Abstract: An information reproducing apparatus is provided with: a clamping device (900) capable of clamping and clamp-releasing a recording medium (100); a rotating device (20) for rotating the recording medium clamped by the clamping device; a reading device (30) disposed opposite to an information record surface of the recording medium for reading information recorded on the information record surface of the recording medium; a driving device (34, 34D, 32) capable of moving the reading device in a radial direction of the recording medium; and a linkage device (24, 83, 85) for linking a clamping or clamp-releasing action by the clamping device with a movement of the reading device by the driving device.

Abstract: The optical pickup moving mechanism includes: a feed screw and a guide shaft, which are arranged in parallel with each other, for movably supporting an optical pickup; and a drive motor for giving a drive force to the feed screw so that the optical pickup can be moved along a recording medium. The skew adjusting mechanism of the optical pickup for adjusting a skew of the optical pickup adjusts a skew of the optical pickup when the feed screw and the guide shaft are respectively moved and adjusted.

Abstract: A substrate 6a having terminals 9 thereon is bonded to a wiring board 11 having output terminals 11c thereon through an ACF 20. The pitch P2 of the output terminals 11c is different from the pitch P1 of the terminals 9 taking into account deformation of the substrate 6a or the wiring board 11 during bonding. When the substrate 6a or the wiring board 11 deforms during the bonding, the both terminals are connected with the pitch P1? of the terminals 9 and the pitch P2? of the output terminals 11c becoming approximately equal to each other.

Abstract: A semiconductor device connecting structure for connecting a semiconductor IC 7 onto a substrate 13. A bonding layer 31 is placed between the substrate 13 and the semiconductor IC 7 to accomplish adhesion therein. This bonding layer includes an ACF 32 as a bonding material for joining said semiconductor IC 7 onto said substrate 13 and a space 33 formed within the ACF 32. Even if the IC 7 deforms due to heat or the like, the deformation is absorbed by the space a 33, whereupon the connecting conditions of bumps 28, 29 can not be unstable.

Abstract: A semiconductor device connecting structure is provided for connecting a semiconductor IC to a substrate. A bonding layer is placed between the substrate and the semiconductor IC to accomplish adhesion therebetween. Sufficient heat and pressure are applied to the bonding layer to create spaces therein which deform during relative movement between the semiconductor IC and substrate thereby maintaining consistent electrical contact between the semiconductor contact bumps and electrodes on the substrate.

Abstract: In a compression-bond-connection substrate having a configuration wherein a plurality of wiring layers are formed, elevated compensation patterns having substantially the same thickness as that of backside wiring patterns are formed in positions corresponding to the backsides of substrate-side terminals to be conductively connected to opposing-side terminals on a compression-bonding-side surface of the compression-bond-connection substrate. Since uniform pressure is exerted on the substrate-side terminals when pressure is applied in compression-bonding, a highly reliable compression-bonding connected assembly can be stably obtained.

Abstract: A multichip mounted structure has a substrate 11 provided with substrate-side terminals 16a and 16b and a plurality of IC chips 12a and 12b provided with bumps 14a and 14b, respectively, so that the substrate-side terminals 16a and 16b are conductively connected with the bumps 14a and 14b, respectively. The bumps 14a and 14b provided on the plurality of IC chips 12a and 12b, respectively, form pairs of terminal lines opposing each other. Since the plurality of IC chips 12a and 12b are mounted on the substrate 11 so that central lines L1 and L2 between the pairs of terminal lines which are individually formed approximately coincide with each other, it is not necessary to transport a position of a compressive head, and one piece of ACF 19 can be commonly used.

Abstract: In a liquid crystal device, spherical-shaped semiconductor devices are mounted in a dispersive fashion on a wiring pattern extending toward a liquid crystal sealing region from input terminals connected to a flexible board. Each spherical-shaped semiconductor device is produced by forming a semiconductor device element on the surface of a spherical-shaped semiconductor material. In production of an electro-optical panel, MIS transistors are first produced in the form of spherical-shaped semiconductor devices, and then one spherical-shaped semiconductor device is installed in each pixel on an active matrix substrate, thereby allowing the MIS transistors to be produced at an optimum temperature without restriction caused by heat resistance of the substrate. When the active matrix substrate is adhesively bonded to an opposite substrate, the spherical-shaped semiconductor devices serve as spacers which allow the substrates to be precisely spaced a desired distance apart from each other.

Abstract: A method of mounting a component in which a component is thermally press-bonded onto a substrate with a conductive adhesive. The method includes a substrate heating step in which the substrate is heated to a temperature which is 20° C.˜40° C. below the glass transition point of a bonding resin contained in the conductive adhesive, and a thermal press-bonding step in which the component is thermally press-bonded onto the substrate heated to the aforementioned temperature with the conductive adhesive.

