Patents by Inventor Klaus Gunter

Klaus Gunter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100170858
    Abstract: The invention relates to a cartridge (1) for accommodating blood bags (35), which is provided for the separation of blood components for the application in a centrifuge. The cartridge (1) has a partition wall (3) which separates a blood bag section (5) positioned radially inside from a product section (7) positioned radially outside, and a cover (9) disposed in a mounting position above the blood bag section (5). The cover (9) is connected to the partition wall (3) pivotally in a first point (11) and detachably in a second point (13), so that the blood bag section (5) is freely accessible by means of laterally pivoting the cover (9) out of the way. The cartridge is applicable in the rotor of a centrifuge.
    Type: Application
    Filed: June 4, 2008
    Publication date: July 8, 2010
    Inventors: Klaus-Gunter Eberle, Roland Biset
  • Publication number: 20100152013
    Abstract: A cartridge (1) for accommodating blood bags (35) to be inserted into a centrifuge is used for the separation of blood components. Said cartridge (1) is provided with a partition wall (3) which separates a blood bag section (5) positioned radially inside from a product section (7) positioned radially outside, wherein a fixture (29) for a filter (31) is provided in the product section (7), a product transport path (36) which leads from the blood bag section (5) via the fixture (29) for the filter (31) to the product section (7). The product transport path (36) coming from the blood bag section (5) leads into the fixture (29) for the filter (31) radially from the outside and from below.
    Type: Application
    Filed: March 14, 2008
    Publication date: June 17, 2010
    Inventors: Klaus-Gunter Eberle, Roland Biset
  • Patent number: 7692317
    Abstract: Apparatus for housing a micromechanical structure, and a method for producing the housing. The apparatus has a substrate having a main side on which the micromechanical structure is formed, a photo-resist material structure surrounding the micromechanical structure to form a cavity together with the substrate between the substrate and the photo-resist material structure, wherein the cavity separates the micromechanical structure and the photo-resist material structure and has an opening, and a closure for closing the opening to close the cavity.
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: April 6, 2010
    Assignee: Infineon Technologies AG
    Inventors: Martin Franosch, Andreas Meckes, Winfried Nessler, Klaus-Gunter Oppermann
  • Publication number: 20090324370
    Abstract: The invention provides a device (10) for feeding sample containers (18) with an analysis sample (P) to be treated, to a treating apparatus (12) for treating the analysis sample (P), in particular to a centrifuge. The device comprises a conveyer (26, 27) for conveying at least one sample container (14) or at least one carrier containing a sample container (14), wherein the conveyer (26, 27) is configured for receiving multiple sample containers (14) and/or carriers and forms a circulating endless conveyer track. The device further comprises an input station (18) for handing over a sample container (14) or a carrier to the conveyer (26, 27). The input station (18) is displaced (V1, V2), with respect to the conveyer (26, 27), obliquely to the conveying direction (26b, 27b) of the conveyer (26, 27).
    Type: Application
    Filed: June 23, 2009
    Publication date: December 31, 2009
    Applicant: Andreas Hettich GmbH & Co. KG
    Inventor: KLAUS-GUNTER EBERLE
  • Patent number: 7564328
    Abstract: Filter and manifold compensation assemblies for thermal compensation of a filter cavity and a manifold which include at least one a lever element pivotally coupled to the filter or manifold at a first pivot point, an anchoring element pivotally coupled to the lever element at the second pivot point and secured to the housing of the filter or manifold, and a thermal expansion element having a lower coefficient of thermal expansion than the filter cavity or manifold and pivotally coupled to the lever element. The relative thermal expansion of the thermal expansion element in comparison with the thermal expansion of the filter or manifold causes the lever element to articulate and to displace the housing for thermal compensation. The degree of each displacement is proportional to the ratio between the distance between the second and first pivot points and the distance between the second and the third pivot points.
    Type: Grant
    Filed: February 20, 2009
    Date of Patent: July 21, 2009
    Assignee: Com Dev International Ltd.
    Inventors: Klaus Gunter Engel, Mihai Vladimirescu
  • Patent number: 7564327
    Abstract: Filter and manifold compensation assemblies for thermal compensation of a filter cavity and a manifold which include at least one a lever element pivotally coupled to the filter or manifold at a first pivot point, an anchoring element pivotally coupled to the lever element at the second pivot point and secured to the housing of the filter or manifold, and a thermal expansion element having a lower coefficient of thermal expansion than the filter cavity or manifold and pivotally coupled to the lever element. The relative thermal expansion of the thermal expansion element in comparison with the thermal expansion of the filter or manifold causes the lever element to articulate and to displace the housing for thermal compensation. The degree of each displacement is proportional to the ratio between the distance between the second and first pivot points and the distance between the second and the third pivot points.
    Type: Grant
    Filed: October 5, 2006
    Date of Patent: July 21, 2009
    Assignee: COM DEV International Ltd.
