Patents by Inventor Kensuke Nakanishi

Kensuke Nakanishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090070093
    Abstract: A game device calculates a shift angle A based on a magnitude of a velocity vector S of a moving object MO and inclination information that indicates an inclination of a controller, calculates a direction D of the moving object on a slope based on a direction of the velocity vector S of the moving object and the shift angle A, calculates a first force vector P1 in the direction intersecting at right angles on the slope with the direction D of the moving object on the slope based on the inclination information, calculates a second force vector P2 based on a slope angle of the slope, calculates a resultant force vector PS by combining the first force vector P1 and the second force vector P2, updates the velocity vector S of the moving object based on the resultant force vector PS, and updates a position of the moving object MO based on the updated velocity vector.
    Type: Application
    Filed: September 5, 2008
    Publication date: March 12, 2009
    Applicant: NAMCO BANDAI GAMES INC.
    Inventors: Kensuke NAKANISHI, Tomoaki YASUDA, Kenichi SHIMADA, Hisashi KAWAMURA
  • Publication number: 20090068865
    Abstract: A case with a connector integrally formed with a resin connector, and can be manufactured with a small number of processes is provided. The connector case includes a housing, a resin connector, and a ground terminal extending along an outer periphery of the connector. A terminal-side fixing portion extending backward from the ground terminal is crimped to or pressed over a housing-side fixing portion. When molds are closed after the housing and the ground terminal are placed in the molds for injection molding of the resin connector, a pressing portion formed on the mold presses the terminal-side fixing portion against the housing-side fixing portion to crimp or press the terminal-side fixing portion to or over the housing-side fixing portion. As a result, in the process for the injection molding of the connector, the ground terminal is fixed to the housing at the same time. The connector case with the ground terminal fixed to the housing can be manufactured in a small number of processes.
    Type: Application
    Filed: March 1, 2007
    Publication date: March 12, 2009
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, MATSUO INDUSTRIES, INC.
    Inventors: Yoshikazu Suzuki, Akira Ishimaru, Tomokiyo Suzuki, Hironao Hayashi, Shigeru Hayashida, Osamu Kuriyagawa, Iori Kobayashi, Kensuke Nakanishi, Toru Takahashi, Yuki Yamakawa, Masanori Sumida
  • Publication number: 20080112585
    Abstract: A microphone contains a capacitor in a capsule with a diaphragm serving as one of electrodes of the capacitor. The microphone is mounted on a mounting board when external terminals installed on an external surface of a circuit board which closes an opening of the capsule are connected face to face with connection terminals on the mounting board. A sound hole is formed in the circuit board and through-hole is formed in the mounting board, being placed in such a position as to avoid overlapping each other when the microphone is mounted. An enclosed space which communicates the through-hole and sound hole is formed when the external terminals are connected with the connection terminals on the mounting board.
    Type: Application
    Filed: November 1, 2007
    Publication date: May 15, 2008
    Applicant: Hosiden Corporation
    Inventors: Toshiro Izuchi, Kazuo Ono, Kensuke Nakanishi, Kiyoshi Ota, Tsuyoshi Baba
  • Publication number: 20080080729
    Abstract: An electret condenser microphone comprising a metal capsule having a top surface provided with sound receiving holes, a diaphragm, a back electrode plate that faces either one of surfaces of the diaphragm and that is provided separately from the capsule, and an electret layer formed on the back electrode plate or the diaphragm. The diaphragm, the back electrode plate and the electret layer are all mounted inside the capsule. The top surface includes a suctioned portion in its center on which suction force can be applied by a suction-type transporting device, and the sound holes are formed circumferentially around the suctioned portion.
    Type: Application
    Filed: September 20, 2007
    Publication date: April 3, 2008
    Applicant: HOSIDEN CORPORATION
    Inventors: Toshiro Izuchi, Kensuke Nakanishi, Tsuyoshi Baba
  • Patent number: 7347699
    Abstract: A contactor (20) has a joint portion (27) which is jointed to each contactor pad (32) of one wiring board (30) by using a solder at one end portion thereof and a connecting portion (24) which is dip-soldered in each through hole (35) of the other wiring board (33) at the other end portion thereof. A housing (1) is constituted by integrally molding a housing main body (1F) having a U-like shape as seen from a plane and a reinforcing bar portion (2) which connects intermediate portions of opposed parts (1A) and (1B) of the housing main body (1F) with each other. Cavities (3) are substantially linearly formed in the housing main body (1F) at predetermined intervals. The contactors (20) are inserted into cavities (3), and the contactors (20) are movably held in the housing (1) with a holding member.
    Type: Grant
    Filed: June 8, 2006
    Date of Patent: March 25, 2008
    Assignees: Hirose Electric Co., Ltd., Toyota Jidosha Kabushiki Kaisha
    Inventors: Kensaku Sato, Akira Shirai, Yoshikazu Suzuki, Hironao Hayashi, Akira Ishimaru, Tomokiyo Suzuki, Osamu Kuriyagawa, Iori Kobayashi, Kensuke Nakanishi
  • Publication number: 20080053572
    Abstract: A soldering flux contains a base resin and an activating agent. The base resin contains a thermoplastic acrylic resin having a glass transition temperature of below ?50° C. This enables to sufficiently suppress the occurrence of cracks in the flux residue after soldering, under the severe environment where the temperature difference is extremely large. The soldering flux has high reliability and excellent solderability, and is conventional with respect to the load against manufacturing cost and environment.
