Patents by Inventor Kazuhiko Takada
Kazuhiko Takada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6573453Abstract: The wiring harness has a plurality of first sub-harnesses, a plurality of second sub-harnesses, and a connection portion electrically connecting one of electrical cables of the sub-harnesses to another. The first sub-harness has a first press-fit terminal joined to each end of a first one of the electrical cables, and the first sub-harness has a first isolator holding the first press-fit terminal. The second sub-harness has a second press-fit terminal, a crimp terminal, and a connector housing for accommodating the crimp terminal, and a second isolator supporting the second press-fit terminal. The second press-fit terminal is connected to one end of a second one of the electrical cables, and the crimp terminal is connected to the other end of the second one of the electrical cables. A connection means is provided for connecting one of the press-fit terminal held by one of the first or second isolators to the press-fit terminal held by another of the first or second isolators.Type: GrantFiled: February 26, 2001Date of Patent: June 3, 2003Assignee: Yazaki CorporationInventors: Kazuhiko Takada, Yutaka Matsuoka, Masami Sakamoto
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Patent number: 6557569Abstract: A method of manufacturing an electrophotographic photosensitive member includes the steps of: cleaning a substrate of the electrophotographic photosensitive member by cleaning step using a vessel and machining the substrate. The cleaning step includes a first overflowing step and a second overflowing step. In the first overflowing step, the liquid is allowed to be overflowed from a vessel while the substrate of the electrophotographic photosensitive member is immersed in the liquid contained in the vessel. In the second overflowing step, the liquid is allowed to overflow from a vessel while the substrate of the electrophotographic photosensitive member is pulled up in the liquid contained in the vessel. A flow rate Q2 of the overflowing liquid of the second overflowing step is higher than a flow rate Q1 of the overflowing liquid of the first overflowing step. The machining step forms a film of a photosensitive substance on the substrate.Type: GrantFiled: June 4, 2001Date of Patent: May 6, 2003Assignee: Canon Kabushiki KaishaInventors: Hiroyuki Katagiri, Yoshio Segi, Hideaki Matsuoka, Kazuhiko Takada
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Publication number: 20030057960Abstract: A conductivity testing method for a sub-harness and a sub-harness manufacturing apparatus are provided, which sub-harness manufacturing apparatus includes: a pair of connecting units each having a wire connecting portion, made of metal, vertically movable so as to connect one end of one or wires composing a sub-harness to one of terminals having a sheathing clamping portion and being arranged in a wire feeding direction; and a pair of transferring devices to transfer the terminals in a direction perpendicular to the wire feeding direction so as to position each one of the terminals under each wire connecting portions, wherein a clamping punch portion to clamp the sheathing clamping portion is provided on the wire connecting portion of each of the pair of connecting units and a conductivity testing device to judge the one, having terminals on the respective ends thereof, of the wires being good or bad is arranged between the clamping punch portions of the pair of connecting units.Type: ApplicationFiled: October 8, 2002Publication date: March 27, 2003Applicant: Yazaki CorporationInventor: Kazuhiko Takada
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Publication number: 20020195645Abstract: There are provided the steps of forming a tunnel insulating film on a semiconductor substrate, forming a first semiconductor film constituting a lower portion of a floating gate on the tunnel insulating film, forming device isolation recesses by etching device isolation regions on the first semiconductor film, the tunnel insulating film, and the semiconductor substrate, forming an device isolation insulating film in the device isolation recesses and on the first semiconductor film, removing the device isolation insulating film from an upper surface of the first semiconductor film and thinning the device isolation insulating film on the device isolation recesses, growing selectively a second semiconductor film serving as an upper portion of the floating gate on the first semiconductor film and growing the second semiconductor film on the device isolation insulating film to extend in the lateral direction, forming a dielectric film on the floating gate, and forming a conductive film serving as a control gate onType: ApplicationFiled: March 7, 2002Publication date: December 26, 2002Applicant: Fujitsu LimitedInventors: Kazuhiko Takada, Shinji Sugatani
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Patent number: 6486677Abstract: A conductivity testing method for a sub-harness and a sub-harness manufacturing apparatus are provided, which sub-harness manufacturing apparatus includes: a pair of connecting units each having a wire connecting portion, made of metal, vertically movable so as to connect one end of one of wires composing a sub-harness to one of terminals having a sheathing clamping portion and being arranged in a wire feeding direction; and a pair of transferring units to transfer the terminals in a direction perpendicular to the wire feeding direction so as to position each one of the terminals under each wire connecting portions, wherein a clamping punch portion to clamp the sheathing clamping portion is provided on the wire connecting portion of each of the pair of connecting units and a conductivity testing units to judge the one of the wires having terminals on the respective ends thereof being good or bad is arranged between the clamping punch portions of the pair of connecting units.Type: GrantFiled: April 5, 2001Date of Patent: November 26, 2002Assignee: Yazaki CorporationInventor: Kazuhiko Takada
