Patents by Inventor Kenji Sakai
Kenji Sakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9226409Abstract: A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.Type: GrantFiled: March 29, 2013Date of Patent: December 29, 2015Assignee: IBIDEN CO., LTD.Inventors: Atsushi Ishida, Ryojiro Tominaga, Kenji Sakai
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Publication number: 20150300753Abstract: The present invention has a cooling tubing (8) that is wound around an outer surface (9S) of an object (9) to be cooled and cools the object. (9) to be cooled, by means of a cooling medium passed therethrough. The cooling tubing (8) is an angular tubing of which the cross-sectional shape is an angular tubular shape.Type: ApplicationFiled: July 1, 2013Publication date: October 22, 2015Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventor: Kenji SAKAI
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Patent number: 9167653Abstract: A power supply device includes a control circuit and a first circuit. The control circuit switches between a current control mode and a voltage control mode according to an inputted dimming signal and thus dims a light-emitting element. In the current control mode the control circuit controls an output current supplied to the light-emitting element to a target current, and in the voltage control mode the control circuit controls an output voltage supplied to the light-emitting element to a target voltage. The first circuit detects the output current and the output voltage, and sets the target voltage at which switching between the current control mode and the voltage control mode is carried out as a first voltage.Type: GrantFiled: March 14, 2013Date of Patent: October 20, 2015Assignee: Toshiba Lighting & Technology CorporationInventors: Koji Takahashi, Hiromichi Nakajima, Kenji Sakai, Hiroyuki Kudo, Hirokazu Otake, Hiroshi Terasaka, Kiyoteru Kosa, Yosuke Saito, Masatoshi Kumagai, Shinichiro Matsumoto, Hideo Kozuka, Kazuhiko Sato, Tatsuya Konishi
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Patent number: 9117730Abstract: A printed wiring board includes a core substrate, a first conductive pattern formed on the substrate, an insulation structure having a first insulation layer and formed on the substrate such that the first insulation layer covers the first pattern, a second conductive pattern formed on the structure, and a second insulation layer formed on the structure such that the second insulation layer covers the second pattern. The structure has a via conductor connecting the first and second patterns through the first insulation layer, the first insulation layer includes a first layer containing a reinforcing fiber material and a second layer formed on the first layer such that the first layer is on the substrate side and a second layer is on the second insulation layer side, and the second layer is made of an insulating material which is the same material as an insulating material forming the second insulation layer.Type: GrantFiled: October 31, 2012Date of Patent: August 25, 2015Assignee: IBIDEN Co., Ltd.Inventors: Ryojiro Tominaga, Kenji Sakai, Naoaki Fujii
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Publication number: 20150216050Abstract: A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a conductive circuit formed on the second surface of the resin insulation layer, and a via conductor formed in the opening and connecting the pad and the conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion.Type: ApplicationFiled: April 7, 2015Publication date: July 30, 2015Applicant: IBIDEN CO., LTD.Inventors: Satoru KAWAI, Kenji Sakai, Liyi Chen
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Patent number: 9072968Abstract: A game device includes an input position acquiring unit and a first game control unit. The input position acquiring unit acquires a position of an entry provided by a player to a touch panel, which can concurrently detect entries at multiple points. The first game control unit displays objects and a sequence in which the objects should be erased on a screen image, and, in case that a position of an entry acquired is at a position corresponding to a position where an object to be erased next is displayed, erases the object from the screen image. The first game control unit includes: a single tap input control unit that, when an input on one object is acknowledged, erases the object; and a multiple-graphic-symbol-tap input control unit that, when inputs on multiple objects are acknowledged concurrently, erases those objects.Type: GrantFiled: September 4, 2012Date of Patent: July 7, 2015Assignees: Sony Corporation, Sony Computer Entertainment Inc.Inventors: Kenji Sakai, Eiji Yamada, Katsuyuki Kanetaka
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Publication number: 20150136697Abstract: An oily water separator for removing oil from oil-containing water, including a vessel, a filtration membrane unit and a discharge mechanism; the filtration membrane unit containing a filtration membrane module and a returning mechanism, the filtration membrane module for performing filtration in the state of allowing the module to be immersed into the oil-containing water; the filtration membrane module having an elongated filtration membrane with an opening portion, the opening portion of the filtration membrane being fixed to one end of the filtration membrane module, the opening portion of the filtration membrane being communicatively connected to the returning mechanism; the returning mechanism being extended along the filtration membrane toward an end on a side opposite to an end portion having the opening portion thereof, the returning mechanism being communicatively connected with the discharge mechanism.Type: ApplicationFiled: November 14, 2014Publication date: May 21, 2015Inventors: Masaaki SAKURAI, Kenji SAKAI, Hidekiyo HARA, Kanako ABE, Takashi NOMURA
