Patents by Inventor Klaus Gunter
Klaus Gunter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20100170858Abstract: The invention relates to a cartridge (1) for accommodating blood bags (35), which is provided for the separation of blood components for the application in a centrifuge. The cartridge (1) has a partition wall (3) which separates a blood bag section (5) positioned radially inside from a product section (7) positioned radially outside, and a cover (9) disposed in a mounting position above the blood bag section (5). The cover (9) is connected to the partition wall (3) pivotally in a first point (11) and detachably in a second point (13), so that the blood bag section (5) is freely accessible by means of laterally pivoting the cover (9) out of the way. The cartridge is applicable in the rotor of a centrifuge.Type: ApplicationFiled: June 4, 2008Publication date: July 8, 2010Inventors: Klaus-Gunter Eberle, Roland Biset
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Publication number: 20100152013Abstract: A cartridge (1) for accommodating blood bags (35) to be inserted into a centrifuge is used for the separation of blood components. Said cartridge (1) is provided with a partition wall (3) which separates a blood bag section (5) positioned radially inside from a product section (7) positioned radially outside, wherein a fixture (29) for a filter (31) is provided in the product section (7), a product transport path (36) which leads from the blood bag section (5) via the fixture (29) for the filter (31) to the product section (7). The product transport path (36) coming from the blood bag section (5) leads into the fixture (29) for the filter (31) radially from the outside and from below.Type: ApplicationFiled: March 14, 2008Publication date: June 17, 2010Inventors: Klaus-Gunter Eberle, Roland Biset
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Patent number: 7692317Abstract: Apparatus for housing a micromechanical structure, and a method for producing the housing. The apparatus has a substrate having a main side on which the micromechanical structure is formed, a photo-resist material structure surrounding the micromechanical structure to form a cavity together with the substrate between the substrate and the photo-resist material structure, wherein the cavity separates the micromechanical structure and the photo-resist material structure and has an opening, and a closure for closing the opening to close the cavity.Type: GrantFiled: September 28, 2007Date of Patent: April 6, 2010Assignee: Infineon Technologies AGInventors: Martin Franosch, Andreas Meckes, Winfried Nessler, Klaus-Gunter Oppermann
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Publication number: 20090324370Abstract: The invention provides a device (10) for feeding sample containers (18) with an analysis sample (P) to be treated, to a treating apparatus (12) for treating the analysis sample (P), in particular to a centrifuge. The device comprises a conveyer (26, 27) for conveying at least one sample container (14) or at least one carrier containing a sample container (14), wherein the conveyer (26, 27) is configured for receiving multiple sample containers (14) and/or carriers and forms a circulating endless conveyer track. The device further comprises an input station (18) for handing over a sample container (14) or a carrier to the conveyer (26, 27). The input station (18) is displaced (V1, V2), with respect to the conveyer (26, 27), obliquely to the conveying direction (26b, 27b) of the conveyer (26, 27).Type: ApplicationFiled: June 23, 2009Publication date: December 31, 2009Applicant: Andreas Hettich GmbH & Co. KGInventor: KLAUS-GUNTER EBERLE
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Patent number: 7564328Abstract: Filter and manifold compensation assemblies for thermal compensation of a filter cavity and a manifold which include at least one a lever element pivotally coupled to the filter or manifold at a first pivot point, an anchoring element pivotally coupled to the lever element at the second pivot point and secured to the housing of the filter or manifold, and a thermal expansion element having a lower coefficient of thermal expansion than the filter cavity or manifold and pivotally coupled to the lever element. The relative thermal expansion of the thermal expansion element in comparison with the thermal expansion of the filter or manifold causes the lever element to articulate and to displace the housing for thermal compensation. The degree of each displacement is proportional to the ratio between the distance between the second and first pivot points and the distance between the second and the third pivot points.Type: GrantFiled: February 20, 2009Date of Patent: July 21, 2009Assignee: Com Dev International Ltd.Inventors: Klaus Gunter Engel, Mihai Vladimirescu
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Patent number: 7564327Abstract: Filter and manifold compensation assemblies for thermal compensation of a filter cavity and a manifold which include at least one a lever element pivotally coupled to the filter or manifold at a first pivot point, an anchoring element pivotally coupled to the lever element at the second pivot point and secured to the housing of the filter or manifold, and a thermal expansion element having a lower coefficient of thermal expansion than the filter cavity or manifold and pivotally coupled to the lever element. The relative thermal expansion of the thermal expansion element in comparison with the thermal expansion of the filter or manifold causes the lever element to articulate and to displace the housing for thermal compensation. The degree of each displacement is proportional to the ratio between the distance between the second and first pivot points and the distance between the second and the third pivot points.Type: GrantFiled: October 5, 2006Date of Patent: July 21, 2009Assignee: COM DEV International Ltd.Inventors: Klaus Gunter Engel, Mihai Vladimirescu