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Publication number: 20020100421Abstract: For enhancing plasma uniformity and long-term stability so as to readily form a film with excellent uniformity of thickness and quality and with good repeatability and for suppressing occurrence of image defects and drastically increasing the yield to form a deposited film ready for volume production, particularly, a functional deposit film (for example, an amorphous semiconductor used for semiconductor devices, electrophotographic photosensitive members, photovoltaic devices, and so on) is formed in an apparatus including a reaction vessel which can be hermetically evacuated, a substrate holder in the reaction vessel, a source gas supply, a power supply for high-frequency power. An end covering member is provided at an end of each of the substrate holder, the source gas supply and the power supply.Type: ApplicationFiled: January 16, 2002Publication date: August 1, 2002Inventors: Kazuto Hosoi, Toshiyasu Shirasuna, Kazuhiko Takada, Ryuji Okamura, Hitoshi Murayama, Kazuyoshi Akiyama
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Patent number: 6413592Abstract: A film-forming apparatus is provided which comprises a reaction chamber capable of being vacuumed and having a reaction space in which a plurality of substrates can be arranged on a common circumference to establish an inner space circumscribed by the plurality of substrates. A film-forming raw material gas can be introduced into the inner space. A first electrode for supplying a high frequency power into the inner space is provided at a central position in the inner space circumscribed by the plurality of substrates. A second electrode is provided outside the plurality of substrates arranged on the common circumference. A shielding member having a dielectric portion constituted by a dielectric material is provided between the second electrode and the plurality of substrates arranged on the common circumference.Type: GrantFiled: August 31, 2000Date of Patent: July 2, 2002Assignee: Canon Kabushiki KaishaInventors: Ryuji Okamura, Toshiyasu Shirasuna, Kazuhiko Takada, Kazuyoshi Akiyama, Hitoshi Murayama
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Publication number: 20020039697Abstract: There is provided an electrophotographic method, in which influence on an image quality attributable to the conditions of the photoreceptor surface is reduced and much sharper and high image quality having high resolution is obtained, when a spot size of the exposure light is made finer as progress is made in high resolution. In a digital exposure system electrophotographic method of a BAE system which performs scan-exposing for an image formation on a photoreceptor, a photoreceptor comprising a supporting member 401 comprising aluminum or an aluminum alloy and a photosensitive layer 402 deposited on the supporting member surface by applying surface treatment using water on its surface, on which a convex structure is formed corresponding to a boundary portion of a crystal grain boundary of the supporting member surface is used.Type: ApplicationFiled: May 29, 2001Publication date: April 4, 2002Inventors: Satoshi Kojima, Koji Yamazaki, Toshiyuki Ehara, Kazuhiko Takada, Masaya Kawada, Hironori Ohwaki
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Patent number: 6360436Abstract: A crimping apparatus for producing sub-harnesses is described that includes a pair of frames, each provided with a centrally disposed crimper. Pairs of movable connector tables are provided on each frame, as well as locking devices for securing the connector tables on both ends of the respective frames. A pair of connector holding poles are provided in each of which a plurality of connectors are arranged to be settable on each of the connector tables.Type: GrantFiled: November 19, 1997Date of Patent: March 26, 2002Assignee: Yazaki CorporationInventor: Kazuhiko Takada
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Publication number: 20020029470Abstract: A press-fitting unit includes a vertically movable press blade for press-fitting a stripped end of an electrical wire to a terminal disposed in a connector. A connector retaining bar movable in a horizontal direction is disposed to be opposed to the press blade. The retaining bar is provided with a plurality of connector receiving recesses in parallel to respectively hold a connector with a press-fit terminal. A wire chuck is disposed so as to opposing to the rear part of the press blade. The wire chuck is horizontally movable along a horizontal guide to a side of the press blade so as to holding the wire. Alternatively, the connector retaining bar is fixed to the apparatus by a frame and a transfer mechanism can carry the press-fitting unit along the bar in a horizontal direction. In addition, the apparatus may have a pair or two pairs of the upper and lower symmetrical press-fitting units; and the connector retaining bar is disposed between the upper and lower press-fitting units.Type: ApplicationFiled: August 1, 2001Publication date: March 14, 2002Applicant: YAZAKI CORPORATIONInventor: Kazuhiko Takada