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Patent number: 9021692Abstract: A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a first via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a first conductive circuit formed on the second surface of the resin insulation layer, and a first via conductor formed in the opening and connecting the pad and the first conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion.Type: GrantFiled: November 29, 2011Date of Patent: May 5, 2015Assignee: Ibiden Co., Ltd.Inventors: Satoru Kawai, Kenji Sakai, Liyi Chen
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Patent number: 8976558Abstract: According to one embodiment, a power supply device includes a rectifying circuit configured to rectify an alternating-current power supply, a first capacitor configured to smooth a voltage after rectification, and a falling voltage chopper circuit configured to supply electric power to a load. The first capacitor is set to a capacity in which a section where a voltage after smoothing drops to an output voltage to the load is provided in a rectified half period of the alternating-current power supply. The falling voltage chopper circuit includes at least one switching element configured to receive an input of the voltage after smoothing, operate in a section where the voltage after smoothing exceeds the output voltage, and pause in a section of the output voltage and a second capacitor provided on an output side and having a capacity larger than the capacity of the first capacitor.Type: GrantFiled: March 16, 2012Date of Patent: March 10, 2015Assignee: Toshiba Lighting & Technology CorporationInventors: Go Kato, Takuro Hiramatsu, Kenji Sakai, Chikako Katano, Hiroshi Takenaga, Tomoaki Shimizu
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Publication number: 20150040390Abstract: A manufacturing method of laser diode unit of the present invention includes steps: placing a laser diode on top of a solder member formed on a mounting surface of a submount, applying a pressing load to the laser diode and pressing the laser diode against the solder member, next, melting the solder member by heating the solder member at a temperature higher than a melting point of the solder member while the pressing load is being applied, and thereafter, bonding the laser diode to the submount by cooling and solidifying the solder member, thereafter, removing the pressing load, and softening the solidified solder member by heating the solder member at a temperature lower than the melting point of the solder member after the pressing load has been removed, and thereafter cooling and re-solidifying the solder member.Type: ApplicationFiled: September 22, 2014Publication date: February 12, 2015Inventors: Koji SHIMAZAWA, Osamu SHINDO, Yoshihiro TSUCHIYA, Yasuhiro ITO, Kenji SAKAI
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Publication number: 20150036252Abstract: A semiconductor driving device includes a negative surge detection circuit and a level shifter circuit. The negative surge detection circuit detects whether the negative surge occurs at a connection point between a P-side SW element and N-side SW element. The level shifter circuit maintains a driving voltage used in driving the P-side SW element upon the negative surge detection circuit detecting occurrence of the negative surge.Type: ApplicationFiled: April 3, 2014Publication date: February 5, 2015Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Motoki IMANISHI, Kenji SAKAI, Takaki NAKASHIMA
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Publication number: 20150014157Abstract: The Li-containing transition metal oxide sintered compact of the present invention includes Li and a transition metal, and further includes Al, Si, Zr, Ca, and Y as impurity elements, of which contents are controlled to the following ranges: Al?90 ppm; Si?100 ppm; Zr?100 ppm; Ca?80 ppm; and Y?20 ppm, wherein the sintered compact has a relative density of 95% or higher and a specific resistance of lower than 2×107 ?cm. The present invention makes it possible to stably form Li-containing transition metal oxide thin films useful as the positive electrode thin films of secondary batteries or the like at a high deposition rate without causing abnormal discharge.Type: ApplicationFiled: March 19, 2013Publication date: January 15, 2015Applicants: KOBELCO RESEARCH INSTITUTE, INC., Toshima Manufacturing Co., Ltd.Inventors: Yuichi Taketomi, Yuki Tao, Moriyoshi Kanamaru, Kenji Sakai, Shuetsu Haseyama, Hideshi Kikuyama
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Patent number: 8866041Abstract: A manufacturing method of laser diode unit of the present invention includes steps: placing a laser diode on top of a solder member formed on a mounting surface of a submount, applying a pressing load to the laser diode and pressing the laser diode against the solder member, next, melting the solder member by heating the solder member at a temperature higher than a melting point of the solder member while the pressing load is being applied, and thereafter, bonding the laser diode to the submount by cooling and solidifying the solder member, thereafter, removing the pressing load, and softening the solidified solder member by heating the solder member at a temperature lower than the melting point of the solder member after the pressing load has been removed, and thereafter cooling and re-solidifying the solder member.Type: GrantFiled: April 12, 2012Date of Patent: October 21, 2014Assignees: TDK Corporation, Rohm Co., Ltd, SAE Magnetics (H.K.) Ltd.Inventors: Koji Shimazawa, Osamu Shindo, Yoshihiro Tsuchiya, Yasuhiro Ito, Kenji Sakai
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Patent number: 8815597Abstract: The present invention provides a baglike container for centrifugation that is mounted in a centrifuge to thereby allow centrifugation of a dispersion liquid accommodated therein. The baglike container for centrifugation is less likely to tear or break as a result of centrifugation by disposing a container wall surface of the baglike container so as to apply centrifugal force perpendicular to the container wall surface.Type: GrantFiled: August 23, 2007Date of Patent: August 26, 2014Assignee: Takara Bio Inc.Inventors: Hideto Chono, Junichi Mineno, Kazutoh Takesako, Takao Yoshida, Takashi Morimura, Kenji Sakai, Shin-ichi Yamada, Noritsugu Yabe, Yuko Taguchi