    Inventors: Klaus Gunter Engel, Mihai Vladimirescu
  • Publication number: 20090153274
    Abstract: Filter and manifold compensation assemblies for thermal compensation of a filter cavity and a manifold which include at least one a lever element pivotally coupled to the filter or manifold at a first pivot point, an anchoring element pivotally coupled to the lever element at the second pivot point and secured to the housing of the filter or manifold, and a thermal expansion element having a lower coefficient of thermal expansion than the filter cavity or manifold and pivotally coupled to the lever element. The relative thermal expansion of the thermal expansion element in comparison with the thermal expansion of the filter or manifold causes the lever element to articulate and to displace the housing for thermal compensation. The degree of each displacement is proportional to the ratio between the distance between the second and first pivot points and the distance between the second and the third pivot points.
    Type: Application
    Filed: February 20, 2009
    Publication date: June 18, 2009
    Inventors: Klaus Gunter Engel, Mihai Vladimirescu
  • Publication number: 20080280953
    Abstract: The present invention relates to inter alia the use of known compounds for the treatment of seed.
    Type: Application
    Filed: September 21, 2005
    Publication date: November 13, 2008
    Applicant: Bayer Cropscience AG
    Inventors: Ulrich Gorgens, Peter Jeschke, Peter Losel, Olga Malsam, Ralf Nauen, Klaus-Gunter Tietjen, Robert Velten, Leonardo Pitta, Christian Arnold, Waltraud Hempel, Erich Sanwald
  • Publication number: 20080084258
    Abstract: Filter and manifold compensation assemblies for thermal compensation of a filter cavity and a manifold which include at least one a lever element pivotally coupled to the filter or manifold at a first pivot point, an anchoring element pivotally coupled to the lever element at the second pivot point and secured to the housing of the filter or manifold, and a thermal expansion element having a lower coefficient of thermal expansion than the filter cavity or manifold and pivotally coupled to the lever element. The relative thermal expansion of the thermal expansion element in comparison with the thermal expansion of the filter or manifold causes the lever element to articulate and to displace the housing for thermal compensation. The degree of each displacement is proportional to the ratio between the distance between the second and first pivot points and the distance between the second and the third pivot points.
    Type: Application
    Filed: October 5, 2006
    Publication date: April 10, 2008
    Applicant: COM DEV International Ltd.
    Inventors: Klaus Gunter Engel, Mihai Vladimirescu
  • Publication number: 20080017974
    Abstract: Apparatus for housing a micromechanical structure, and a method for producing the housing. The apparatus has a substrate having a main side on which the micromechanical structure is formed, a photo-resist material structure surrounding the micromechanical structure to form a cavity together with the substrate between the substrate and the photo-resist material structure, wherein the cavity separates the micromechanical structure and the photo-resist material structure and has an opening, and a closure for closing the opening to close the cavity.
    Type: Application
    Filed: September 28, 2007
    Publication date: January 24, 2008
    Applicant: Infineon Technologies AG
    Inventors: MARTIN FRANOSCH, Andreas Meckes, Winfried Nessler, Klaus-Gunter Oppermann
  • Patent number: 7300823
    Abstract: Apparatus for housing a micromechanical structure, and a method for producing the housing. The apparatus has a substrate having a main side on which the micromechanical structure is formed, a photo-resist material structure surrounding the micromechanical structure to form a cavity together with the substrate between the substrate and the photo-resist material structure, wherein the cavity separates the micromechanical structure and the photo-resist material structure and has an opening, and a closure for closing the opening to close the cavity.
    Type: Grant
    Filed: November 17, 2004
    Date of Patent: November 27, 2007
    Assignee: Infineon Technologies AG
    Inventors: Martin Franosch, Andreas Meckes, Winfried Nessler, Klaus-Gunter Oppermann
  • Patent number: 7234237
    Abstract: In a method for producing a protective cover for a device formed in a substrate, at first a sacrificial structure is produced on the substrate, wherein the sacrificial structure comprises a first portion covering a first area of the substrate including the device and a second portion extending from the first portion into a second area of the substrate including no device. Then a first cover layer is deposited that encloses the sacrificial structure such that the second portion of the sacrificial structure is at least partially exposed. Then the sacrificial structure is removed, and the structure formed by the removal of the sacrificial structure is closed.
    Type: Grant
    Filed: April 9, 2004
    Date of Patent: June 26, 2007
    Assignee: Infineon Technologies AG
    Inventors: Martin Franosch, Andreas Meckes, Klaus-Günter Oppermann
  • Patent number: 7135947
    Abstract: A hybrid switch actuator having six positions that are stable in the absence of current and in which displacement occurs between an initial position and a target position under the action of a current. The actuator includes a stator and a rotationally moveable rotor package. The stator has six pole shoes. Each pair of opposed pole shoes is equipped with a common exciting coil. The rotor package has two pairs of rotor poles magnetized transversely in alternate directions and a permanent magnet ring and two end caps adapted to be engaged around said permanent magnet ring. Each end cap is associated with two rotor poles having maximum radius regions that correspond to the area of each of the stator pole shoes and reduced radius regions positioned adjacent the maximum radius regions such that each rotor pole can be precisely aligned with each stator pole shoe.
    Type: Grant
    Filed: January 29, 2004
    Date of Patent: November 14, 2006
    Assignee: Com Dev Ltd.
