Abstract: A compression-bond-connection substrate compression-bonded to a compression-bonding target object has front-side terminals conductively connected to opposing-side terminals and backside terminals formed at the backsides thereof. The backside terminals are formed diagonally to the front-side terminals. Pressure is exerted uniformly on substrate-side terminals in the pressure application in compression-bonding. Therefore, a highly reliable compression-bonding connected assembly can be stably obtained.

Abstract: A disc storage is provided for storing a plurality of trays, each for holding a disc. The trays are stacked in the storage. A movable member is provided to be moved in the vertical direction. A disc player, a tray moving device are mounted on the movable member. The tray moving device is provided to be engaged with trays for moving the trays and for increasing a space between a desired tray and an adjacent disc for receiving disc player, and for decreasing the space during the reproduction of the desired disc.

Abstract: To provide a semiconductor device in which a plurality of spherical members are easily stacked at predetermined positions, with at least one of the spherical members being formed of a semiconductor material and having a semiconductor element or wiring formed on the surface of the spherical semiconductor material. One spherical member 11 is placed in a depression formed by three spherical semiconductors 11 that are substantially in contact. The spherical members 11 are stacked in three dimensions so that four spherical members 11 form a triangular pyramid to thereby form a semiconductor device 1. In the stacked spherical semiconductors 11, there may be provided a connecting spherical semiconductor 11E, which only performs the function of electrically connecting the spherical semiconductors 11, and a dummy spherical member 11F, which only performs the function of filling a gap between other spherical members.

Abstract: A disc storage stores a plurality of discs. A pair of driving rollers are provided for carrying a disc inserted from an opening to the disc storage. Each of the driving rollers is provided to be moved between a disc carrying position and a retracted position by a moving device.

Abstract: A semiconductor device, a mounting structure thereof, a liquid crystal device, and an electronic apparatus having an improved bump electrode structure, such that the bump electrodes and corresponding electrode terminals can be electrically connected through an anisotropic conductive film without compromising, or causing deterioration of, the electrical characteristics or reliability of the device, even when the bump electrodes are formed with a narrow pitch. Since the bump electrodes of the semiconductor device are tapered inward from top to bottom, the base portions of adjacent bump electrodes are spaced apart from each other by wider gaps than the corresponding upper portions. Thus, a large number of conductive particles in the conductive film do not gather between adjacent bump electrodes to cause short-circuiting therebetween.

Abstract: To provide a semiconductor device in which a plurality of spherical members are easily stacked at predetermined positions, with at least one of the spherical members being formed of a semiconductor material and having a semiconductor element or wiring formed on the surface of the spherical semiconductor material. One spherical member 11 is placed in a depression formed by three spherical semiconductors 11 that are substantially in contact. The spherical members 11 are stacked in three dimensions so that four spherical members 11 form a triangular pyramid to thereby form a semiconductor device 1. In the stacked spherical semiconductors 11, there may be provided a connecting spherical semiconductor 11E, which only performs the function of electrically connecting the spherical semiconductors 11, and a dummy spherical member 11F, which only performs the function of filling a gap between other spherical members.

Abstract: A semiconductor device, a mounting structure thereof, a liquid crystal device, and an electronic apparatus having an improved bump electrode structure, such that the bump electrodes and corresponding electrode terminals can be electrically connected through an anisotropic conductive film without compromising, or causing deterioration of, the electrical characteristics or reliability of the device, even when the bump electrodes are formed with a narrow pitch. Since the bump electrodes of the semiconductor device are tapered inward from top to bottom, the base portions of adjacent bump electrodes are spaced apart from each other by wider gaps than the corresponding upper portions. Thus, a large number of conductive particles in the conductive film do not gather between adjacent bump electrodes to cause short-circuiting therebetween.

Abstract: A semiconductor device in which electrical connection between a spherical semiconductor and a substrate can be reliably effected and a method of manufacturing such a semiconductor device. The spherical semiconductor includes contact pads that are treated to create a higher wettability with the fixative material (e.g. solder) then the wettability of the semiconductor material surrounding the contact pads. The substrate includes terminal which may be similarly treated to create a higher wettability with the solder than that of the substrate material surrounding the terminals. The difference in wettability and the surface tension of solder creates a biasing force that causes the contact pads and terminal to bond in an aligned manner. Additionally, the substrate may include a recess 150 in the area where the spherical semiconductor 11 is mounted, with terminals 151 being formed in this recess 150.

Abstract: A supporting mechanism is provided to be moved between a disc insertion opening and a disc storing device, and a driving roller is rotatably mounted on the supporting mechanism for carrying a disc inserted in the opening toward the disc storing device. The supporting mechanism is moved between the opening and the disc storing device, and the driving roller is driven for carrying the disc from the opening to the disc storing device.