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Publication number: 20020029472Abstract: A crimping apparatus comprises a pair of frames; a pair of crimpers each provided centrally in each frame; pairs of connector tables each provided movably in a longitudinal direction on each frame; locking means for securing the connector tables on both ends of each frame; moving means for moving each said connector table along the frame; and a pair of connector holding poles in each of which a plurality of connectors are arranged to be settable on each the connector table. Thus, a large number of kinds of sub-harnesses can be manufactured.Type: ApplicationFiled: November 9, 2001Publication date: March 14, 2002Applicant: Yazaki CorporationInventor: Kazuhiko Takada
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Publication number: 20020029471Abstract: A press-fitting unit includes a vertically movable press blade for press-fitting a stripped end of an electrical wire to a terminal disposed in a connector. A connector retaining bar movable in a horizontal direction is disposed to be opposed to the press blade. The retaining bar is provided with a plurality of connector receiving recesses in parallel to respectively hold a connector with a press-fit terminal. A wire chuck is disposed so as to opposing to the rear part of the press blade. The wire chuck is horizontally movable along a horizontal guide to a side of the press blade so as to holding the wire. Alternatively, the connector retaining bar is fixed to the apparatus by a frame and a transfer mechanism can carry the press-fitting unit along the bar in a horizontal direction. In addition, the apparatus may have a pair or two pairs of the upper and lower symmetrical press-fitting units; and the connector retaining bar is disposed between the upper and lower press-fitting units.Type: ApplicationFiled: August 1, 2001Publication date: March 14, 2002Applicant: YAZAKI CORPORATIONInventor: Kazuhiko Takada
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Patent number: 6347601Abstract: For enhancing plasma uniformity and long-term stability so as to readily form a film with excellent uniformity of thickness and quality and with good repeatability and for suppressing occurrence of image defects and drastically increasing the yield to form a deposited film ready for volume production, particularly, a functional deposit film (for example, an amorphous semiconductor used for semiconductor devices, electrophotographic photosensitive members, photovoltaic devices, and so on) is formed in an apparatus including a reaction vessel which can be hermetically evacuated, a substrate holder in the reaction vessel, a source gas supply, a power supply for high-frequency power. An end covering member is provided at an end of each of the substrate holder, the source gas supply and the power supply.Type: GrantFiled: December 23, 1998Date of Patent: February 19, 2002Assignee: Canon Kabushiki KaishaInventors: Kazuto Hosoi, Toshiyasu Shirasuna, Kazuhiko Takada, Ryuji Okamura, Kazuyoshi Akiyama, Hitoshi Murayama
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Publication number: 20020004983Abstract: A press-fitting unit includes a vertically movable press blade for press-fitting a stripped end of an electrical wire to a terminal disposed in a connector. A connector retaining bar movable in a horizontal direction is disposed to be opposed to the press blade. The retaining bar is provided with a plurality of connector receiving recesses in parallel to respectively hold a connector with a press-fit terminal. A wire chuck is disposed so as to opposing to the rear part of the press blade. The wire chuck is horizontally movable along a horizontal guide to a side of the press blade so as to holding the wire. Alternatively, the connector retaining bar is fixed to the apparatus by a frame and a transfer mechanism can carry the press-fitting unit along the bar in a horizontal direction. In addition, the apparatus may have a pair or two pairs of the upper and lower symmetrical press-fitting units; and the connector retaining bar is disposed between the upper and lower press-fitting units.Type: ApplicationFiled: August 2, 2001Publication date: January 17, 2002Applicant: YAZAKI CORPORATIONInventor: Kazuhiko Takada
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Patent number: 6336423Abstract: A film-forming apparatus is provided which comprises a reaction chamber capable of being vacuumed and having a reaction space in which a plurality of substrates can be arranged on a common circumference to establish an inner space circumscribed by the plurality of substrates. A film-forming raw material gas can be introduced into the inner space. A first electrode for supplying a high frequency power into the inner space is provided at a central position in the inner space circumscribed by the plurality of substrates. A second electrode is provided outside the plurality of substrates arranged on the common circumference. A shielding member having a dielectric portion constituted by a dielectric material is provided between the second electrode and the plurality of substrates arranged on the common circumference.Type: GrantFiled: July 9, 1998Date of Patent: January 8, 2002Assignee: Canon Kabushiki KaishaInventors: Ryuji Okamura, Toshiyasu Shirasuna, Kazuhiko Takada, Kazuyoshi Akiyama, Hitoshi Murayama
