Abstract: In a method for generating a protective cover for a device, where a substrate is provided, which comprises the device, first, a sacrificial pattern is generated on the substrate. The sacrificial pattern covers at least an area of the substrate, which comprises the device. Then, a polymer layer is deposited, which comprises at least on sacrificial pattern. Then, an opening will be formed in the polymer layer to expose a portion of the sacrificial pattern. Then, the sacrificial pattern will be removed and the formed opening in the polymer layer is closed.

Abstract: In a method for producing a protective cover for a device which is formed in a substrate, a first cover layer is initially deposited on the substrate, the first cover layer covering an area of the substrate which includes the device. Subsequently, an opening is formed in the first cover layer, the opening exposing that area of the substrate which includes the device. Then the opening formed in the first cover layer is filled up using a filling material. Subsequently, a second cover layer is deposited on the first cover layer and in the opening of the first cover layer which is filled up with the filling material. Thereafter, an opening is formed in the second cover layer to expose an area of the filling material. Finally, the filling material covering that area of the substrate which includes the device is removed, and the opening formed in the second cover layer is closed.

Abstract: A semiconductor component includes a semiconductor body of a first conductivity type which accommodates a space charge region. Semiconductor regions of a second conductivity type are disposed in at least one plane extending essentially perpendicularly to a connecting line extending between two electrodes. A cell array is disposed under one of the electrodes in the semiconductor body. At least some of the semiconductor regions of the second conductivity type are connected to the cell array via filiform semiconductor zones of the second conductivity type in order to expedite switching processes. A method for fabricating such a semiconductor component is also provided.

Abstract: A laser diode in a recorder is thermally stabilized. The laser diode is used to produce a light beam, which is modulated by superimposing a basic current and a modulation current derived from an image signal, and exposes a recording material point by point and line by line. Between the exposure periods, wherein in each case one line is exposed, there are return periods, wherein the light beam is guided to the start of the next line, and wherein the laser diode is modulated for the purpose of thermal stabilization. In the return period, the laser diode is modulated with the basic current during a stabilization period, the sum of the modulation times during the exposure period and during the stabilization period being constant. In addition, during the return period, the laser diode can be modulated with a modulation current, which is derived from the inverted image signal from the preceding or the following line.

Abstract: A recess is produced in a material layer by creating at least a first and a second structure in various steps. The layers define each other laterally and extend to the bottom of the recess. The first structure and the second structure are so narrow that they can be made by creating conformally produced layers that have an independent thickness and are smaller than the depth of the recess. The conformally produced layers are formed in an appropriate deposition process. A covering structure can be produced on top of the first and second structure. An opening can be made in the covering structure, through which the first structure and the second structure can be removed in an etching step.

Abstract: A micromechanical component placed on a substrate face includes at least one cell. A counter-electrode of a cell capacitor is placed under a cavity. The counter-electrode can be made from a first part of a lower conductive layer. An optionally circular membrane used as an electrode of the capacitor is placed above the cavity. The membrane is homogeneous, has a substantially uniform thickness, and can be part of an upper conductive layer preferably supported by a second part of the lower conductive layer. A caustic channel used to remove the sacrificial coating in order to form the cavity is laterally connected thereto. The channel has a vertical dimension equal to the vertical dimension of the cavity. A closure is adjacent to the channel and disposed outside the membrane. The component can be used as a pressure sensor, and can have several cells each adjacent to six other cells. A process for fabricating a micromechanical component is also provided.

Abstract: Use of solid, finely divided urea compounds to prevent edge migration when stoving electrophoretically deposited electrodeposition lacquers, and electrodeposition lacquers with a content of 0.1 to 5 wt. % of urea compound, related to resin solids.

Abstract: A semiconductor component includes a semiconductor body of a first conductivity type which accommodates a space charge region. Semiconductor regions of a second conductivity type are disposed in at least one plane extending essentially perpendicularly to a connecting line extending between two electrodes. A cell array is disposed under one of the electrodes in the semiconductor body. At least some of the semiconductor regions of the second conductivity type are connected to the cell array via filiform semiconductor zones of the second conductivity type in order to expedite switching processes. A method for fabricating such a semiconductor component is also provided.

Abstract: A laser diode in a recorder is thermally stabilized. The laser diode is used to produce a light beam, which is modulated by superimposing a basic current and a modulation current derived from an image signal, and exposes a recording material point by point and line by line. Between the exposure periods, wherein in each case one line is exposed, there are return periods, wherein the light beam is guided to the start of the next line, and wherein the laser diode is modulated for the purpose of thermal stabilization. In the return period, the laser diode is modulated with the basic current during a stabilization period, the sum of the modulation times during the exposure period and during the stabilization period being constant. In addition, during the return period, the laser diode can be modulated with a modulation current, which is derived from the inverted image signal from the preceding or the following line.