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Publication number: 20090153274Abstract: Filter and manifold compensation assemblies for thermal compensation of a filter cavity and a manifold which include at least one a lever element pivotally coupled to the filter or manifold at a first pivot point, an anchoring element pivotally coupled to the lever element at the second pivot point and secured to the housing of the filter or manifold, and a thermal expansion element having a lower coefficient of thermal expansion than the filter cavity or manifold and pivotally coupled to the lever element. The relative thermal expansion of the thermal expansion element in comparison with the thermal expansion of the filter or manifold causes the lever element to articulate and to displace the housing for thermal compensation. The degree of each displacement is proportional to the ratio between the distance between the second and first pivot points and the distance between the second and the third pivot points.Type: ApplicationFiled: February 20, 2009Publication date: June 18, 2009Inventors: Klaus Gunter Engel, Mihai Vladimirescu
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Publication number: 20080280953Abstract: The present invention relates to inter alia the use of known compounds for the treatment of seed.Type: ApplicationFiled: September 21, 2005Publication date: November 13, 2008Applicant: Bayer Cropscience AGInventors: Ulrich Gorgens, Peter Jeschke, Peter Losel, Olga Malsam, Ralf Nauen, Klaus-Gunter Tietjen, Robert Velten, Leonardo Pitta, Christian Arnold, Waltraud Hempel, Erich Sanwald
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Publication number: 20080084258Abstract: Filter and manifold compensation assemblies for thermal compensation of a filter cavity and a manifold which include at least one a lever element pivotally coupled to the filter or manifold at a first pivot point, an anchoring element pivotally coupled to the lever element at the second pivot point and secured to the housing of the filter or manifold, and a thermal expansion element having a lower coefficient of thermal expansion than the filter cavity or manifold and pivotally coupled to the lever element. The relative thermal expansion of the thermal expansion element in comparison with the thermal expansion of the filter or manifold causes the lever element to articulate and to displace the housing for thermal compensation. The degree of each displacement is proportional to the ratio between the distance between the second and first pivot points and the distance between the second and the third pivot points.Type: ApplicationFiled: October 5, 2006Publication date: April 10, 2008Applicant: COM DEV International Ltd.Inventors: Klaus Gunter Engel, Mihai Vladimirescu
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Publication number: 20080017974Abstract: Apparatus for housing a micromechanical structure, and a method for producing the housing. The apparatus has a substrate having a main side on which the micromechanical structure is formed, a photo-resist material structure surrounding the micromechanical structure to form a cavity together with the substrate between the substrate and the photo-resist material structure, wherein the cavity separates the micromechanical structure and the photo-resist material structure and has an opening, and a closure for closing the opening to close the cavity.Type: ApplicationFiled: September 28, 2007Publication date: January 24, 2008Applicant: Infineon Technologies AGInventors: MARTIN FRANOSCH, Andreas Meckes, Winfried Nessler, Klaus-Gunter Oppermann
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Patent number: 7300823Abstract: Apparatus for housing a micromechanical structure, and a method for producing the housing. The apparatus has a substrate having a main side on which the micromechanical structure is formed, a photo-resist material structure surrounding the micromechanical structure to form a cavity together with the substrate between the substrate and the photo-resist material structure, wherein the cavity separates the micromechanical structure and the photo-resist material structure and has an opening, and a closure for closing the opening to close the cavity.Type: GrantFiled: November 17, 2004Date of Patent: November 27, 2007Assignee: Infineon Technologies AGInventors: Martin Franosch, Andreas Meckes, Winfried Nessler, Klaus-Gunter Oppermann
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Patent number: 7234237Abstract: In a method for producing a protective cover for a device formed in a substrate, at first a sacrificial structure is produced on the substrate, wherein the sacrificial structure comprises a first portion covering a first area of the substrate including the device and a second portion extending from the first portion into a second area of the substrate including no device. Then a first cover layer is deposited that encloses the sacrificial structure such that the second portion of the sacrificial structure is at least partially exposed. Then the sacrificial structure is removed, and the structure formed by the removal of the sacrificial structure is closed.Type: GrantFiled: April 9, 2004Date of Patent: June 26, 2007Assignee: Infineon Technologies AGInventors: Martin Franosch, Andreas Meckes, Klaus-Günter Oppermann
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Patent number: 7135947Abstract: A hybrid switch actuator having six positions that are stable in the absence of current and in which displacement occurs between an initial position and a target position under the action of a current. The actuator includes a stator and a rotationally moveable rotor package. The stator has six pole shoes. Each pair of opposed pole shoes is equipped with a common exciting coil. The rotor package has two pairs of rotor poles magnetized transversely in alternate directions and a permanent magnet ring and two end caps adapted to be engaged around said permanent magnet ring. Each end cap is associated with two rotor poles having maximum radius regions that correspond to the area of each of the stator pole shoes and reduced radius regions positioned adjacent the maximum radius regions such that each rotor pole can be precisely aligned with each stator pole shoe.Type: GrantFiled: January 29, 2004Date of Patent: November 14, 2006Assignee: Com Dev Ltd.Inventor: Klaus Gunter Engel
