Abstract: A semiconductor package includes: a carrier having an electrically insulative body and a first contact structure at a first side of the electrically insulative body; and a semiconductor die having a first pad attached to the first contact structure of the carrier, the first pad being at source or emitter potential. The first pad is spaced inward from an edge of the semiconductor die by a first distance. The semiconductor die has an edge termination region between the edge and the first pad. The first contact structure of the carrier is spaced inward from the edge of the semiconductor die by a second distance greater than the first distance such that an electric field that emanates from the edge termination region in a direction of the carrier during normal operation of the semiconductor die does not reach the first contact structure of the carrier. Methods of production are also provided.

Abstract: The present disclosure relates to methods, compositions, and kits for concentrating and purifying at least one target analyte from a clinical biological sample. In some embodiments, the methods involve one or more aqueous two-phase system (ATPS) compositions and at least one solid phase medium. Some embodiments provide a kit comprising one or more ATPS compositions, a binding buffer; and a solid phase medium. Other embodiments provide methods of treating cancers or infectious diseases in a patient in need thereof.

Abstract: A light emitting device having a die that includes a light source that generates light of a first wavelength and a layer of phosphor particles covering the die is disclosed. The phosphor particles convert a portion of the light of the first wavelength to light of a second wavelength. The light source can be fabricated by attaching the light source to a substrate, and converting the light source by applying a light converting layer that includes a volatile carrier material and particles of a phosphor that convert light of the first wavelength to light of the second wavelength over the light source. The volatile carrier material is then caused to evaporate leaving a layer of the phosphor particles over the light source. A binder material can be incorporated in the volatile carrier for binding the phosphor particles to one another after the volatile carrier material is evaporated.

Abstract: Embodiments of the present invention include a light emitting diode package comprising a ceramic cavity comprising a substrate for mounting a light emitting diode and substantially vertical sidewalls for reducing light leakage. The ceramic LED package further includes a metallic coating on a portion of the ceramic substrate for reflecting light in a predetermined direction.

Abstract: A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive interconnecting elements.

Abstract: A tubular light source having a semiconductor light source and a tube is disclosed. The tube includes a transparent medium, the tube having a side tube surface, a center curve, one end surface, a length, and a maximum cross-sectional dimension. The tube includes scattering centers that cause light traveling in the tube to be reflected at angles such that the reflected light leaves the tube through the side tube surface. The semiconductor light source is positioned to emit light into the tube within a cone of angles such that the light will not leave the side tube surface in the absence of the scattering centers. The scattering centers can be dispersed in the transparent medium or located on the side tube surface. The transparent medium can be rigid or flexible.

Abstract: A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has first and second sections, the first section including a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is mounted in the chip mounting area and is in thermal contact with the chip mounting area. The encapsulating layer has top, bottom, and first and second side surfaces. The first extension is bent to provide a first heat path from the chip mounting area to the bottom surface. The heat path connects the heat chip mounting area to the bottom surface without passing through the first and second side surfaces and provides a heat path that has less thermal resistance than the heat path through either the lateral portion or the second section.

Abstract: A light source that is both thermally and spatially efficient can be achieved by attaching a light source, such as an LED chip, to a flexible circuit and positioning a light conductive material around the light source. For one embodiment, a cavity is created around the light source such that the light conductive material, for example, clear silicone, can be positioned within the cavity. In one embodiment, the cavity is created by a housing, such as a premolded plastic housing, secured to the flexible circuit. In one embodiment, a lens can be secured to the device to form the light.

Abstract: In one embodiment, a light source is attached to a first side of a flexible printed circuit; and the flexible printed circuit is conformed to at least part of a heat sink. A cross-section of the heat sink has surfaces facing in different directions, and conforming the flexible printed circuit to the at least part of the heat sink causes a second side of the flexible printed circuit, opposite the first side, to contact ones of the surfaces of the heat sink facing in at least two different directions. Also disclosed are various apparatus that include a heat sink, a flexible printed circuit conformed to the heat sink, and a light source attached to the flexible printed circuit.

Abstract: A device and method for producing an enhanced color image of a scene of interest captures a grayscale image of the scene of interest using a flash of infrared light and a color image of the scene of interest without using any flash of infrared light. The grayscale information from the grayscale image and the visible color information from the color image are combined to produce the enhanced color image.

