Abstract: A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.

Abstract: A printed wiring board includes a substrate having a first surface and a second surface on the opposite side of the first surface and multiple first penetrating holes, a first conductive portion formed on the first surface of the substrate and made of a first plated cover layer, a second conductive portion formed on the second surface of the substrate and made of a second plated cover layer, the second conductive portion being positioned opposite the first conductive portion, and multiple first through-hole conductors made of conductors formed in the multiple first penetrating holes, respectively, the multiple first through-hole conductors connecting the first conductive portion and the second conductive portion. The first conductive portion, the second conductive portion and the first through-hole conductors form a first through-hole connection section which sets up either a power-source through-hole conductor or a ground through-hole conductor.

Abstract: A game device comprising: a roll control unit or a slide control unit operative to allow a character to move on a game field; a jump control unit operative, upon receiving an input operation for allowing the character to jump while the first requirement is satisfied, to allow the character to jump and to change a mode of a game to a special mode where a reward is given to a player; an acceleration control unit operative, upon receiving an input operation for accelerating the character while the second requirement is satisfied, to accelerate the character and to change a mode of a game to a special mode where a reward is given to a player; a combo control unit operative, if no input operation for all owing the character to jump is received while the first requirement is satisfied and no input operation for accelerating the character is received while the second requirement is satisfied, to terminate the special mode and to give a reward to a player in the special mode.

Abstract: A planetary gear system contains: a sun gear as an input; a fixed ring gear; a planetary career as an output, a first planetary gear supported by the planetary career and engaging the sun gear; and a second planetary gear supported by the planetary career and engaging the ring gear. A first spin axis of the first planetary gear is arranged closer to a planetary career rotation axis of the planetary career than a second spin axis of the second planetary gear. Torque is transmitted from the first planetary gear to the second planetary gear.

Abstract: A planetary gear system contains: a sun gear as an input; a fixed ring gear; a planetary career as an output; and a planetary gear unit supported by the planetary career. The planetary gear unit includes: a shaft; a first planetary gear coupled to the shaft and engaging the sun gear; and a second planetary gear coupled to the shaft and engaging the ring gear. The planetary gear unit rotates around a first rotation axis with respect to the planetary career. The planetary career rotates around a second rotation axis. The first rotation axis intersects the second rotation axis.

Abstract: A reactor including a reactor vessel and heat exchange tubes provided in the reactor vessel. The reactor vessel includes a tubesheet and is configured to receive a reaction fluid. The tubesheet has a first plate member configured to contact the reaction fluid and a second plate member configured to not contact the reaction fluid. Heat exchange tubes are provided in the reactor vessel and fixed to the first plate member. The heat exchange tubes are configured to receive a heat exchange medium. At least a portion of the first plate member configured to contact the reaction fluid is made of a metal that has a high corrosion-resistance against the reaction liquid, and the second plate member is made of a metal that has a low corrosion-resistance against the reaction liquid. The second plate member is detachably fixed to a remainder of the reactor vessel.

Abstract: A reactor including a reactor vessel and heat exchange tubes provided in the reactor vessel. The reactor vessel includes a tubesheet and is configured to receive a reaction fluid. The tubesheet has a first plate member configured to contact the reaction fluid and a second plate member configured to not contact the reaction fluid. Heat exchange tubes are provided in the reactor vessel and fixed to the first plate member. The heat exchange tubes are configured to receive a heat exchange medium. At least a portion of the first plate member configured to contact the reaction fluid is made of a metal that has a high corrosion-resistance against the reaction liquid, and the second plate member is made of a metal that has a low corrosion-resistance against the reaction liquid. The second plate member is detachably fixed to a remainder of the reactor vessel.

Abstract: A printed wiring board and a method for manufacturing the same are provided. The printed wiring board includes a resin insulation layer having a first surface and a second surface opposite the first surface, and includes an opening for a first via conductor. An electronic-component mounting pad is formed on the first surface of the resin insulation layer. The electronic-component mounting pad includes a portion embedded in the resin insulation layer and a portion protruding from the resin insulation layer. The protruding portion covers the embedded portion and a portion of the first surface of the resin insulation layer that surrounds the embedded portion. A first conductive circuit is formed on the second surface of the resin insulation layer. A first via conductor is formed in the opening of the resin insulation layer and connects the electronic-component mounting pad and the first conductive circuit.

Abstract: A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a first via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a first conductive circuit formed on the second surface of the resin insulation layer, and a first via conductor formed in the opening and connecting the pad and the first conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion.

Abstract: Baglike container (1) that is fitted in a centrifuge to thereby allow centrifugation of any dispersion liquid placed therein. The baglike container for centrifugation is one comprising a main frame constituted of first container wall (3) with recess portion (6) formed so as to allow fitting in a centrifuge and with flange portion (7) provided on an open face border of the recess portion (6) and constituted of flexible second container wall (4) having its peripheral portion sealed mutually with the flange portion (7) of the first container wall (3) so as to define storing space (6?) for dispersion liquid in cooperation with the recess portion (6) and further comprising port (5) fitted to the main frame in a fashion allowing communication with the storing space (6?), wherein the recess portion (6) defining the storing space (6?) can be set in the centrifuge so that centrifugal force perpendicular to the bottom plane of the recess portion (6) applies.

