Abstract: The present invention provides a method for the isolation of nucleic acid from microbial cells in an environmental sample. The method includes preparing a suspension of the environmental sample, lysing the suspended sample with a buffered solution, adding sodium dodecylsulfate solution to the lysed suspended sample, carrying out solvent extraction and separation to obtain an aqueous phase, reacting the aqueous phase with solvents to generate an insoluble precipitate containing nucleic acid, and isolating the nucleic acid therefrom, thereby releasing high molecular weight nucleic acid pellets from the cells.

Abstract: A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.

Abstract: According to one embodiment, a first control section controls a power supply voltage converting circuit and, if an abnormality detecting section detects an abnormality of a load, controls an output of the power supply voltage converting circuit to be stopped or reduced. A second control section gives a command to the first control section and, if the abnormality detecting section detects the abnormality of the load, controls the first control section to stop or reduce the output of the power supply voltage converting circuit.

Abstract: A manufacturing method of laser diode unit of the present invention includes steps: placing a laser diode on top of a solder member formed on a mounting surface of a submount, applying a pressing load to the laser diode and pressing the laser diode against the solder member, next, melting the solder member by heating the solder member at a temperature higher than a melting point of the solder member while the pressing load is being applied, and thereafter, bonding the laser diode to the submount by cooling and solidifying the solder member, thereafter, removing the pressing load, and softening the solidified solder member by heating the solder member at a temperature lower than the melting point of the solder member after the pressing load has been removed, and thereafter cooling and re-solidifying the solder member.

Abstract: A wiring board includes a substrate having first and second surfaces, a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second hole, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, a first conductive portion on one end of the second hole, and a second conductive portion on the opposite end of the second penetrating hole. The first conductor is connecting the first circuit and the second circuit. The second conductor is made of a conductive material filled in the second hole and is connecting the first conductive portion and the second conductive portion.

Abstract: A printed wiring board includes a core substrate, a first conductive pattern formed on the substrate, an insulation structure having a first insulation layer and formed on the substrate such that the first insulation layer covers the first pattern, a second conductive pattern formed on the structure, and a second insulation layer formed on the structure such that the second insulation layer covers the second pattern. The structure has a via conductor connecting the first and second patterns through the first insulation layer, the first insulation layer includes a first layer containing a reinforcing fiber material and a second layer formed on the first layer such that the first layer is on the substrate side and a second layer is on the second insulation layer side, and the second layer is made of an insulating material which is the same material as an insulating material forming the second insulation layer.

Abstract: There is provided a radial flow reactor having a multi-pass structure in which loading and unloading of granular packing are easy and which does not impair the reaction performance. The reactor includes, in an upright tubular reactor vessel: a packing region for housing a continuous packed bed of granular packing; and an outer and an inner passages disposed outside and inside the packing region, respectively, allowing a fluid to flow in the axial direction. The reactor is configured so that the fluid can pass between the packing region and the outer passage and between the packing region and the inner passage.

Abstract: A method for manufacturing a printed wiring board including preparing a carrier, forming a metal layer on the carrier, forming an etching resist on the metal layer, forming a metal film from the metal layer underneath the resist by removing portion of the metal layer exposed through the resist and part of the metal layer contiguous to the portion of the metal layer and underneath the resist, forming a coating layer on side surface of the film and the carrier, forming a pad on the coating layer, removing the resist, forming a resin insulation layer on the film and surface of the pad, forming an opening reaching the surface of the pad in the insulation layer, forming a conductive circuit on the insulation layer, forming a via conductor connecting the circuit and the pad in the opening, removing the carrier from the film and coating layer, and removing the film.

Abstract: A game device includes an input position acquiring unit and a first game control unit. The input position acquiring unit acquires a position of an entry provided by a player to a touch panel, which can concurrently detect entries at multiple points. The first game control unit displays objects and a sequence in which the objects should be erased on a screen image, and, in case that a position of an entry acquired is at a position corresponding to a position where an object to be erased next is displayed, erases the object from the screen image. The first game control unit includes: a single tap input control unit that, when an input on one object is acknowledged, erases the object; and a multiple-graphic-symbol-tap input control unit that, when inputs on multiple objects are acknowledged concurrently, erases those objects.

Abstract: According to one embodiment, a power supply device includes a rectifying circuit configured to rectify an alternating-current power supply, a first capacitor configured to smooth a voltage after rectification, and a falling voltage chopper circuit configured to supply electric power to a load. The first capacitor is set to a capacity in which a section where a voltage after smoothing drops to an output voltage to the load is provided in a rectified half period of the alternating-current power supply. The falling voltage chopper circuit includes at least one switching element configured to receive an input of the voltage after smoothing, operate in a section where the voltage after smoothing exceeds the output voltage, and pause in a section of the output voltage and a second capacitor provided on an output side and having a capacity larger than the capacity of the first capacitor.

