Abstract: A light source and method for controlling the same is disclosed. The light source includes a first component light source that includes N LEDs, a photo-detector, and a light redirector, where N>1. Each LED has a light emitting chip in a package. The light emitting chip emits light in a forward direction and light in a side direction. The light generated in the forward direction is determined by a drive signal coupled to that LED. A portion of the light in the side direction leaves the package. The light redirector is positioned such that a portion of the light in the side direction that leaves the package of each of the LEDs is scattered onto the photo-detector. The photo-detector generates N intensity signals, each intensity signal having an amplitude related to the intensity of the light emitted in the side direction by a corresponding one of the LEDs.

Abstract: A circuit element having a heat-conducting body having top and bottom surfaces, and a die having an electronic circuit thereon is disclosed. The die includes first and second contact points for powering the electronic circuit. The die is in thermal contact with the heat-conducting body, the die having a bottom surface that is smaller than the top surface of the heat-conducting body. The first contact point on the die is connected to a first trace bonded to the top surface of the heat-conducting body. An encapsulating cap covers the die. The first trace has a first portion that extends outside of the encapsulating cap and a second portion that is covered by the encapsulating cap. The heat-conducting body is preferably constructed from copper or aluminum and includes a cavity having an opening on the first surface in which the die is mounted. The die preferably includes a light-emitting device.

Abstract: A light emitting device assembly comprises a light emitting diode (LED) chip, a substrate with two terminals, at least one encapsulation layer, and a thermally conductive adhesive to connect the LED chip and the substrate. The first terminal of the substrate is comprised of a portion with a width at least as wide as the LED chip and a vertical cross-sectional area of at least 30% of the total vertical cross-sectional area of the encapsulated assembly, and a straight element. The enlarged first terminal portion provides more area for heat dissipation and conduction, and along with the thermally conductive adhesive and the encapsulation package, provide enhanced thermal conductivity.

Abstract: A method for fabrication of a light source and the light source fabricated by that method are disclosed. The light source is fabricated by mounting a chip having a primary light source on a substrate, the primary light source emitting light of a first wavelength. The chip is connected to power terminals on the substrate for powering the primary light source. A preformed transparent cap of constant thickness is mounted over the chip. The cap includes a wavelength converting material for converting a portion of the light of the first wavelength to a second wavelength. The primary light source is preferably an LED or laser diode. In one embodiment, the cap includes a phosphor that is suspended in a clear compound. In another embodiment, the cap includes a planar sheet of a single crystal phosphor.

Abstract: Improved LED die mount. By mounting an LED die on a pedestal which is smaller than the LED die, formation of fillets of die mount material which would block some of the light from the LED die are reduced or eliminated.