Abstract: According to one embodiment, an electronic apparatus includes a transmitter circuitry, a receiver circuitry, and a processing circuitry. The transmitter circuitry transmits a first data frame including first data to a destination apparatus. The receiver circuitry receives first acknowledgment information indicative of a reception state of the first data included in the first data frame. The receiver circuitry receives second acknowledgment information indicative of a reception state of the first data included in a second data frame. The second data frame is transmitted from another electronic apparatus to the destination apparatus. The processing circuitry determines whether the first data frame is retransmitted, based on at least one of the first and second acknowledgment information.

Abstract: According to one embodiment, an electronic apparatus includes a receiver and a transmitter. The receiver is configured to receive, from a first wireless apparatus, a first physical frame including a destination address receivable by a second wireless apparatus different from the electronic apparatus. The transmitter is configured to transmit, to the first wireless apparatus, a first response frame including first information regarding the first physical frame, if the first physical frame is successfully received. A transmission period of the first response frame at least partially overlaps with a transmission period of a second response frame including second information regarding the first physical frame received by the second wireless apparatus.

Abstract: A microphone assembly including a main board and a microphone. The microphone includes a capacitor or a MEMS chip, a case accommodating the capacitor or the MEMS chip, and a microphone board electrically connected to the capacitor or the MEMS chip. The microphone board has a larger outer dimension than the case and includes a fixing portion and a connecting portion. The case is fixed onto the fixing portion. The connecting portion is a portion of the microphone board, the portion being located outside the case and electrically and mechanically connected to the main board.

Abstract: A microphone unit including a substrate, a microphone, a fixing member, and a film. The substrate includes a first face, a second face opposite to the first face, and a through-hole extending from the first face to the second face through the substrate. The microphone is mounted on or fixed onto the second face of the substrate and has a sound hole in communication with the through-hole of the substrate. The fixing member is fixed onto the first face of the substrate such as to be located around the through-hole. The film provides at least one of dustproofness and waterproofness and is fixed onto the fixing member such as to cover the through-hole.

Abstract: In a solder alloy consisting essentially of tin, silver, copper, bismuth, antimony, indium, and nickel, the content ratio of the silver is 0.05 mass % or more and below 0.2 mass %; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is above 4.0 mass % and 10 mass % or less; the content ratio of the antimony is 0.005 mass % or more and 8 mass % or less; the content ratio of the indium is 0.005 mass % or more and 2 mass % or less; the content ratio of the nickel is 0.003 mass % or more and 0.4 mass % or less; and the content ratio of the tin is the remaining ratio and the mass ratio (Bi/Ni) of the bismuth content with respect to the nickel content is 35 or more and 1500 or less.

Abstract: In a solder alloy consisting essentially of tin, silver, copper, bismuth, antimony, indium, nickel and an additional element, the content ratios of the silver, the copper, the bismuth, the antimony, the indium, the nickel and the additional element, which is at least one of germanium, gallium, iron or phosphorus, are defined, the content ratio of the tin is the remaining ratio, and the mass ratio (Bi/Ni) of the bismuth content with respect to the nickel content is 35 or more and 1500 or less. In a further embodiment, the solder alloy additionally contains a defined amount of cobalt.

Abstract: A microphone assembly including a main board and a microphone. The microphone includes a capacitor or a MEMS chip, a case accommodating the capacitor or the MEMS chip, and a microphone board electrically connected to the capacitor or the MEMS chip. The microphone board has a larger outer dimension than the case and includes a fixing portion and a connecting portion. The case is fixed onto the fixing portion. The connecting portion is a portion of the microphone board, the portion being located outside the case and electrically and mechanically connected to the main board.

Abstract: In a solder alloy consisting essentially of tin, silver, copper, bismuth, antimony, indium, and nickel, the content ratio of the silver is 0.05 mass % or more and below 0.2 mass %; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is above 4.0 mass % and 10 mass % or less; the content ratio of the antimony is 0.005 mass % or more and 8 mass % or less; the content ratio of the indium is 0.005 mass % or more and 2 mass % or less; the content ratio of the nickel is 0.003 mass % or more and 0.4 mass % or less; and the content ratio of the tin is the remaining ratio and the mass ratio (Bi/Ni) of the bismuth content with respect to the nickel content is 35 or more and 1500 or less.

Abstract: A signal detection device according to the embodiment of the present invention includes a memory and processing circuitry. The memory is configured to store a program. The processing circuitry is for executing the program and is configured to calculate a first signal level indicative of a signal level of a digital complex signal; calculate a first variation indicative of a temporal variation of the first signal level; calculate a statistic in a predetermined first time period on the basis of the first variation within the first time period; and determine, on the basis of the statistic in the first time period, whether or not an interference source signal indicative of a signal of a radio wave coming from an interference source is included in the digital complex signals within the first time period.

Abstract: A control device for a vehicle includes an electronic control unit. The electronic control unit executes control for prohibiting stop-and-start control until a predetermined period elapses after an ignition switch is turned ON. The electronic control unit executes scene-specific electric power supply control for operating a first function group that is a specific function and stopping a function other than the first function group in accordance with a state of the vehicle at a time when the ignition switch is turned OFF. The electronic control unit sets the predetermined period during which the stop-and-start control is prohibited longer in a case where the first function group is in an operating state than in a case where the first function group is not in an operating state when the ignition switch is turned ON.

