Abstract: An oscillator includes a board having a first surface, and provided with a housing section opening on the first surface, a resonator including a resonator element and a resonator package configured to house the resonator element, a heat generator attached to the resonator, electrically connected to the resonator package, and disposed inside the housing section, and a plurality of lead terminals connected to the board, and configured to support the resonator.

Abstract: A planar antenna includes a multilayer ceramic body 10 having an upper surface and a lower surface, and including a plurality of ceramic layers stacked together, at least one radiation conductor 31 positioned at one of interfaces between the plurality of ceramic layers in the multilayer ceramic body or on the upper surface of the multilayer ceramic body, a ground conductor 32 positioned at another one of the interfaces between the plurality of ceramic layers in the multilayer ceramic body or on the lower surface of the multilayer ceramic body, and a low-dielectric-constant region 115 positioned in the multilayer ceramic body between the radiation conductor and the ground conductor, and having a plurality of hollow portions.

Abstract: A buffer circuit includes a first MOSFET including a first source electrode, a first gate electrode, and a first drain electrode, and a second MOSFET, which includes a second source electrode, a second gate electrode, and a second drain electrode, and is same in polarity as the first MOSFET, and the first gate electrode and the second gate electrode are electrically connected to each other.

Abstract: A planar antenna includes: a multilayer ceramic structure 10 having an upper surface and a lower surface and including a plurality of ceramic layers stacked with each other; at least one radiation conductor 31 located at one of interfaces between the ceramic layers 10; and a ground conductor 32 located on the lower surface of the multilayer ceramic structure or at one of the interfaces between the ceramic layers that is on a lower surface side of the radiation conductor.

Abstract: A multilayer ceramic substrate includes: a plurality of ceramic layers 300a, 300b stacked together; a via hole 400a, 400b provided in each of the plurality of ceramic layers, the via holes of the plurality of ceramic layers being connected together in a layer stacking direction of the plurality of ceramic layers; a via wire 406a, 406b including an electrical conductor filled into each of the via holes; a first conductor 404a, 404b provided on an upper surface of at least one of the plurality of ceramic layers, the first conductor having an annular or partially annular shape surrounding the via wire; and a second conductor 403a, 403b including a first portion and a second portion, the first portion being located outside the first conductor on the upper surface of the at least one ceramic layer, the second portion overlying the first conductor, and an inner rim of the second portion being located outside an inner rim of the first conductor, wherein a thickness of the first conductor 404a, 404b is greater than a

Abstract: A high toughness and high tensile strength thick steel plate has a plate thickness of 100 mm or more, wherein a reduction of area in a center of the plate thickness by tension in a plate thickness direction is 40% or more. Thus, a high tensile strength thick steel plate with excellent strength and toughness in a center of the plate thickness can be obtained with no need for a larger production line, even in the case of producing a high strength thick steel plate for which the addition amount of alloying element needs to be increased.

Abstract: An abrasion-resistant steel plate that can achieve both gas cutting cracking resistance and abrasion resistance at low cost is provided. An abrasion-resistant steel plate comprises: a chemical composition containing, in mass %, C: more than 0.34% and 0.50% or less, Si: 0.01% to 1.0%, Mn: 0.30% to 2.00%, P: 0.015% or less, S: 0.005% or less, Cr: 0.01% to 2.00%, Al: 0.001% to 0.100%, N: 0.01% or less, and a balance consisting of Fe and inevitable impurities; and a microstructure in which a volume fraction of martensite at a depth of 1 mm from a surface of the abrasion-resistant steel plate is 90% or more, and a prior austenite grain size at the mid-thickness of the abrasion-resistant steel plate is 80 ?m or less, wherein hardness at a depth of 1 mm from the surface of the abrasion-resistant steel plate is 560 HBW 10/3000 or more in Brinell hardness, and a concentration [Mn] of Mn in mass % and a concentration [P] of P in mass % in a plate thickness central segregation area satisfy 0.04[Mn]+[P]<0.45.

Abstract: A semiconductor power module including an insulating substrate having one surface and another surface, an output side terminal arranged at a one surface side of the insulating substrate, a first power supply terminal arranged at the one surface side of the insulating substrate, a second power supply terminal to which a voltage of a magnitude different from a voltage applied to the first power supply terminal is to be applied, and arranged at another surface side of the insulating substrate so as to face the first power supply terminal across the insulating substrate, a first switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the first power supply terminal, and a second switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the second power supply terminal.

Abstract: Provided are: an FRP sheet press molding method and device whereby yield can be improved without opening/closing adjustment of a mold after mold clamping; and an FRP molded article. The FRP sheet press molding method, whereby a press-molded article PM is molded using a fiber-reinforced plastic sheet material SM, comprises: a press step in which molds 2, 3 are closed and the heated sheet material SM is press-molded inside a cavity 5; and a filling step in which the closed state of the molds 2, 3 is maintained from the press step, a molten resin MP is pressure-injected into a gap IS that occurs between the sheet material SM and the cavity 5, and a surface of the sheet material SM and a surface of the molten resin MP are caused to come in contact with the cavity 5.

Abstract: A planar array antenna includes: a radiation section 51 including a plurality of radiation conductors 30 and a first ground conductor layer 20, and a power supply section 52 including a plurality of strip conductors 10 and a second ground conductor layer 60, wherein the strip conductors 10 are arranged so as to correspond to the radiation conductors 30 between the first ground conductor layer 20 and the second ground conductor layer 60; and the first ground conductor layer 20 is located between the radiation conductors 30 and the corresponding strip conductors 10, and includes a plurality of slots 21 extending in a direction that crosses a direction in which the strip conductor 10 extends and a groove or at least one aperture 22 located between adjacent two of the slots 21.