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Publication number: 20060228267Abstract: The invention relates to a reaction chamber system (10, 70) for processing samples, comprising a reaction chamber (12), a sample carrier (26) arranged at least in the reaction chamber (12). When in operation, said sample carrier can be displaced in relation to the reaction chamber (12) by means of a drive device (30) which is coupled to the sample carrier (26). The reaction chamber system also comprises heating means (50) for warming the samples. The invention is characterized in that the heating means (50, 54) are arranged on the sample carrier (26) and can be displaced with the sample carrier (26) when in operation.Type: ApplicationFiled: December 18, 2003Publication date: October 12, 2006Applicant: Hettlab AGInventor: Klaus-Gunter Eberle
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Patent number: 7045960Abstract: A high-pressure discharge lamp for motor vehicle headlamps having a mercury-free ionizable fill which consists of xenon with a cold filling pressure of at least 2000 hPa and metal halides. The discharge vessel has a tubular section (10) which consists of a transparent ceramic and has an internal diameter which is less than or equal to 2 mm and inside which there are arranged electrodes with a spacing less than or equal to 10 mm.Type: GrantFiled: August 22, 2003Date of Patent: May 16, 2006Assignee: Patent Treuhand-Gesellschaft für elektrische Glühlampen mbHInventor: Klaus Gunter
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Patent number: 6955950Abstract: In a method for generating a protective cover for a device, where a substrate is provided, which comprises the device, first, a sacrificial pattern is generated on the substrate. The sacrificial pattern covers at least an area of the substrate, which comprises the device. Then, a polymer layer is deposited, which comprises at least on sacrificial pattern. Then, an opening will be formed in the polymer layer to expose a portion of the sacrificial pattern. Then, the sacrificial pattern will be removed and the formed opening in the polymer layer is closed.Type: GrantFiled: July 9, 2004Date of Patent: October 18, 2005Assignee: Infineon Technologies AGInventors: Robert Aigner, Martin Franosch, Andreas Meckes, Klaus-Günter Oppermann, Marc Strasser
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Patent number: 6939734Abstract: In a method for producing a protective cover for a device which is formed in a substrate, a first cover layer is initially deposited on the substrate, the first cover layer covering an area of the substrate which includes the device. Subsequently, an opening is formed in the first cover layer, the opening exposing that area of the substrate which includes the device. Then the opening formed in the first cover layer is filled up using a filling material. Subsequently, a second cover layer is deposited on the first cover layer and in the opening of the first cover layer which is filled up with the filling material. Thereafter, an opening is formed in the second cover layer to expose an area of the filling material. Finally, the filling material covering that area of the substrate which includes the device is removed, and the opening formed in the second cover layer is closed.Type: GrantFiled: April 8, 2004Date of Patent: September 6, 2005Assignee: Infineon Technologies AGInventors: Martin Franosch, Andreas Meckes, Klaus-Günter Oppermann
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Publication number: 20050174053Abstract: A high-pressure discharge lamp for motor vehicle headlamps having a mercury-free ionizable fill which consists of xenon with a cold filling pressure of at least 2 000 hPa and metal halides. The discharge vessel has a tubular section (10) which consists of a transparent ceramic and has an internal diameter which is less than or equal to 2 mm and inside which there are arranged electrodes with a spacing less than or equal to 10 mm.Type: ApplicationFiled: August 22, 2003Publication date: August 11, 2005Applicant: PATENT-TREUHAND-GESELLSCHAFT FUR ELEKTRISCH GLUHLAMPEN MBHInventor: Klaus Gunter
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Publication number: 20050146022Abstract: Apparatus for housing a micromechanical structure, and a method for producing the housing. The apparatus has a substrate having a main side on which the micromechanical structure is formed, a photo-resist material structure surrounding the micromechanical structure to form a cavity together with the substrate between the substrate and the photo-resist material structure, wherein the cavity separates the micromechanical structure and the photo-resist material structure and has an opening, and a closure for closing the opening to close the cavity.Type: ApplicationFiled: November 17, 2004Publication date: July 7, 2005Applicant: Infineon Technologies AGInventors: Martin Franosch, Andreas Meckes, Winfried Nessler, Klaus-Gunter Oppermann
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Publication number: 20050148205Abstract: In a method for producing a protective cover for a device formed in a substrate, at first a sacrificial structure is produced on the substrate, wherein the sacrificial structure comprises a first portion covering a first area of the substrate including the device and a second portion extending from the first portion into a second area of the substrate including no device. Then a first cover layer is deposited that encloses the sacrificial structure such that the second portion of the sacrificial structure is at least partially exposed. Then the sacrificial structure is removed, and the structure formed by the removal of the sacrificial structure is closed.Type: ApplicationFiled: April 9, 2004Publication date: July 7, 2005Applicant: Infineon Technologies AGInventors: Martin Franosch, Andreas Meckes, Klaus-Gunter Oppermann