Abstract: Conductive connection can be effected between electrodes arranged at a minute pitch. When joining an IC chip (36), which is a semiconductor device, to an external substrate (32a), conductive paste (41) is sprayed in particles to terminals (37) on the external substrate (32a) and the conductive paste (41) is put on the electrodes (37). Next, positioning of pads (38) of the IC chip (36) is effected with respect to the conductive paste (41) and, in this condition, the IC chip (36) and the substrate (32a) are glued to each other. Since the conductive paste (41) is sprayed in particles and printed on the electrodes (37), it is possible to correctly put the conductive paste (41) thereon even when the electrodes (37) are arranged at a minute pitch. Further, since conduction is effected between the pads (38) and the electrodes (37) through the conductive paste (41), the conduction state is stable.

Abstract: A conductive adhesive which can withstand exposure to high temperature during a solder reflow process comprises an adhesive resin and a plurality of conductive particles mixed in the adhesive resin. The conductive particles each include a core formed of a synthetic resin and a conductive material coated around the core. The cores are each formed of a material having a thermal deformation temperature higher than that of the adhesive resin, and more preferably formed of a material having a thermal deformation temperature (18.6 kg/cm2) higher than 120° C. as measured according to the measuring method defined in the ASTM standard D648, and still more preferably formed of a material selected from the group consisting of polyphenylene oxide, polysulfone, polycarbonate, polyacetal, and polyethylene terephthalate.

Abstract: A dry etching is performed using a mask made of a titanium nitride under a reaction gas of a carbon monoxide with an additive of a nitrogen containing compound gas.

Abstract: A substrate 6a having terminals 9 thereon is bonded to a wiring board 11 having output terminals 11c thereon through an ACP 20. The pitch P2 of the output terminals 11c is different from the pitch P1 of the terminals 9 taking into account deformation of the substrate 6a or the wiring board 11 during bonding. When the substrate 6a or the wiring board 11 deforms during the bonding, the both terminals are connected with the pitch P1′ of the terminals 9 and the pitch P2′ of the output terminals 11c becoming approximately equal to each other.

Abstract: A disc storage is provided for storing a plurality of trays, each for holding a disc. The trays are stacked in the storage. A movable member is provided to be moved in the vertical direction. A disc player, a tray moving device are mounted on the movable member. The tray moving device is provided to be engaged with trays for moving the trays and for forming spaces between trays for receiving disc player. A driving device is provided for vertically moving the movable member.

Abstract: An optical pickup sending device comprises: an optical pickup for reading information from an information recording medium; a rack member provided in connection with the optical pickup; and a screwed shaft engaged with the rack member for sending the optical pickup along the screwed shaft. In particular, the rack member is formed with a plurality of curved teeth each having a radius of curvature larger than that of the screwed shaft.

Abstract: A disc storage is provided for storing a plurality of trays, each for holding a disc. The trays are stacked in the storage. A movable member is provided to be moved in the vertical direction. A disc player, a tray moving device are mounted on the movable member. The tray moving device is provided to be engaged with trays for moving the trays and for forming spaces between trays for receiving disc player. A driving device is provided for vertically moving the movable member.

Abstract: A supporting means is provided to be moved between a disc insertion opening and a disc storing device, and a driving roller is rotatably mounted on the supporting means for carrying a disc inserted in the opening toward the disc storing device. The supporting means is moved between the opening and the disc storing means, and the driving roller is driven for carrying the disc from the opening to the disc storing device.

Abstract: A disc storage stores a plurality of discs. A pair of driving rollers are provided for carrying a disc inserted from an opening to the disc storage. Each of the driving rollers is provided to be moved between a disc carrying position and a retracted position by a moving device.

Abstract: A mounting structure of a semiconductor chip including a semiconductor chip 6 with a plurality of bumps 16, and a circuit substrate 3 with a plurality of output wires 11 and input terminals 12. In the press-bonding process, ACF 4 is used to join the semiconductor chip 6 and the circuit substrate 3 together so as to allow electrical conduction between the bumps 16 and the land parts of, for example, the output wires 11. A plurality of transfixion holes 10 are formed so as to be spread out in an area of the circuit board 3 surrounded by the land parts of the wires 11 and the terminals 12, and the excess ACF 4, present during the press-bonding, is allowed to escape through the transfixion holes 10, thereby preventing generation of a large internal stress in the ACF 4. This allows the IC 6 to be joined more reliably.

Abstract: A plurality of trays, each for holding a disc, are arranged in a disc arranging direction in a disc storage. A movable base is provided to be rotated about a shaft and a disc player having a turntable, a disc clamper and a pickup, is mounted on the movable base. A driving device is provided for rotating the movable base between a retracted position and a disc reproducing position. A lock device is provided on the chassis for engaging with the movable base at the disc reproducing position to minimize external vibrations to the movable base during disc reproduction.