Patents by Inventor Kensuke Nakanishi

Kensuke Nakanishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8391531
    Abstract: There is provided a condenser microphone that has improved portability and that can be realized at low costs.
    Type: Grant
    Filed: June 16, 2010
    Date of Patent: March 5, 2013
    Assignee: Hosiden Corporation
    Inventors: Hiroyuki Harano, Hiroshi Yamagata, Kazuo Ono, Kensuke Nakanishi
  • Publication number: 20130010981
    Abstract: A microphone capable of canceling vibration noise caused by mechanical vibration is provided with, in capsules, a pair of diaphragms and a pair of back plates opposite to the respective diaphragms. A printed circuit board is disposed at the middle of capsules. A pair of diaphragms is disposed close and opposite to the surfaces of the printed circuit board with the printed circuit board disposed therebetween. The difference in distance from a vibration source to the two diaphragms is made small. The microphone has a high canceling effect for canceling vibration noise caused by mechanical vibration.
    Type: Application
    Filed: March 10, 2011
    Publication date: January 10, 2013
    Applicant: HOSIDEN CORPORATION
    Inventors: Hiroyuki Harano, Hiroshi Yamagata, Kazuo Ono, Kensuke Nakanishi
  • Publication number: 20120291922
    Abstract: A solder paste according to an aspect of the invention includes, within a flux, an activator that has a dibasic acid with a molecular weight of 250 or less, a monobasic acid with a molecular weight of 150 or greater and 300 or less, and a dibasic acid with a molecular weight of 300 or greater and 600 or less; and at least one resin additive selected from the group consisting of high-density polyethylenes and polypropylenes. The solder paste has the resin additive in an amount of 4% by weight or greater and 12% by weight or less when the total amount of the flux is taken as 100% by weight, and has a viscosity of 400 Pa·s or greater at 80° C.
    Type: Application
    Filed: December 6, 2010
    Publication date: November 22, 2012
    Applicants: ARAKAWA CHEMICAL INDUSTRIES, LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA, HARIMA CHEMICALS, INC., FUJITSU TEN LIMITED, KOKI COMPANY LIMITED, DENSO CORPORATION
    Inventors: Eiji Iwamura, Kazushi Gotoh, Fumio Ishiga, Takayasu Yoshioka, Masayoshi Utsuno, Atsuo Nakamura, Teruo Okochi, Masaki Sanji, Takuji Sukekawa, Kenshi Ikedo, Yoshiyuki Andoh, Takeshi Shirai, Kimiaki Mori, Rie Wada, Kensuke Nakanishi, Masami Aihara, Seishi Kumamoto
  • Publication number: 20120291921
    Abstract: A flux for a solder paste according to an aspect of the invention includes an acrylic resin obtained by radically copolymerizing a (meth)acrylate having a C6-C15 alkyl group and a (meth)acrylate other than the above-mentioned (meth)acrylate; and rosins. The weight ratio of the acrylic resin is 0.5 or greater and 1.2 or less when the weight of the rosins is taken as 1, and the flux for a solder paste is fluidized by application of a shear force of 10 Pa or greater and 150 Pa or less.
    Type: Application
    Filed: December 6, 2010
    Publication date: November 22, 2012
    Applicants: ARAKAWA CHEMICAL INDUSTRIES, LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA, HARIMA CHEMICALS, INC., FUJITSU TEN LIMITED, KOKI COMPANY LIMITED, DENSO CORPORATION
    Inventors: Eiji Iwamura, Kazushi Gotoh, Shinsuke Nagasaka, Takayasu Yoshioka, Masayoshi Utsuno, Atsuo Nakamura, Teruo Okochi, Masaki Sanji, Takuji Sukekawa, Kenshi Ikedo, Yoshiyuki Andoh, Takeshi Shirai, Kimiaki Mori, Rie Wada, Kensuke Nakanishi, Masami Aihara, Seishi Kumamoto
  • Patent number: 8308565
    Abstract: A game device calculates a shift angle A based on a magnitude of a velocity vector S of a moving object MO and inclination information that indicates an inclination of a controller, calculates a direction D of the moving object on a slope based on a direction of the velocity vector S of the moving object and the shift angle A, calculates a first force vector P1 in the direction intersecting at right angles on the slope with the direction D of the moving object on the slope based on the inclination information, calculates a second force vector P2 based on a slope angle of the slope, calculates a resultant force vector PS by combining the first force vector P1 and the second force vector P2, updates the velocity vector S of the moving object based on the resultant force vector PS, and updates a position of the moving object MO based on the updated velocity vector.