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Patent number: 8803561Abstract: A semiconductor circuit of the present invention comprises a capacitor for charging ON driven electric charges in response to an ON driving signal, a capacitor for charging OFF driven electric charges in response to an OFF driving signal, a signal generating circuit for generating a first trigger signal in response to the ON driving signal, a signal generating circuit for generating a second trigger signal in response to the OFF driving signal, a discharging circuit for discharging the ON driven electric charges in response to the second trigger signal, and a discharging circuit for discharging the OFF driven electric charges in response to the first trigger signal. With this configuration, it is possible to provide a semiconductor circuit and a semiconductor device both of which have a general-purpose malfunction prevention function by which a malfunction due to dV/dt can be prevented without being affected by any external factor.Type: GrantFiled: September 9, 2011Date of Patent: August 12, 2014Assignee: Mitsubishi Electric CorporationInventors: Motoki Imanishi, Kenji Sakai, Yoshikazu Tanaka, Kyouko Oyama
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Patent number: 8779830Abstract: A voltage conversion mask signal generation circuit generates a first main signal and a first mask signal by converting an output signal of the first transistor to a low-side voltage, and generating a second main signal and a second mask signal by converting an output signal of the second transistor to a low-side voltage. A mask signal generation circuit generating a third mask signal with higher sensitivity than the first and second mask signals with respect to a fluctuation in the high-side reference potential. A mask logical circuit generating a fourth mask signal by performing a AND operation between the first mask signal and the second mask signal, and masking the first and second main signals with the third and fourth mask signals; and a SR flip flop circuit generating the output signal from the masked first and second main signals.Type: GrantFiled: March 13, 2013Date of Patent: July 15, 2014Assignee: Mitsubishi Electric CorporationInventors: Takaki Nakashima, Motoki Imanishi, Kenji Sakai
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Patent number: 8724357Abstract: A power semiconductor device comprises: high side and low side switching elements; high side and low side drive circuits; a bootstrap capacitor supplying a drive voltage to the high side drive circuit and having a first terminal connected to a connection point between the high side switching element and the low side switching element and a second terminal connected to a power supply terminal of the high side drive circuit; a bootstrap diode having an anode connected to a power supply and a cathode connected to the second terminal and supplying a current from the power supply to the second terminal; a floating power supply; and a bootstrap compensation circuit supplying a current from the floating power supply to the second terminal, when the high side drive circuit turns ON the high side switching element and the low side drive circuit turns OFF the low side switching element.Type: GrantFiled: January 20, 2011Date of Patent: May 13, 2014Assignee: Mitsubishi Electric CorporationInventors: Motoki Imanishi, Kenji Sakai, Yoshikazu Tanaka
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Patent number: 8686300Abstract: A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a first via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a first conductive circuit formed on the second surface of the resin insulation layer, and a first via conductor formed in the opening and connecting the pad and the first conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion.Type: GrantFiled: October 27, 2009Date of Patent: April 1, 2014Assignee: Ibiden Co., Ltd.Inventors: Satoru Kawai, Kenji Sakai, Liyi Chen
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Publication number: 20140084813Abstract: A power supply device includes a control circuit and a first circuit. The control circuit switches between a current control mode and a voltage control mode according to an inputted dimming signal and thus dims a light-emitting element. In the current control mode the control circuit controls an output current supplied to the light-emitting element to a target current, and in the voltage control mode the control circuit controls an output voltage supplied to the light-emitting element to a target voltage. The first circuit detects the output current and the output voltage, and sets the target voltage at which switching between the current control mode and the voltage control mode is carried out as a first voltage.Type: ApplicationFiled: March 14, 2013Publication date: March 27, 2014Inventors: Koji TAKAHASHI, Hiromichi Nakajima, Kenji Sakai, Hiroyuki Kudo, Hirokazu Otake, Hiroshi Terasaka, Kiyoteru Kosa, Yosuke Saito, Masatoshi Kumagai, Shinichiro Matsumoto, Hideo Kozuka, Kazuhiko Sato, Tatsuya Konishi
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Publication number: 20140062571Abstract: A voltage conversion mask signal generation circuit generates a first main signal and a first mask signal by converting an output signal of the first transistor to a low-side voltage, and generating a second main signal and a second mask signal by converting an output signal of the second transistor to a low-side voltage. A mask signal generation circuit generating a third mask signal with higher sensitivity than the first and second mask signals with respect to a fluctuation in the high-side reference potential. A mask logical circuit generating a fourth mask signal by performing a AND operation between the first mask signal and the second mask signal, and masking the first and second main signals with the third and fourth mask signals; and a SR flip flop circuit generating the output signal from the masked first and second main signals.Type: ApplicationFiled: March 13, 2013Publication date: March 6, 2014Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Takaki NAKASHIMA, Motoki IMANISHI, Kenji SAKAI