    Type: Application
    Filed: September 5, 2007
    Publication date: March 6, 2008
    Applicants: DENSO CORPORATION, Harima Chemicals, Inc.
    Inventors: Masaki Sanji, Masayasu Yamamoto, Kensuke Nakanishi, Masami Aihara
  • Publication number: 20080053571
    Abstract: A soldering flux contains a base resin and an activating agent. The soldering flux contains, as the activating agent, an oxygen-containing heterocyclic compound having at least one carboxyl group in a molecule. A solder paste composition contains the abovementioned soldering flux and the solder alloy powder. These enable exhibition of excellent wettability to lead-free metals and plating, irrespective of the type of the metals.
    Type: Application
    Filed: September 5, 2007
    Publication date: March 6, 2008
    Applicants: DENSO CORPORATION, Harima Chemicals, Inc.
    Inventors: Masayasu Yamamoto, Takumi Shiomi, Kensuke Nakanishi, Masahiro Watanabe, Masami Aihara
  • Publication number: 20070120287
    Abstract: In a method for producing a molded article having a resin part, the resin part is injection-molded to an opening of a main body part and the molded article has an excellent air-tightness between the resin part and the main body part. A foam sealant is attached to a peripheral portion around the opening of the main body part. Attached to the main body part is a retainer made of the same kind of resin as injected resin and adapted to keep the foam sealant compressed in its thickness direction. The main body part is placed within a mold so that the retainer is exposed inside a cavity of the mold. A molten resin is injected into the cavity of the mold. The injected resin and the retainer are integrated into the resin part.
    Type: Application
    Filed: November 6, 2006
    Publication date: May 31, 2007
    Inventors: Yoshikazu Suzuki, Tomokiyo Suzuki, Hironao Hayashi, Osamu Kuriyagawa, Iori Kobayashi, Kensuke Nakanishi, Toru Takahashi, Yuki Yamakawa, Masanori Sumida
  • Publication number: 20070117632
    Abstract: It is an object of the invention to provide a communication game apparatus, a communication game system, a communication game method, and a communication game program that can improve, in a competitive game, the feeling of realistic sense of the game by preventing actions of characters from becoming unnatural. Plural game terminals 10 serving as the other communication game apparatuses excluding the apparatus of own are connected to the game terminal 10 serving as the own communication game apparatus via communication lines.
    Type: Application
    Filed: November 16, 2006
    Publication date: May 24, 2007
    Applicant: NAMCO BANDAI GAMES INC.
    Inventor: Kensuke NAKANISHI
  • Publication number: 20070104339
    Abstract: An object of the present invention is to provide a digital-output electret condenser microphone capable of being soldered on a wiring substrate of an apparatus by using a reflow furnace. An electret condenser microphone according to the present invention has an electret polymer film and a spacer that are formed of a heat-resistant material. Sound apertures are provided in a front panel of the electrically conductive capsule and/or the wiring substrate. Provided on the surface exposed in the open end of the electrically conductive capsule are multiple terminals, including at least a power supply terminal, a digital signal output terminal, and a clock input terminal. The terminals are protruded outward beyond a caulked part at the open end of the electrically conductive capsule.
    Type: Application
    Filed: October 25, 2006
    Publication date: May 10, 2007
    Applicant: Hosiden Corporation
    Inventors: Toshiro Izuchi, Kensuke Nakanishi, Ryuji Awamura
  • Publication number: 20070010141
    Abstract: To provide a mounting substrate that requires a reduced amount of solder and reduces a thermal effect of solder on the interior of an electronic component, and a microphone to be mounted on the substrate. A mounting substrate according to the present invention includes: a solder part formed on a part of an electrode formed on the mounting substrate; a resist film formed to prevent the solder of the solder part from flowing out of a predetermined range; and a gas-escape groove that is constituted by the absence of the electrode and the resist film and allows gas produced during soldering to escape. In the case where a component having a central terminal and a peripheral terminal is mounted on the mounting substrate, each part of the mounting substrate has the characteristics described below.
    Type: Application
    Filed: July 6, 2006
    Publication date: January 11, 2007
    Applicant: Hosiden Corporation
    Inventors: Toshiro Izuchi, Kazuo Ono, Kensuke Nakanishi, Hiroaki Onishi
  • Publication number: 20060285707
    Abstract: An object of the present invention is to provide an electro-acoustic transducer having the effects of absorbing vibration and high-frequency noise, reducing the number of components, and preventing heat conduction at the same time. An electro-acoustic transducer according to the present invention includes: an electrically conductive capsule having an opening for electrically connecting internal circuitry to an external object; terminals which protrude from the opening to the outside; and a raised part which is a portion of the capsule on the opening side and is spaced with a gap from the internal structure of the capsule. The raised part and the terminals are arranged in such a manner that the raised part and all of the terminals are able to be directly soldered to a wiring board. The raised part may extend toward the terminals in such a manner that the opening is narrowed. Furthermore, the raised part may have a slit extending to the boundary between the raised part and the other part of the capsule.