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Publication number: 20010049066Abstract: The present invention provides a method for efficiently cleaning a cleaning subject, especially a method for cleaning an electrophotographic photosensitive member that enables a uniform and high quality image to be obtained without leaving image defects and irregular images, wherein the cleaning step of the cleaning subject comprises: making the circulation flow rate during dipping of a cleaning subject in the cleaning solution to be different from the circulation flow rate when the cleaning subject is pulled up; and showering the cleaning solution used in the cleaning step during the pull-up step on the surface of the cleaning subject; or wherein the method for manufacturing an electrophotographic photosensitive member for depositing a functional film by a plasma CVD method on an aluminum substrate containing silicon, iron and aluminum especially comprises cleaning steps of: degreasing oil components on the surface of the substrate prior to deposition of a film; making the circulation flow rate during dippinType: ApplicationFiled: June 4, 2001Publication date: December 6, 2001Inventors: Hiroyuki Katagiri, Yoshio Segi, Hideaki Matsuoka, Kazuhiko Takada
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Patent number: 6321759Abstract: A cleaning method for an electrophotographic photosensitive member that eliminate corrosion and cleaning irregularities of a substrate during cleaning, and a method of producing an electrophotographic photosensitive member which is easy to operate and capable of stably forming the photosensitive member at a low cost, in a high yield, and at a high speed. The cleaning method is a water-based cleaning method of cleaning a cylindrical substrate for an electrophotographic photosensitive member, using at least one selected from the group consisting of pure water, pure water having dissolved carbon dioxide, and pure water containing a surface active agent, wherein the cylindrical substrate is cleaned by a cleaning liquid ejected from a plurality of nozzles, and wherein those surfaces of the cleaning liquid ejected from the respective nozzles which are in contact with a surface of the cylindrical substrate do not interfere with each other, and the cleaning apparatus is arranged to carry out the cleaning method.Type: GrantFiled: December 22, 1998Date of Patent: November 27, 2001Assignee: Canon Kabushiki KaishaInventors: Ryuji Okamura, Toshiyasu Shirasuna, Kazuhiko Takada, Kazuyoshi Akiyama, Hitoshi Murayama, Kazuto Hosoi
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Patent number: 6318382Abstract: A method for efficiently cleaning a cleaning subject, especially a method for cleaning an electrophotographic photosensitive member enables a uniform and high quality image to be obtained without leaving image defects and irregular images. The method includes a cleaning step during which the circulation flow rate during dipping of the cleaning subject in a cleaning solution is different from the circulation flow rate when the cleaning subject is pulled up, and where the cleaning solution is showered on the surface of the cleaning subject when it is pulled up. The cleaning method may be used in a method for manufacturing an electrophotographic photosensitive member for depositing a functional film by a plasma CVD method on a substrate.Type: GrantFiled: December 20, 1999Date of Patent: November 20, 2001Assignee: Canon Kabushiki KaishaInventors: Hiroyuki Katagiri, Yoshio Segi, Hideaki Matsuoka, Kazuhiko Takada
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Publication number: 20010029664Abstract: A terminal mounting apparatus inserts press-fit terminals into a terminal housing for constituting a joint connector. The terminal mounting apparatus has a terminal positioning unit, a transfer unit, a carrier cutting unit, a tab bending unit, a separator, and an insertion unit. The terminal positioning unit adjusts spaces between adjacent ones of the terminals such that each of the terminals can enter one of the terminal insertion channels. The transfer unit transfers the terminals. The carrier cutting unit removes a desired joint portion jointing the terminals. The tab bending unit brings a desired contact tab, which can connect an upper one to a lower one of the terminals, into a connection state. The separator adjusts spaces between the terminals to correspond to spaces between terminal insertion channels. The insertion unit presses the terminals all at once into the terminal insertion channels.Type: ApplicationFiled: April 4, 2001Publication date: October 18, 2001Applicant: Yazaki Corporation,Inventor: Kazuhiko Takada
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Publication number: 20010028250Abstract: A conductivity testing method for a sub-harness and a sub-harness manufacturing apparatus are provided, which sub-harness manufacturing apparatus includes: a pair of connecting units each having a wire connecting portion, made of metal, vertically movable so as to connect one end of one of wires composing a sub-harness to one of terminals having a sheathing clamping portion and being arranged in a wire feeding direction; and a pair of transferring means to transfer the terminals in a direction perpendicular to the wire feeding direction so as to position each one of the terminals under each wire connecting portions, wherein a clamping punch portion to clamp the sheathing clamping portion is provided on the wire connecting portion of each of the pair of connecting units and a conductivity testing means to judge the one, having terminals on the respective ends thereof, of the wires being good or bad is arranged between the clamping punch portions of the pair of connecting units.Type: ApplicationFiled: April 5, 2001Publication date: October 11, 2001Applicant: Yazaki CorporationInventor: Kazuhiko Takada