Abstract: An oscillator includes an oscillation circuit, an operation state signal generation circuit that generates an operation state signal based on an operation state of the oscillation circuit, and a first integrated circuit, the oscillation circuit and the operation state signal generation circuit are disposed outside the first integrated circuit, and the first integrated circuit includes a first digital interface circuit, a D/A conversion circuit that converts a digital signal input via the first digital interface circuit into an analog signal to generate a frequency control signal that controls a frequency of the oscillation circuit, and a terminal to which the operation state signal is input.

Abstract: In order to address the problem in that, by increasing the gate resistance of a power semiconductor element, while variation of switching time can be controlled, loss due to the gate resistance becomes larger and power efficiency for the entire system is lowered, the present invention provides an insulating substrate capable of uniformizing switching speeds of circuit elements while suppressing influence on power efficiency of the circuit elements. In the insulating substrate according to the present invention, part of a wiring layer is formed as a control signal circuit layer, and part of the control signal circuit layer is formed as a resistance layer that increases input resistance when the circuit element receives a control signal.

Abstract: An abrasion-resistant steel plate comprises: a specific chemical composition; and a microstructure in which a volume fraction of martensite at a depth of 1 mm from a surface of the abrasion-resistant steel plate is 90% or more, and a prior austenite grain size in a plate thickness central part at the mid-thickness of the abrasion-resistant steel plate is 80 ?m or less, wherein hardness at a depth of 1 mm from the surface of the abrasion-resistant steel plate is 460 to 590 HBW 10/3000 in Brinell hardness, and a concentration [Mn] of Mn in mass % and a concentration [P] of P in mass % in a plate thickness central segregation area satisfy 0.04[Mn]+[P]<0.50.

Abstract: Provided is a method for producing an optical film using simultaneous multilayer coating application, the method being capable of reducing the incidence of coating failure in an optical film. The present invention relates to a method for producing an optical film having at least two or more optical functional layers formed on a base material, the method including: a loss modulus checking step of checking the loss moduli of coating liquids capable of forming the respective optical functional layers by measuring dynamic viscoelasticity; and a coating application step of performing simultaneous multilayer coating application of the coating liquids capable of forming the respective optical functional layers on the base material.

Abstract: A suction pressure casting method uses a casting device that includes a holding furnace for accumulating molten metal, a metal mold and a core forming a cavity, a molten-metal pressurizing tank that supplies a pressurizing gas, and a suction and exhaust tank for sucking and exhausting the inside of the cavity. A preset decompression pattern of a casting process is compared with a measured pressure pattern of the cavity and the core that is measured during actual casting. A corrected decompression pattern is calculated based on a difference therebetween. The preset decompression pattern at the time of the next casting is then corrected by using the corrected decompression pattern.

Abstract: A bag opening apparatus and a bag opening method capable of efficiently opening a bag body in a short period of time are provided. A bag opening apparatus includes a gap formation unit which bends at least a front wall portion, of the front wall portion and a back wall portion that constitute a mouth portion of a bag body, so as to form a gap. When a first press drive member presses a first holding unit against the front wall portion, a contact part of the first holding unit is swung against urging force of an urging part of the first holding unit to bend the front wall portion.

Abstract: A low-pressure casting device is provided with a holding furnace, a stoke, a pressure control device and a molten-metal level sensor. The holding furnace holds molten metal. The stoke supplies molten metal into a casting mold via a sprue. The pressure control device moves the molten metal in the stoke and fills the molten metal in the casting mold. The molten-metal level sensor detects a surface level of the molten-metal in the stoke. The stoke has a lower end immersed in the molten metal in the holding furnace. The low-pressure casting device is configured to correct filling of the molten metal in the casting mold in a next casting based on the height of the molten metal surface detected by the molten-metal level sensor.

Abstract: An abrasion-resistant steel plate comprises: a chemical composition containing, in mass %, C: 0.20% to 0.45%, Si: 0.01% to 1.0%, Mn: 0.3% to 2.5%, P: 0.020% or less, S: 0.01% or less, Cr: 0.01% to 2.0%, Ti: 0.10% to 1.00%, B: 0.0001% to 0.0100% , Al: 0.1% or less, N: 0.01% or less, and a balance consisting of Fe and inevitable impurities; and a microstructure in which a volume fraction of martensite is 90% or more, and a prior austenite grain size is 80 ?m or less, wherein a number density of TiC precipitate having a size of 0.5 ?m or more is 400 particles/mm2 or more, and a Mn content [Mn] and a P content [P] in a plate thickness central segregation area satisfy 0.04[Mn]+[P]<0.50.

Abstract: Provided are: an FRP sheet press molding method and device that are capable of improving production efficiency; and an FRP molded article. The FRP sheet press molding method, whereby a press-molded article PM is molded using a fiber-reinforced plastic sheet material SM1, comprises: a press step in which molds 2, 3 are closed and the heated sheet material SM1 is press-molded interior a cavity 5; and a filling step in which the closed state of the molds 2, 3 is maintained from the press step and a molten resin MP is pressure-injected from an injection section IP1 formed in one surface of the sheet material SM1, towards the interior IN1 of the sheet material SM1.

Abstract: An abrasion-resistant steel plate comprises: a specific chemical composition; and a microstructure in which a volume fraction of martensite at a depth of 1 mm from a surface of the abrasion-resistant steel plate is 90% or more, and a prior austenite grain size at the mid-thickness of the abrasion-resistant steel plate is 80 ?m or less, wherein hardness at a depth of 1 mm from the surface of the abrasion-resistant steel plate is 360 to 490 HBW 10/3000 in Brinell hardness, and a concentration [Mn] of Mn in mass % and a concentration [P] of P in mass % in a plate thickness central segregation area satisfy 0.04[Mn]+[P]<0.55.