    Type: Grant
    Filed: September 5, 2008
    Date of Patent: November 13, 2012
    Assignee: Namco Bandai Games Inc.
    Inventors: Kensuke Nakanishi, Tomoaki Yasuda, Kenichi Shimada, Hisashi Kawamura
  • Publication number: 20120195453
    Abstract: A unidirectional microphone includes a cylindrical capsule, a front plate blocking one end of the cylindrical capsule, a front plate sound hole formed in the front plate, a vibrating membrane and a first rear pole plate that are housed in the cylindrical capsule and form capacitance, a substrate blocking another open end of the capsule, and a rear plate sound hole formed in the substrate. The front plate sound hole and the rear plate sound hole are placed on mutually opposite sides of a central axis of the capsule so as to be offset relative to the central axis. The directional axis can be significantly offset relative to the central axis of the microphone using the microphone alone.
    Type: Application
    Filed: September 9, 2010
    Publication date: August 2, 2012
    Applicant: Hosiden Corporation
    Inventors: Hiroyuki Harano, Hiroshi Yamagata, Kazuo Ono, Kensuke Nakanishi
  • Patent number: 8150078
    Abstract: An electret condenser microphone is provided that can reduce parasitic capacitance and realize enhanced sensitivity. The electret condenser microphone includes a capacitor section including a fixed electrode having an electret member and a diaphragm electrode, a casing section housing the capacitor section, a circuit board including a converter circuit 4 for converting variations of capacitance of the capacitor section caused by vibrations of the diaphragm electrode to electric signals for output, and conducting elements for making the capacitor conductive with the circuit board, in which the casing section has a shape as viewed from top different from a shape of the capacitor as viewed from top to provide different distances between outer sides of the capacitor section and the casing section circumferentially of the capacitor section as viewed from top.
    Type: Grant
    Filed: April 12, 2007
    Date of Patent: April 3, 2012
    Assignee: Hosiden Corporation
    Inventors: Toshiro Izuchi, Kensuke Nakanishi, Ryuji Awamura
  • Patent number: 8135150
    Abstract: An electret condenser microphone comprising a metal capsule having a top surface provided with sound receiving holes, a diaphragm, a back electrode plate that faces either one of surfaces of the diaphragm and that is provided separately from the capsule, and an electret layer formed on the back electrode plate or the diaphragm. The diaphragm, the back electrode plate and the electret layer are all mounted inside the capsule. The top surface includes a suctioned portion in its center on which suction force can be applied by a suction-type transporting device, and the sound holes are formed circumferentially around the suctioned portion.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: March 13, 2012
    Assignee: Hosiden Corporation
    Inventors: Toshiro Izuchi, Kensuke Nakanishi, Tsuyoshi Baba
  • Patent number: 8050443
    Abstract: A microphone contains a capacitor in a capsule with a diaphragm serving as one of electrodes of the capacitor. The microphone is mounted on a mounting board when external terminals installed on an external surface of a circuit board which closes an opening of the capsule are connected face to face with connection terminals on the mounting board. A sound hole is formed in the circuit board and through-hole is formed in the mounting board, being placed in such a position as to avoid overlapping each other when the microphone is mounted. An enclosed space which communicates the through-hole and sound hole is formed when the external terminals are connected with the connection terminals on the mounting board.
    Type: Grant
    Filed: November 1, 2007
    Date of Patent: November 1, 2011
    Assignee: Hosiden Corporation
    Inventors: Toshiro Izuchi, Kazuo Ono, Kensuke Nakanishi, Kiyoshi Ota, Tsuyoshi Baba
  • Publication number: 20110261987
    Abstract: A condenser microphone includes a housing (7) formed by combining: a top face member (15) as a top face; a bottom face member (5) as a bottom face; and intermediate members (13,14) disposed between the top face member (15) and the bottom face member (5). In the top face member (15) or the bottom face member (5), sonic holes (15a,15b) configured to allow a sound to enter an internal space is provided, and the internal space of the housing (7) is partitioned into a space extending from the sonic hole (15a) to one face of a vibrating membrane electrode (9) and a space extending from the sonic hole (15b) to the other face of the vibrating membrane electrode (9).