    Inventor: Klaus Gunter Engel
  • Publication number: 20060228267
    Abstract: The invention relates to a reaction chamber system (10, 70) for processing samples, comprising a reaction chamber (12), a sample carrier (26) arranged at least in the reaction chamber (12). When in operation, said sample carrier can be displaced in relation to the reaction chamber (12) by means of a drive device (30) which is coupled to the sample carrier (26). The reaction chamber system also comprises heating means (50) for warming the samples. The invention is characterized in that the heating means (50, 54) are arranged on the sample carrier (26) and can be displaced with the sample carrier (26) when in operation.
    Type: Application
    Filed: December 18, 2003
    Publication date: October 12, 2006
    Applicant: Hettlab AG
    Inventor: Klaus-Gunter Eberle
  • Patent number: 7045960
    Abstract: A high-pressure discharge lamp for motor vehicle headlamps having a mercury-free ionizable fill which consists of xenon with a cold filling pressure of at least 2000 hPa and metal halides. The discharge vessel has a tubular section (10) which consists of a transparent ceramic and has an internal diameter which is less than or equal to 2 mm and inside which there are arranged electrodes with a spacing less than or equal to 10 mm.
    Type: Grant
    Filed: August 22, 2003
    Date of Patent: May 16, 2006
    Assignee: Patent Treuhand-Gesellschaft für elektrische Glühlampen mbH
    Inventor: Klaus Gunter
  • Patent number: 6955950
    Abstract: In a method for generating a protective cover for a device, where a substrate is provided, which comprises the device, first, a sacrificial pattern is generated on the substrate. The sacrificial pattern covers at least an area of the substrate, which comprises the device. Then, a polymer layer is deposited, which comprises at least on sacrificial pattern. Then, an opening will be formed in the polymer layer to expose a portion of the sacrificial pattern. Then, the sacrificial pattern will be removed and the formed opening in the polymer layer is closed.
    Type: Grant
    Filed: July 9, 2004
    Date of Patent: October 18, 2005
    Assignee: Infineon Technologies AG
    Inventors: Robert Aigner, Martin Franosch, Andreas Meckes, Klaus-Günter Oppermann, Marc Strasser
  • Patent number: 6939734
    Abstract: In a method for producing a protective cover for a device which is formed in a substrate, a first cover layer is initially deposited on the substrate, the first cover layer covering an area of the substrate which includes the device. Subsequently, an opening is formed in the first cover layer, the opening exposing that area of the substrate which includes the device. Then the opening formed in the first cover layer is filled up using a filling material. Subsequently, a second cover layer is deposited on the first cover layer and in the opening of the first cover layer which is filled up with the filling material. Thereafter, an opening is formed in the second cover layer to expose an area of the filling material. Finally, the filling material covering that area of the substrate which includes the device is removed, and the opening formed in the second cover layer is closed.
    Type: Grant
    Filed: April 8, 2004
    Date of Patent: September 6, 2005
    Assignee: Infineon Technologies AG
    Inventors: Martin Franosch, Andreas Meckes, Klaus-Günter Oppermann
  • Publication number: 20050174053
    Abstract: A high-pressure discharge lamp for motor vehicle headlamps having a mercury-free ionizable fill which consists of xenon with a cold filling pressure of at least 2 000 hPa and metal halides. The discharge vessel has a tubular section (10) which consists of a transparent ceramic and has an internal diameter which is less than or equal to 2 mm and inside which there are arranged electrodes with a spacing less than or equal to 10 mm.
    Type: Application
    Filed: August 22, 2003
    Publication date: August 11, 2005
    Applicant: PATENT-TREUHAND-GESELLSCHAFT FUR ELEKTRISCH GLUHLAMPEN MBH
    Inventor: Klaus Gunter
  • Publication number: 20050146022
    Abstract: Apparatus for housing a micromechanical structure, and a method for producing the housing. The apparatus has a substrate having a main side on which the micromechanical structure is formed, a photo-resist material structure surrounding the micromechanical structure to form a cavity together with the substrate between the substrate and the photo-resist material structure, wherein the cavity separates the micromechanical structure and the photo-resist material structure and has an opening, and a closure for closing the opening to close the cavity.
    Type: Application
    Filed: November 17, 2004
    Publication date: July 7, 2005
    Applicant: Infineon Technologies AG
    Inventors: Martin Franosch, Andreas Meckes, Winfried Nessler, Klaus-Gunter Oppermann
  • Publication number: 20050148205
    Abstract: In a method for producing a protective cover for a device formed in a substrate, at first a sacrificial structure is produced on the substrate, wherein the sacrificial structure comprises a first portion covering a first area of the substrate including the device and a second portion extending from the first portion into a second area of the substrate including no device. Then a first cover layer is deposited that encloses the sacrificial structure such that the second portion of the sacrificial structure is at least partially exposed. Then the sacrificial structure is removed, and the structure formed by the removal of the sacrificial structure is closed.
    Type: Application
    Filed: April 9, 2004
    Publication date: July 7, 2005
    Applicant: Infineon Technologies AG
    Inventors: Martin Franosch, Andreas Meckes, Klaus-Gunter Oppermann