Abstract: A light emitting device has a light emitting diode (LED), a reflector cup, and one or more adjustment mechanisms to control the intensity profile of light emitted from the light emitting device. The reflector cup has a base and a sidewall extending outward from the base. A base adjustment mechanism controls the total amount of light reflected from the base and into the beam of light emitted from the light emitting mechanism by controlling the aggregate reflectivity of the base. A sidewall adjustment mechanism controls the angle of the sidewall relative to the base. A vertical adjustment mechanism vertically raises or lowers the LED relative to the base.

Abstract: A camera flash is disclosed for producing a warm light having a desired color temperature. In one embodiment, the flash has a xenon flash component producing a light with a spectrum having a color temperature at a higher Kelvin rating than the warm light, and a light emitting diode flash component producing a light with a spectrum having a color temperature at a lower Kelvin rating than the warm light. The color temperature of the light of the xenon flash component and the color temperature of the light of the light emitting diode flash component together produce the warm light having the desired color temperature.

Abstract: An omni-directional LED device is constructed such that light is prevented from exiting from the top of the LED device. In one embodiment, an opaque barrier is created and in some embodiments enhancement surfaces are created below the opaque barrier to increase lumen output from the device sides. In one embodiment, a reflecting structure is created to assist with horizontal light mixing. The horizontally mixed light is then redirected through a structure, such as an LED structure, to create a high lumen output, slender back-lighted display.

Abstract: An enhanced light output light emitting diode (LED) is constructed using a plurality of single domed LEDs with each dome acting as a lens. By packaging multiple LEDs, each with its own dome (lens), greater-light output can be achieved. In one embodiment, each individually domed LED is a single color and the mixed colors from the group of LEDs within a device yields white light output. In another embodiment, the phosphors within each dome are mixed to produce white light. Reflectors can be added to enhance light output.

Abstract: A pointing device having an illumination system, an imaging array, and a controller is disclosed. The illumination system illuminates a surface over which the pointing device moves, the illumination system generating a light signal having first and second spectral regions. A portion of the light signal is viewable by a user of the pointing device. The first spectral region includes visible light of a predetermined color and the second spectral region includes infrared light. The imaging array records a plurality of images of the illuminated surface and is sensitive to light in the second spectral region. The second spectral region can be chosen to match the sensitivity of a silicon imaging array, while the first spectral region provides a decorative glow that is seen by the user.

Abstract: A virtual display with motion synchronization (“VDMS”) device using one or more arrays of light sources for displaying messages. The VDMS device may include a motion sensor to detect and measure movement of the VDMS device, and synchronization circuitry configured to synchronize the light emission of the individual light sources in the arrays with the movement of the VDMS device. The VDMS device may also include a self-contained power source and a control unit and interface that allow the user to program the messages that are displayed by the VDMS device, as well as memory that stores user messages.

Abstract: A lighting source capable of producing white light using a semiconductor radiation source. The semiconductor radiation source may be an ultraviolet (“UV”) light emitting diode (“LED”) device that emits light at a short wavelength, e.g., near-violet or ultraviolet light. A thin film of phosphor may be deposited or coated on the surface of the UV LED or positioned directly above the UV LED. The lighting source may also include an UV reflector radiationally coupled to the thin phosphor layer that allows visible white light emitted from the thin phosphor to pass through and reflects shorter wavelength light back to the thin phosphor layer.

Abstract: An imaging device and method for producing a flash of light utilizes pulsing of one or more color lights, e.g., red, green and blue lights, emitted from light sources to produce the flash of light. The light sources may include light emitting diode dies configured to generate different color lights.

Abstract: An electronic flash, imaging device and method for producing flashes of light uses a diffractive optical element to produce a flash of light having a rectangular radiation pattern. The diffractive optical element is configured to diffract light emitted from a light source such that the radiation pattern of the light emitted from the diffractive optical element is rectangular to produce the rectangular flash of light.

Abstract: A light source and method for making the same are disclosed. The light source includes a plurality of LEDs mounted on a substrate and a sensor for measuring light from the LEDs. Each LED emits light having a different spectrum from the other LEDs, the average intensity of light from that LED being determined by a drive signal coupled to that LED. The sensor generates a plurality of signals, each signal being characterized by a sensor value that is proportional to the intensity of light emitted by a corresponding one of the LEDs. A controller generates the drive signals and stores a current target value for each LED. The drive signals for each of the LEDs is generated such that the sensor value for that LED matches the stored current target value for that LED.