    Type: Application
    Filed: July 25, 2008
    Publication date: October 27, 2011
    Applicant: HOSIDEN CORPORATION
    Inventors: Kensuke Nakanishi, Ryuji Awamura
  • Patent number: 8038914
    Abstract: In a method for producing a molded article having a resin part, the resin part is injection-molded to an opening of a main body part and the molded article has an excellent air-tightness between the resin part and the main body part. A foam sealant is attached to a peripheral portion around the opening of the main body part. Attached to the main body part is a retainer made of the same kind of resin as injected resin and adapted to keep the foam sealant compressed in its thickness direction. The main body part is placed within a mold so that the retainer is exposed inside a cavity of the mold. A molten resin is injected into the cavity of the mold. The injected resin and the retainer are integrated into the resin part.
    Type: Grant
    Filed: November 6, 2006
    Date of Patent: October 18, 2011
    Assignees: Toyota Jidosha Kabushiki Kaisha, Matsuo Industries Inc.
    Inventors: Yoshikazu Suzuki, Tomokiyo Suzuki, Hironao Hayashi, Osamu Kuriyagawa, Iori Kobayashi, Kensuke Nakanishi, Toru Takahashi, Yuki Yamakawa, Masanori Sumida
  • Patent number: 7974430
    Abstract: In order to automate a microphone assembly process including a dust-proof treatment, an object of the present invention is to provide a dust-proof microphone having a configuration suitable for automated assembly. According to the present invention, a microphone has a plate-like or film-like dust-proof section that is disposed in a conductive housing (capsule) having a sound aperture and covers the sound aperture. The dust-proof section has a plurality of pores at least in a region corresponding to the sound aperture, and the dust-proof section further has a nonporous region. In the case of an electret condenser microphone, from the viewpoint of performance of the microphone, the dust-proof section is conductive. In addition, taking into account a soldering in a reflow furnace, the dust-proof section is heat-resistant. Each pore is desirably designed taking into account the environment for the usage of the microphone.
    Type: Grant
    Filed: January 27, 2006
    Date of Patent: July 5, 2011
    Assignee: Hosiden Corporation
    Inventors: Toshiro Izuchi, Kazuo Ono, Kensuke Nakanishi, Hiroaki Onishi
  • Publication number: 20110135122
    Abstract: A microphone has a housing (9) defining an acoustic hole (99) and having inner faces. The microphone includes a MEMS capacitor (1) secured to and electrically connected with a first face (6) of the inner faces of the housing (9), the first face defining the acoustic hole (99), a detecting circuit (7) secured to and electrically connected with a second face (8) of the inner faces of the housing (9), the second face (8) being not adjacent the first face (6), the detecting circuit (7) detecting at least a change in the electrostatic capacity of the MEMS capacitor (1). The microphone further includes a flexible substrate (4) secured to the first face (6) and the second face (8) and disposed under a bent state inside the housing (9). The flexible substrate (4) establishes electrical connection between the MEMS capacitor (1) and the detecting circuit (7) via a wire electrically connecting the first face (6) and the second face (8).
    Type: Application
    Filed: December 1, 2010
    Publication date: June 9, 2011
    Applicant: HOSIDEN CORPORATION
    Inventors: Ryuji Awamura, Noriaki Hanada, Kensuke Nakanishi, Tetsuo Toyoda
  • Patent number: 7907743
    Abstract: An object of the present invention is to provide an electro-acoustic transducer having the effects of absorbing vibration and high-frequency noise, reducing the number of components, and preventing heat conduction at the same time. An electro-acoustic transducer according to the present invention includes: an electrically conductive capsule having an opening for electrically connecting internal circuitry to an external object; terminals which protrude from the opening to the outside; and a raised part which is a portion of the capsule on the opening side and is spaced with a gap from the internal structure of the capsule. The raised part and the terminals are arranged in such a manner that the raised part and all of the terminals are able to be directly soldered to a wiring board. The raised part may extend toward the terminals in such a manner that the opening is narrowed. Furthermore, the raised part may have a slit extending to the boundary between the raised part and the other part of the capsule.
    Type: Grant
    Filed: June 8, 2006
    Date of Patent: March 15, 2011
    Assignee: Hosiden Corporation
    Inventors: Toshiro Izuchi, Kazuo Ono, Kensuke Nakanishi, Hiroaki Onishi, Ryuji Awamura
  • Publication number: 20110013788
    Abstract: An electret condenser microphone includes a conductive capsule including an opening formed in a top member, a capacitor section including a diaphragm, a back electrode plate arranged to face either surface of the diaphragm, and a electret layer provided on the diaphragm or the back electrode plate, which are housed in the capsule, and a cap member provided between the capacitor section and the top member of the capsule and including an acoustic hole formed in a portion exposed to the outside through the opening, wherein the cap member further includes a suctioned portion formed in a central portion thereof to be drawn by a suction-type transporting device, the acoustic holes being arranged along the circumference of the suctioned portion.