Abstract: In a solder alloy consisting essentially of tin, silver, copper, bismuth, antimony, indium, and nickel, the content ratio of the silver is 0.05 mass % or more and below 0.2 mass %; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is above 4.0 mass % and 10 mass % or less; the content ratio of the antimony is 0.005 mass % or more and 8 mass % or less; the content ratio of the indium is 0.005 mass % or more and 2 mass % or less; the content ratio of the nickel is 0.003 mass % or more and 0.4 mass % or less; and the content ratio of the tin is the remaining ratio and the mass ratio (Bi/Ni) of the bismuth content with respect to the nickel content is 35 or more and 1500 or less.

Abstract: A microphone unit including a substrate, a microphone, a fixing member, and a film. The substrate includes a first face, a second face opposite to the first face, and a through-hole extending from the first face to the second face through the substrate. The microphone is mounted on or fixed onto the second face of the substrate and has a sound hole in communication with the through-hole of the substrate. The fixing member is fixed onto the first face of the substrate such as to be located around the through-hole. The film provides at least one of dustproofness and waterproofness and is fixed onto the fixing member such as to cover the through-hole.

Abstract: A signal detection device according to the embodiment of the present invention includes a memory and processing circuitry. The memory is configured to store a program. The processing circuitry is for executing the program and is configured to calculate a first signal level indicative of a signal level of a digital complex signal; calculate a first variation indicative of a temporal variation of the first signal level; calculate a statistic in a predetermined first time period on the basis of the first variation within the first time period; and determine, on the basis of the statistic in the first time period, whether or not an interference source signal indicative of a signal of a radio wave coming from an interference source is included in the digital complex signals within the first time period.

Abstract: In a solder alloy consisting essentially of tin, silver, copper, bismuth, antimony, indium, and nickel, the content ratio of the silver is 0.05 mass % or more and below 0.2 mass %; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is above 4.0 mass % and 10 mass % or less; the content ratio of the antimony is 0.005 mass % or more and 8 mass % or less; the content ratio of the indium is 0.005 mass % or more and 2 mass % or less; the content ratio of the nickel is 0.003 mass % or more and 0.4 mass % or less; and the content ratio of the tin is the remaining ratio and the mass ratio (Bi/Ni) of the bismuth content with respect to the nickel content is 35 or more and 1500 or less.

Abstract: A solder alloy is a tin-silver-copper solder alloy, and contains tin, silver, copper, bismuth, nickel, and cobalt. Relative to the total amount of the solder alloy, the silver content is 2 mass % or more and 4 mass % or less, the nickel content is 0.01 mass % or more and 0.15 mass % or less, and the cobalt content is 0.001 mass % or more and 0.008 mass % or less.

Abstract: A solder alloy is a tin-silver-copper solder alloy, and contains tin, silver, copper, bismuth, nickel, and cobalt. Relative to the total amount of the solder alloy, the silver content is 2 mass % or more and 4 mass % or less, the nickel content is 0.01 mass % or more and 0.15 mass % or less, and the cobalt content is 0.001 mass % or more and 0.008 mass % or less.

Abstract: A microphone capable of canceling vibration noise caused by mechanical vibration is provided with, in capsules, a pair of diaphragms and a pair of back plates opposite to the respective diaphragms. A printed circuit board is disposed at the middle of capsules. A pair of diaphragms is disposed close and opposite to the surfaces of the printed circuit board with the printed circuit board disposed therebetween. The difference in distance from a vibration source to the two diaphragms is made small. The microphone has a high canceling effect for canceling vibration noise caused by mechanical vibration.

Abstract: A unidirectional microphone includes a cylindrical capsule, a front plate blocking one end of the cylindrical capsule, a front plate sound hole formed in the front plate, a vibrating membrane and a first rear pole plate that are housed in the cylindrical capsule and form capacitance, a substrate blocking another open end of the capsule, and a rear plate sound hole formed in the substrate. The front plate sound hole and the rear plate sound hole are placed on mutually opposite sides of a central axis of the capsule so as to be offset relative to the central axis. The directional axis can be significantly offset relative to the central axis of the microphone using the microphone alone.

Abstract: A vibrator includes a substrate, a coil supported to the substrate and a vibrator member disposed in opposition to the coil and capable of vibrating along the axial direction of the coil. The vibrator member includes a weight, a magnet polarized along the axial direction of the coil, and a supporting member for supporting the magnet with allowing displacement thereof along the axial direction of the coil.

Abstract: A microphone has a housing (9) defining an acoustic hole (99) and having inner faces. The microphone includes a MEMS capacitor (1) secured to and electrically connected with a first face (6) of the inner faces of the housing (9), the first face defining the acoustic hole (99), a detecting circuit (7) secured to and electrically connected with a second face (8) of the inner faces of the housing (9), the second face (8) being not adjacent the first face (6), the detecting circuit (7) detecting at least a change in the electrostatic capacity of the MEMS capacitor (1). The microphone further includes a flexible substrate (4) secured to the first face (6) and the second face (8) and disposed under a bent state inside the housing (9). The flexible substrate (4) establishes electrical connection between the MEMS capacitor (1) and the detecting circuit (7) via a wire electrically connecting the first face (6) and the second face (8).