    Type: Application
    Filed: June 8, 2006
    Publication date: December 21, 2006
    Applicant: Hosiden Corporation
    Inventors: Toshiro Izuchi, Kazuo Ono, Kensuke Nakanishi, Hiroaki Onishi, Ryuji Awamura
  • Publication number: 20060279316
    Abstract: A contactor (20) has a joint portion (27) which is jointed to each contactor pad (32) of one wiring board (30) by using a solder at one end portion thereof and a connecting portion (24) which is dip-soldered in each through hole (35) of the other wiring board (33) at the other end portion thereof. A housing (1) is constituted by integrally molding a housing main body (1F) having a U-like shape as seen from a plane and a reinforcing bar portion (2) which connects intermediate portions of opposed parts (1A) and (1B) of the housing main body (1F) with each other. Cavities (3) are substantially linearly formed in the housing main body (1F) at predetermined intervals. The contactors (20) are inserted into cavities (3), and the contactors (20) are movably held in the housing (1) with a holding member.
    Type: Application
    Filed: June 8, 2006
    Publication date: December 14, 2006
    Inventors: Kensaku Sato, Akira Shirai, Yoshikazu Suzuki, Hironao Hayashi, Akira Ishimaru, Tomokiyo Suzuki, Osamu Kuriyagawa, Iori Kobayashi, Kensuke Nakanishi
  • Publication number: 20060177085
    Abstract: In order to automate a microphone assembly process including a dust-proof treatment, an object of the present invention is to provide a dust-proof microphone having a configuration suitable for automated assembly. According to the present invention, a microphone has a plate-like or film-like dust-proof section that is disposed in a conductive housing (capsule) having a sound aperture and covers the sound aperture. The dust-proof section has a plurality of pores at least in a region corresponding to the sound aperture, and the dust-proof section further has a nonporous region. In the case of an electret condenser microphone, from the viewpoint of performance of the microphone, the dust-proof section is conductive. In addition, taking into account a soldering in a reflow furnace, the dust-proof section is heat-resistant. Each pore is desirably designed taking into account the environment for the usage of the microphone.
    Type: Application
    Filed: January 27, 2006
    Publication date: August 10, 2006
    Applicant: Hosiden Corporation
    Inventors: Toshiro Izuchi, Kazuo Ono, Kensuke Nakanishi, Hiroaki Onishi
  • Patent number: 6607384
    Abstract: Disclosed is a lighting device for use with a dental or medical instrument having a tool in the distal part of the instrument for treatment of a site. The lighting device includes a plurality of LEDs and an LED holder encasing the plurality of LEDs and capable of being mounted on a distal part of the instrument. The LEDs are arranged so as to illuminate the site substantially without casting a shadow on the site in treatment when the LED holder is mounted on the instrument. Also disclosed is a dental or medical instrument including a tool in the distal part of the instrument for treatment of a site and a lighting device. The lighting device further includes a plurality of LEDs and an LED holder encasing the LEDs and provided in the distal part of the instrument. The LEDs are arranged so as to illuminate the site substantially without casting a shadow on the site in treatment.
    Type: Grant
    Filed: October 19, 2000
    Date of Patent: August 19, 2003
    Assignee: Nakanishi Inc.
    Inventor: Kensuke Nakanishi
  • Patent number: 6425826
    Abstract: A game machine having a plurality of play patterns for a game, the play patterns being different from each other in the numbers of moving-body objects entering the game, for providing images of a highest quality for each play pattern in real time, and an information storage medium suitable for use in such a game machine. The game machine can be used to play a game having a plurality of play patterns which are different from each other in the number of moving-body objects entering the game. In order to generate a more accurate images of moving-body objects for a play pattern having a reduced number of moving-body objects entering the game, the game machine comprises an accuracy setting section for setting the accuracy of moving-body objects for each play pattern and an image generation section for generating images of the moving-body objects based on the accuracy.
    Type: Grant
    Filed: April 11, 2000
    Date of Patent: July 30, 2002
    Assignee: Namco, Ltd.
    Inventors: Kensuke Nakanishi, Yuji Iizuka
  • Patent number: 6336864
    Abstract: It is an object of the present invention to provide a game apparatus allowing for an accurate determination of a collision of a player's moving object traveling at high speed with an obstacle. A relative coordinate calculation section 21 calculates the relative coordinates of another movable object by using the position of the player's movable object as the origin. A relative speed calculation section 22 calculates the relative speed of the player's moving object and the other movable object. If the relative speed exceeds a predetermined value, a hit check position decision section 23 equally divides a distance traveled by the player's moving object at the relative speed in {fraction (1/60)} seconds into segments, each of the segments not exceeding the length L of the player's moving object, to determine the number of hit checks, and sets one or more hit check positions between the player's moving object and the other movable object on their trajectory.
    Type: Grant
    Filed: August 9, 2000
    Date of Patent: January 8, 2002
    Assignee: Namco Ltd.
    Inventor: Kensuke Nakanishi