Abstract: This invention provides a hollow fiber membrane module which can reduce pressure loss in discharging water within a module and can reduce operating power. A hollow fiber membrane bundle comprising a plurality of numbers of hollow fiber membranes are disposed within a cylindrical case having in its side face an opening part for the inflow/outflow of water, and the end of the hollow fiber membrane bundle is fixed by bonding at a position which is located in the axial direction of the cylindrical case at an outer position than the position of the opening part for the inflow/outflow of water on the side face of the cylindrical case.

Abstract: Provided are membrane elements and membrane units capable of easily forming a space part surrounded with a frame body above the membrane elements regardless of the number of the membrane elements. That is, the membrane elements are membrane elements each comprising filtering membranes on both surfaces of a plate-like supporting plate, wherein spacer parts are formed in both side parts for keeping the membrane face distance to adjacent membrane elements being prescribed intervals, and the spacer parts have through bolt insertion holes and are extended upward from the upper end part of the supporting plate. The membrane units are configured by arranging a plurality of the membrane elements in such a manner that the channel parts formed in the spacer parts are brought into contact with each other, seal panels are installed in the outermost parts of the arranged membrane elements, and a frame body is formed by surrounding the space above the filtering membranes by the spacer parts and the seal panels.

Abstract: In a camera module 1 of the present invention, a mechanical shutter 2 is provided above a top surface of a lens unit 3, and a protrusion section formed to an end of a lens 31 is held in a depression section formed on a back surface of the mechanical shutter 2. With the arrangement, it is possible to cause the camera module 1 employing the mechanical shutter 2 to be smaller and thinner at the same time.

Abstract: A polishing composition contains a deterioration inhibitor for inhibiting deterioration of polishing capability of the polishing composition, an abrasive, and water. The deterioration inhibitor is at least one selected from polysaccharide and polyvinyl alcohol. The polysaccharide is starch, amylopectin, glycogen, cellulose, pectin, hemicellulose, pullulan, or elsinan. Among them, pullulan is preferable. The abrasive is at least one selected from aluminum oxide and silicon dioxide, preferably at least one selected from fumed silica, fumed alumina, and colloidal silica. The polishing composition can be suitably used in polishing for forming wiring a semiconductor device.

Abstract: A device to reform a raw material gas into a synthesis gas rich in hydrogen and carbon monoxide is disclosed. The device includes a vessel, a floating head, a plurality of reaction tubes, inlets and outlets for raw material and heating gases, and a cooled fixed tube plate.

Abstract: A semiconductor device according to the present invention is a semiconductor device for driving and controlling a power device in the high-potential side of two power devices connected in series between a main power source potential of a high potential and a main power source potential of a low potential, and is equipped with a pulse generating circuit for generating first and second pulse signals corresponding to the level transition to first and second states of input signals having a first state showing the conduction of the power device in the high-potential side and a second state showing the non-conduction of the power device in the high-potential side, respectively; a level shift circuit for obtaining first and second level-shifted pulse signals by level-shifting the first and second pulse signals to the high-potential side; an SR-type flip-flop circuit inputting the first level-shifted pulse signals from set input terminal and the second level-shifted pulse signals from reset input terminal; and a del

Abstract: A polishing composition of the present invention, to be used in polishing for forming wiring in a semiconductor device, includes: a specific surfactant; a silicon oxide; at least one selected from the group consisting of carboxylic acid and alpha-amino acid; a corrosion inhibitor; an oxidant; and water. This polishing composition is capable of suppressing the occurrence of the dishing.

Abstract: A semiconductor device according to the present invention is a semiconductor device for driving and controlling a power device in the high-potential side of two power devices connected in series between a main power source potential of a high potential and a main power source potential of a low potential, and is equipped with a pulse generating circuit for generating first and second pulse signals corresponding to the level transition to first and second states of input signals having a first state showing the conduction of the power device in the high-potential side and a second state showing the non-conduction of the power device in the high-potential side, respectively; a level shift circuit for obtaining first and second level-shifted pulse signals by level-shifting the first and second pulse signals to the high-potential side; an SR-type flip-flop circuit inputting the first level-shifted pulse signals from set input terminal and the second level-shifted pulse signals from reset input terminal; and a del

Abstract: A reactor including a reactor vessel and heat exchange tubes provided in the reactor vessel. The reactor vessel includes a tubesheet and is configured to receive a reaction fluid. The tubesheet has a first plate member configured to contact the reaction fluid and a second plate member configured to not contact the reaction fluid. Heat exchange tubes are provided in the reactor vessel and fixed to the first plate member. The heat exchange tubes are configured to receive a heat exchange medium. At least a portion of the first plate member configured to contact the reaction fluid is made of a metal that has a high corrosion-resistance against the reaction liquid, and the second plate member is made of a metal that has a low corrosion-resistance against the reaction liquid. The second plate member is detachably fixed to a remainder of the reactor vessel.

Abstract: A first polishing composition is used in chemical mechanical polishing for removing one part of the portion of a conductive layer positioned outside a trench. A second polishing composition is used in chemical mechanical polishing for removing the remaining part of the portion of a conductive layer positioned outside the trench and the portion of a barrier layer positioned outside the trench. The first polishing composition contains a specific surfactant, a silicon oxide, a carboxylic acid, an anticorrosive, an oxidizing agent, and water. The second polishing composition contains colloidal silica, an acid, an anticorrosive, and a completely saponified polyvinyl alcohol.