminated in this order in a laminate direction, in which an outer circumferential edge of the first electrode is larger than an outer circumferential edge of the piezoelectric body in a plan view across the laminate direction, in which the piezoelectric body includes an active portion that is provided in the vibration portion, and an extraction portion that is connected to the active portion and is provided over the inside and the outside of the vibration portion, in which a width dimension of the extraction portion is smaller than a width dimension of the active portion, and in which the second electrode is provided on the active portion and the extraction portion.
    Type: Application
    Filed: December 19, 2017
    Publication date: June 28, 2018
    Inventors: Chikara KOJIMA, Koji OHASHI, Hikaru IWAI, Kanechika KIYOSE
  • Publication number: 20180132827
    Abstract: An ultrasonic unit includes a first and a second ultrasonic wave transmission and reception portions that transmit ultrasonic waves to a subject and receive ultrasonic waves reflected from the subject, a first sound guide portion through which ultrasonic waves transmitted and received by a first ultrasonic wave transmission and reception portion pass, and a second sound guide portion through which ultrasonic waves transmitted and received by a second ultrasonic wave transmission and reception portion pass, in which a distance between the first sound guide portion and the second sound guide portion is gradually reduced toward the subject.
    Type: Application
    Filed: November 9, 2017
    Publication date: May 17, 2018
    Inventors: Daisuke NAKANISHI, Kanechika KIYOSE
  • Publication number: 20180059067
    Abstract: An ultrasonic device includes: a substrate provided with a first opening and a second opening; a support film that is provided on the substrate and closes the first opening and the second opening; a transmitting piezoelectric film that is provided on the support film at a position which overlaps the first opening when viewed in a thickness direction of the substrate and that is sandwiched between a pair of electrodes in the thickness direction of the substrate; and a receiving piezoelectric film that is provided on the support film at a position which overlaps the second opening when viewed in the thickness direction of the substrate and that is sandwiched between a pair of electrodes in an intersecting direction intersecting with the thickness direction of the substrate.
    Type: Application
    Filed: August 21, 2017
    Publication date: March 1, 2018
    Inventors: Hiromu MIYAZAWA, Hiroshi ITO, Tomoaki NAKAMURA, Masayoshi YAMADA, Kanechika KIYOSE, Tsukasa FUNASAKA
  • Publication number: 20180047891
    Abstract: An ultrasonic device includes a substrate having a first opening, a second opening and a wall part partitioning the first opening and the second opening; a first vibration film and a second vibration film which close the first opening and the second opening respectively; a first piezoelectric element and a second piezoelectric element which are formed on surfaces of the first vibration film and the second vibration film opposite to the substrate; an acoustic matching layer which is disposed within the first opening and the second opening so as to come into contact with the first vibration film and the second vibration film.
    Type: Application
    Filed: October 11, 2017
    Publication date: February 15, 2018
    Inventor: Kanechika KIYOSE
  • Patent number: 9868137
    Abstract: An ultrasonic transducer device includes a base, a plurality of piezoelectric elements, a conductive body and an insulating film. The base has a plurality of vibrating film portions arranged in an array pattern. The piezoelectric elements are respectively disposed on the vibrating film portions. The conductive body is disposed on the base, and arranged inside and outside of an area corresponding to each of the vibrating film portions in a plan view as viewed along a thickness direction of the base. The insulating film is disposed on the conductive body only at outside of the area corresponding to each of the vibrating film portions in the plan view.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: January 16, 2018
    Assignee: Seiko Epson Corporation
    Inventors: Kanechika Kiyose, Hironori Suzuki, Hiroshi Matsuda
  • Patent number: 9818929
    Abstract: An ultrasonic device includes a substrate having a first opening, a second opening and a wall part partitioning the first opening and the second opening; a first vibration film and a second vibration film which close the first opening and the second opening respectively; a first piezoelectric element and a second piezoelectric element which are formed on surfaces of the first vibration film and the second vibration film opposite to the substrate; an acoustic matching layer which is disposed within the first opening and the second opening so as to come into contact with the first vibration film and the second vibration film.
    Type: Grant
    Filed: November 14, 2014
    Date of Patent: November 14, 2017
    Assignee: Seiko Epson Corporation
    Inventor: Kanechika Kiyose
  • Patent number: 9782150
    Abstract: An ultrasonic transducer device includes a base, a first electrode film, a piezoelectric film, a second electrode film and a first conductive film. The base has a plurality of vibrating film portions arranged in an array pattern. The first electrode film is disposed on each of the vibrating film portions. The piezoelectric film is disposed on the first electrode film. The second electrode film is disposed on the piezoelectric film. The first conductive film is connected to the first electrode film. The first conductive film has a film thickness larger than a film thickness of the first electrode film.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: October 10, 2017
    Assignee: Seiko Epson Corporation
    Inventors: Kanechika Kiyose, Hironori Suzuki, Hiroshi Matsuda
  • Publication number: 20170258442
    Abstract: An ultrasonic device includes an ultrasonic transceiver having a flat ultrasonic wave transmitting/receiving surface and an acoustic lens provided on the ultrasonic wave transmitting/receiving surface. The acoustic lens has a first acoustic lens layer on the side facing away from the ultrasonic wave transmitting/receiving surface and a second acoustic lens layer on the side facing the ultrasonic wave transmitting/receiving surface. The first acoustic lens layer and the second acoustic lens layer have different attenuation coefficients. The interface between the first acoustic lens layer and the second acoustic lens layer is parallel to the ultrasonic wave transmitting/receiving surface.
    Type: Application
    Filed: March 8, 2017
    Publication date: September 14, 2017
    Inventors: Kazuki YOSHIDA, Tomoaki NAKAMURA, Kanechika KIYOSE
  • Publication number: 20170205500
    Abstract: An ultrasonic probe includes a transmitting unit including a transmitting surface that transmits ultrasonic waves, a receiving unit including a receiving surface that receives the ultrasonic waves, and a receiving attitude changing unit that changes an angle of the receiving unit, wherein a part of the transmitting unit includes a second receiving unit (group of transmitting and receiving transducers) that can receive the ultrasonic waves.
    Type: Application
    Filed: January 5, 2017
    Publication date: July 20, 2017
    Inventor: Kanechika KIYOSE
  • Publication number: 20170184715
    Abstract: An ultrasonic device includes a substrate having an ultrasonic element arranged on a first face of the substrate, an acoustic lens provided on a first face side of the substrate via an acoustic matching layer, and a frame having a first fixing portion and a second fixing portion. The first fixing portion and the second fixing portion being disposed between the substrate and the acoustic lens. The first fixing portion and the second fixing portion protrude toward each other in a direction generally along the first face of the substrate. The first fixing portion and the second fixing portion are separated by a perforated portion therebetween through which the acoustic matching layer penetrates. The first fixing portion and the second fixing portion are connected to the substrate and in contact with the acoustic lens.
    Type: Application
    Filed: March 10, 2017
    Publication date: June 29, 2017
    Inventor: Kanechika KIYOSE