    Type: Application
    Filed: November 4, 2008
    Publication date: January 20, 2011
    Applicant: HOSIDEN CORPORATION
    Inventors: Toshiro Izuchi, Kensuke Nakanishi, Tsuyoshi Baba
  • Publication number: 20110002483
    Abstract: There is provided a condenser microphone that has improved portability and that can be realized at low costs.
    Type: Application
    Filed: June 16, 2010
    Publication date: January 6, 2011
    Applicant: HOSIDEN CORPORATION
    Inventors: Hiroyuki Harano, Hiroshi Yamagata, Kazuo Ono, Kensuke Nakanishi
  • Patent number: 7824194
    Abstract: A case with a connector integrally formed with a resin connector, and can be manufactured with a small number of processes is provided. The connector case includes a housing, a resin connector, and a ground terminal extending along an outer periphery of the connector. A terminal-side fixing portion extending backward from the ground terminal is crimped to or pressed over a housing-side fixing portion. When molds are closed after the housing and the ground terminal are placed in the molds for injection molding of the resin connector, a pressing portion formed on the mold presses the terminal-side fixing portion against the housing-side fixing portion to crimp or press the terminal-side fixing portion to or over the housing-side fixing portion. As a result, in the process for the injection molding of the connector, the ground terminal is fixed to the housing at the same time. The connector case with the ground terminal fixed to the housing can be manufactured in a small number of processes.
    Type: Grant
    Filed: March 1, 2007
    Date of Patent: November 2, 2010
    Assignees: Toyota Jidosha Kabushiki Kaisha, Matsuo Industries, Inc.
    Inventors: Yoshikazu Suzuki, Akira Ishimaru, Tomokiyo Suzuki, Hironao Hayashi, Shigeru Hayashida, Osamu Kuriyagawa, Iori Kobayashi, Kensuke Nakanishi, Toru Takahashi, Yuki Yamakawa, Masanori Sumida
  • Patent number: 7687723
    Abstract: To provide a mounting substrate that requires a reduced amount of solder and reduces a thermal effect of solder on the interior of an electronic component, and a microphone to be mounted on the substrate. A mounting substrate according to the present invention includes: a solder part formed on a part of an electrode formed on the mounting substrate; a resist film formed to prevent the solder of the solder part from flowing out of a predetermined range; and a gas-escape groove that is constituted by the absence of the electrode and the resist film and allows gas produced during soldering to escape.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: March 30, 2010
    Assignee: Hosiden Corporation
    Inventors: Toshiro Izuchi, Kazuo Ono, Kensuke Nakanishi, Hiroaki Onishi
  • Publication number: 20090226012
    Abstract: An electret condenser microphone is provided that can reduce parasitic capacitance and realize enhanced sensitivity The electret condenser microphone includes a capacitor section including a fixed electrode having an electret member and a diaphragm electrode, a casing section housing the capacitor section, a circuit board including a converter circuit 4 for converting variations of capacitance of the capacitor section caused by vibrations of the diaphragm electrode to electric signals for output, and conducting elements for making the capacitor conductive with the circuit board, in which the casing section has a shape as viewed from top different from a shape of the capacitor as viewed from top to provide different distances between outer sides of the capacitor section and the casing section circumferentially of the capacitor section as viewed from top.
    Type: Application
    Filed: April 12, 2007
    Publication date: September 10, 2009
    Applicant: HOSIDEN CORPORATION
    Inventors: Toshiro Izuchi, Kensuke Nakanishi, Ryuji Awamura
  • Publication number: 20090129621
    Abstract: Two microphone assemblies 3 each having a main sound hole 61M and an auxiliary sound hole 61S are placed at a distance from each other facing the same direction, the main sound hole 61M being offset to one side with respect to an axis of an electret condenser microphone 4 and communicated with a rear face 4B of the electret condenser microphone 4 and the auxiliary sound hole 61S being offset to the opposite side of the axis of the electret condenser microphone 4 from the main sound hole 61M. The auxiliary sound holes 61S are provided in one face 1F of a housing 10 and the main sound holes 61M are provided in other faces 1R and 1L continuous with the face 1F of the housing 10. Directional axes extending from the respective auxiliary sound holes 61S to the respective main sound holes 61M are separated from each other at an angle.
    Type: Application
    Filed: May 25, 2006
    Publication date: May 21, 2009
    Applicant: Hosiden Corporation
    Inventors: Toshiro Izuchi, Kensuke Nakanishi, Ryuji Awamura