Abstract: There is provided a clamp mechanism for clamping and unclamping an information recording disk to be loaded on a loading plane of a turntable. The clamp mechanism comprises a plurality of holders and a driving device. The holders each holds the disk loaded on the loading plane of the turntable. The driving device drives the holders in both of a holding direction along which the disk is held and an un-holding direction along which the disk is released from being held. At least one of plural holders is configured to press, in a direction parallel to the loading plane, the disk loaded on the turntable.

Abstract: The liquid crystal device comprises a pair of substrates 11a and 11b facing each other with liquid crystal interposed therebetween and having aluminum electrodes 15a formed on opposing surfaces of the substrates that face each other and also comprises a protruding portion 30 provided on one substrate 11a of the pair of substrates 11a, 11b extending toward the outside from the other substrate 11b, wherein the aluminum electrodes 15a extend along the protruding portion 30 and an overcoat layer 16a is provided on the aluminum electrodes 15a extending along the protruding portion 30.

Abstract: In order to provide an anisotropic conductive adhesive agent which is capable of including a predetermined number of conductive particles between the terminals to be connected in a sure manner and which improves the conductive reliability, a plurality of conductive particles 3 included in the insulating adhesive agent 2 of the anisotropic conductive adhesive agent 1 are non-uniformly provided on the one side of the two adhering surfaces of the insulating adhesive agent 2.

Abstract: A resin composition for toners which comprises: (A) a wax composition comprising an ethylene polymer having a melt index of from 0.1 to 100 as measured at 190±0.4° C. and a paraffin wax having a melting point of from 70° C. to 120° C. or a Fisher-Tropsch wax having a melting point of from 70° C. to 120° C.; and (B) a binder resin for toners.

Abstract: The optical pickup moving mechanism includes: a feed screw and a guide shaft, which are arranged in parallel with each other, for movably supporting an optical pickup; and a drive motor for giving a drive force to the feed screw so that the optical pickup can be moved along a recording medium. The skew adjusting mechanism of the optical pickup for adjusting a skew of the optical pickup adjusts a skew of the optical pickup when the feed screw and the guide shaft are respectively moved and adjusted.

Abstract: A clamp/alignment mechanism has: a turntable on which a recording medium is mounted, the turntable being rotated by a rotation driving device; a holding device for holding the recording medium mounted on the turntable; an aligning device for aligning the recording medium mounted on the turntable; and a driving device for driving both the holding device and the alignment device. The driving device is configured to drive the aligning device in an aligning direction along which the recording medium is subjected to alignment thereof, in cases where the holding device is driven in a holding direction in which the recording medium is to be held.

Abstract: A dry etching is performed using a mask made of a titanium nitride under a reaction gas of a carbon monoxide with an additive of a nitrogen containing compound gas.

Abstract: In order to provide an anisotropic conductive adhesive agent which is capable of including a predetermined number of conductive particles between the terminals to be connected in a sure manner and which improves the conductive reliability, a plurality of conductive particles 3 included in the insulating adhesive agent 2 of the anisotropic conductive adhesive agent 1 are non-uniformly provided on the one side of the two adhering surfaces of the insulating adhesive agent 2.

Abstract: An information reproducing apparatus is provided with: a clamping device (900) capable of clamping and clamp-releasing a recording medium (100), a rotating device (20) for rotating the recording medium clamped by the clamping device; a reading device (30) disposed opposite to an information record surface of the recording medium for reading information recorded on the information record surface of the recording medium; a driving device (34, 34D, 32) capable of moving the reading device in a radial direction of the recording medium; and a linkage device (24, 83, 85) for linking a clamping or clamp-releasing action by the clamping device with a movement of the reading device by the driving device.

Abstract: In order to provide an adhesive which can enhance adhesiveness on each of adherends even when it is bonded with two adherends composed of different materials, an insulating adhesive material of an adhesive 1 placed between the two adherends is composed of a two-layer structure of a first insulating adhesive material 4 adhered with one adherend, and a second insulating adhesive material 5 adhered with the other adherend. Each of the adhesives 4 and 5 is caused to have proper adhesive properties suitable for the adherend to be bonded with by, for example, adding different kinds of coupling agents. By this construction, the adhesion forces of the adhesives 4 and 5 on each adherend can respectively be enhanced, and the adhesion forces of the anisotropically electrically conductive adhesive can be improved as compared with adhesive comprising a conventional single insulating adhesive material.

Abstract: A semiconductor device in which electrical connection between a spherical semiconductor and a substrate can be reliably effected and a method of manufacturing such a semiconductor device. The spherical semiconductor includes contact pads that are treated to create a higher wettability with the fixative material (e.g. solder) then the wettability of the semiconductor material surrounding the contact pads. The substrate includes terminal which may be similarly treated to create a higher wettability with the solder than that of the substrate material surrounding the terminals. The difference in wettability and the surface tension of solder creates a biasing force that causes the contact pads and terminal to bond in an aligned manner. Additionally, the substrate may include a recess 150 in the area where the spherical semiconductor 11 is mounted, with terminals 151 being formed in this recess 150.