Abstract: A pet monitoring device 12 to be fitted to a pet 14 that is to be monitored includes a transmitter configured to transmit signals via a mobile telecommunications network 20. The location of the pet monitoring device 12 can be determined by reference to parameters associated with receipt of a signal 18 transmitted by the transmitter by at least one base station of the mobile telecommunications network 20 so that an authorised user can identify the location of the pet monitoring device.

Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a semiconductor device includes a workpiece having a buried layer disposed beneath a top portion thereof. A trench is disposed in the workpiece extending at least through the buried layer. At least one sinker contact is disposed in the top portion of the workpiece. The at least one sinker contact is proximate sidewalls of at least a portion of the trench and is adjacent the buried layer. An insulating material is disposed on the sidewalls of the trench. A conductive material is disposed within the trench and is coupled to a lower portion of the workpiece.

Abstract: Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a semiconductive layer disposed over a substrate. A trench is disposed in the semiconductive layer, the trench with a first sidewall and an opposite second sidewall. A first insulating material layer is disposed over an upper portion of the first sidewall, and a conductive material disposed within the trench. An air gap is disposed between the conductive material and the semiconductive layer.

Abstract: Devices and circuits related to Electrostatic discharge (ESD) and Electromagnetic compatibility (EMC) are herein described. An ESD protection device is incorporated into a transistor in order to protect the gate of the transistor from excessive current loads related to ESD or EMC events. In an implementation, a device includes a first diode and a second diode that are electrically connected via their respective cathodes. The breakdown voltage of the first diode is lower than the breakdown voltage of the second diode in order to divert excessive current through the second diode.

Abstract: Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a semiconductive layer disposed over a substrate. A trench is disposed in the semiconductive layer, the trench with a first sidewall and an opposite second sidewall. A first insulating material layer is disposed over an upper portion of the first sidewall, and a conductive material disposed within the trench. An air gap is disposed between the conductive material and the semiconductive layer.

Abstract: Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a semiconductive layer disposed over a substrate. A trench is disposed in the semiconductive layer, the trench with a first sidewall and an opposite second sidewall. A first insulating material layer is disposed over an upper portion of the first sidewall, and a conductive material disposed within the trench. An air gap is disposed between the conductive material and the semiconductive layer.

Abstract: An office furniture unit has an outer face with slotted hangers, and a removable storage unit assembly including a bottom panel positioned in a generally horizontal orientation along the office furniture unit, and a top panel disposed above and generally parallel with the bottom panel. First and second panels are disposed at opposite ends of the top and bottom panels and are connected therewith to define a rigid, box-shaped case having an open back portion. The first and second end panels have rear portions with multiple vertically spaced slots. First and second hanger brackets have a rear portion with first hooks selectively received in the slotted hangers of the office furniture units, and a forward portion with second hooks selectively received in the slots in the rear portions of the first and second end panels to detachably support the case against the outer face of the office furniture unit.

Abstract: Devices and circuits related to Electrostatic discharge (ESD) and Electromagnetic compatibility (EMC) are herein described. An ESD protection device is incorporated into a transistor in order to protect the gate of the transistor from excessive current loads related to ESD or EMC events. In an implementation, a device includes a first diode and a second diode that are electrically connected via their respective cathodes. The breakdown voltage of the first diode is lower than the breakdown voltage of the second diode in order to divert excessive current through the second diode.

Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a semiconductor device includes a workpiece having a buried layer disposed beneath a top portion thereof. A trench is disposed in the workpiece extending at least through the buried layer. At least one sinker contact is disposed in the top portion of the workpiece. The at least one sinker contact is proximate sidewalls of at least a portion of the trench and is adjacent the buried layer. An insulating material is disposed on the sidewalls of the trench. A conductive material is disposed within the trench and is coupled to a lower portion of the workpiece.

Abstract: A keyboard that can be illuminated comprises a key array and a base element. Key buttons of the key array are held in modules arranged on a side, facing away from either the base element or a printed circuit board that is provided for delivering signals. The printed circuit board is arranged above the base element in a place close to but at a distance away from the base statement and made at least partially light-transmitting. At least one light source for emitting light is arranged on the underside of the printed circuit board that faces the base element. At least one light-scattering elements, which projects from the base element toward the printed circuit board, is arranged on the side of the base element facing the printed circuit board.

Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a semiconductor device includes a workpiece having a buried layer disposed beneath a top portion thereof. A trench is disposed in the workpiece extending at least through the buried layer. At least one sinker contact is disposed in the top portion of the workpiece. The at least one sinker contact is proximate sidewalls of at least a portion of the trench and is adjacent the buried layer. An insulating material is disposed on the sidewalls of the trench. A conductive material is disposed within the trench and is coupled to a lower portion of the workpiece.

Abstract: A photodetector is formed in a semiconductor body. A hard mask grating is photolithographically formed on a surface of the semiconductor body. The semiconductor body is etched using the hard mask grating as a mask. The etching is performed down to a predetermined depth. An implantation is performed such that an anode or cathode of the photodetector that has been interrupted during the etching is re-formed.