Abstract: This invention provides a hollow fiber membrane module which can reduce pressure loss in discharging water within a module and can reduce operating power. A hollow fiber membrane bundle is disposed within a cylindrical case having in its side face an opening part for the inflow/outflow of water, and the end of the hollow fiber membrane bundle is bonded at an axially outer position with respect to the opening for the inflow/outflow of water. A distribution holes is provided axially inward of the opening for the inflow/outflow of water and so as to surround the outer periphery of the hollow fiber membrane bundle, and grooves and/or corrugated protrusions are provided on the inner face of the distribution cylinder so as to be in communication with each other among the distribution holes.

Abstract: A semiconductor circuit of the present invention comprises a capacitor for charging ON driven electric charges in response to an ON driving signal, a capacitor for charging OFF driven electric charges in response to an OFF driving signal, a signal generating circuit for generating a first trigger signal in response to the ON driving signal, a signal generating circuit for generating a second trigger signal in response to the OFF driving signal, a discharging circuit for discharging the ON driven electric charges in response to the second trigger signal, and a discharging circuit for discharging the OFF driven electric charges in response to the first trigger signal. With this configuration, it is possible to provide a semiconductor circuit and a semiconductor device both of which have a general-purpose malfunction prevention function by which a malfunction due to dV/dt can be prevented without being affected by any external factor.

Abstract: A printed wiring board and a method for manufacturing the same are provided. The printed wiring board includes a resin insulation layer having a first surface and a second surface opposite the first surface, and includes an opening for a first via conductor. An electronic-component mounting pad is formed on the first surface of the resin insulation layer. The electronic-component mounting pad includes a portion embedded in the resin insulation layer and a portion protruding from the resin insulation layer. The protruding portion covers the embedded portion and a portion of the first surface of the resin insulation layer that surrounds the embedded portion. A first conductive circuit is formed on the second surface of the resin insulation layer. A first via conductor is formed in the opening of the resin insulation layer and connects the electronic-component mounting pad and the first conductive circuit.

Abstract: In a camera module 1 of the present invention, a mechanical shutter 2 is provided above a top surface of a lens unit 3, and a protrusion section formed to an end of a lens 31 is held in a depression section formed on a back surface of the mechanical shutter 2. With the arrangement, it is possible to cause the camera module 1 employing the mechanical shutter 2 to be smaller and thinner at the same time.

Abstract: A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a first via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a first conductive circuit formed on the second surface of the resin insulation layer, and a first via conductor formed in the opening and connecting the pad and the first conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion.

Abstract: A method for manufacturing a printed wiring board including preparing a carrier, forming a metal layer on the carrier, forming an etching resist on the metal layer, forming a metal film from the metal layer underneath the resist by removing portion of the metal layer exposed through the resist and part of the metal layer contiguous to the portion of the metal layer and underneath the resist, forming a coating layer on side surface of the film and the carrier, forming a pad on the coating layer, removing the resist, forming a resin insulation layer on the film and surface of the pad, forming an opening reaching the surface of the pad in the insulation layer, forming a conductive circuit on the insulation layer, forming a via conductor connecting the circuit and the pad in the opening, removing the carrier from the film and coating layer, and removing the film.

Abstract: A sun-and-planet speed-up gear includes a low-speed-stage sun-and-planet gearing and a high-speed-stage sun-and-planet gearing, in which an input shaft is connected to a low-speed-stage ring gear, the position of a shaft of a low-speed-stage planet gear is secured, a shaft of a low-speed-stage sun gear is connected to a high-speed-stage carrier, and an output shaft is connected to a high-speed-stage sun gear. In order to automatically center the low-speed-stage sun gear to prevent damage to gears and a bearing, a flange formed at a tip of the shaft of the low-speed-stage sun gear and a flange formed at a tip of a coupling that is directly attached to the high-speed-stage carrier or that is formed on the high-speed-stage carrier are coupled via a sleeve.

Abstract: A power semiconductor device comprises: high side and low side switching elements; high side and low side drive circuits; a bootstrap capacitor supplying a drive voltage to the high side drive circuit and having a first terminal connected to a connection point between the high side switching element and the low side switching element and a second terminal connected to a power supply terminal of the high side drive circuit; a bootstrap diode having an anode connected to a power supply and a cathode connected to the second terminal and supplying a current from the power supply to the second terminal; a floating power supply; and a bootstrap compensation circuit supplying a current from the floating power supply to the second terminal, when the high side drive circuit turns ON the high side switching element and the low side drive circuit turns OFF the low side switching element.

Abstract: There is provided a radial flow reactor having a multi-pass structure in which loading and unloading of granular packing are easy and which does not impair the reaction performance. The reactor includes, in an upright tubular reactor vessel: a packing region for housing a continuous packed bed of granular packing; and an outer and an inner passages disposed outside and inside the packing region, respectively, allowing a fluid to flow in the axial direction. The reactor is configured so that the fluid can pass between the packing region and the outer passage and between the packing region and the inner passage. The reactor further includes at least one of an outer partition structure and an inner partition structure.

Abstract: A wiring board includes a substrate having first and second surfaces, a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second hole, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, a first conductive portion on one end of the second hole, and a second conductive portion on the opposite end of the second penetrating hole. The first conductor is connecting the first circuit and the second circuit. The second conductor is made of a conductive material filled in the second hole and is connecting the first conductive portion and the second conductive portion.