Abstract: Etching openings are provided in a membrane above an etched-out cavity, only at a distance of at most one tenth of the diameter of the member away from the edge of the cavity. For production, a poly layer is applied to a sacrificial layer composed of SiO2 and is provided with rows of etching holes, through which channels are etched out in the sacrificial layer. The poly layer is oxidized and is made smooth by means of a planarization layer. Etching holes are produced in the edge region of the membrane layer. The sacrificial layer is removed over the entire area of the cavity which is to be produced, with the etching medium propagating sufficiently quickly through the channels.

Abstract: A method is disclosed for producing a micromechanical component. The micromechanical component has sensor holes, wherein at least one component protective layer and/or a spacer coating is applied on the component before separating the wafer into chips. The component protective layer sealingly covers at least the walls of the holes extending parallel to the surface of the wafer and perpendicular to the surface of the wafer and the spacer coating sealingly covers at least the walls of the holes extending parallel to the surface of the wafer.

Abstract: A micromechanical structure, such as a sensor, includes a substrate, a diaphragm, a cavity, a sacrificial layer and a terminating structure. The terminating structure is cut away in the region of the diaphragm in such a way that a media opening is located above the diaphragm. The diameter of the cavity is smaller over the entire circumference of the cavity than the diameter of the opening. A method for manufacturing the micromechanical structure is also provided.

Abstract: An integrated sensor is fabricated by etching recesses or depressions into the top side of a semiconductor body and by fabricating sensor components in the recesses or depressions. The sensor components are lowered in the recesses or depressions by approximately half of their height. Electronic components are fabricated in the remaining regions of the top side of the semiconductor body. The remaining regions may be covered with a protective layer if the recesses or depressions are fabricated after the electronic components.

Abstract: A method is disclosed for producing a micromechanical component. The micromechanical component has sensor holes, wherein at least one component protective layer and/or a spacer coating is applied on the component before separating the wafer into chips. The component protective layer sealingly covers at least the walls of the holes extending parallel to the surface of the wafer and perpendicular to the surface of the wafer and the spacer coating sealingly covers at least the walls of the holes extending parallel to the surface of the wafer.

Abstract: A micromechanical sensor is described which contains electrodes that are disposed on a substrate, and electrode bars made of silicon that can move with regard to the electrodes. A deformation of the substrate is measured by determining differential changes in a capacity of the electrode bars in comparison to adjacently disposed electrodes. Two groups of electrode bars are preferably used which are interlocked with one another in an alternating comb-like manner, which, are separate from one another, and are interconnected at the ends thereof in an electrically conductive manner, and which are anchored on the substrate.

Abstract: A micromechanical component placed on a substrate face includes at least one cell. A counter-electrode of a cell capacitor is placed under a cavity. The counter-electrode can be made from a first part of a lower conductive layer. An optionally circular membrane used as an electrode of the capacitor is placed above the cavity. The membrane is homogeneous, has a substantially uniform thickness, and can be part of an upper conductive layer preferably supported by a second part of the lower conductive layer. A caustic channel used to remove the sacrificial coating in order to form the cavity is laterally connected thereto. The channel has a vertical dimension equal to the vertical dimension of the cavity. A closure is adjacent to the channel and disposed outside the membrane. The component can be used as a pressure sensor, and can have several cells each adjacent to six other cells. A process for fabricating a micromechanical component is also provided.

Abstract: A method of determining an intactness of a configuration having a plurality of sensor groups, includes the steps of forming, for all of the sensor groups, associated test signals by summing up electric signals of all respective other ones of the sensor groups. All the test signals are compared with one another; and it is selectively determined that an intactness exists, if the test signals are all substantially equal to one another, and it is determined that the intactness does not exist if the test signals are not substantially equal to one another. The configuration is provided such that each sensor group can be disconnected so as to exclude its signal from the aggregate signal. The configuration is preferably provided in a CMOS circuit on a single semiconductor chip.

Abstract: A recess is produced in a material layer by creating at least a first and a second structure in various steps. The layers define each other laterally and extend to the bottom of the recess. The first structure and the second structure are so narrow that they can be made by creating conformally produced layers that have an independent thickness and are smaller than the depth of the recess. The conformally produced layers are formed in an appropriate deposition process. A covering structure can be produced on top of the first and second structure. An opening can be made in the covering structure, through which the first structure and the second structure can be removed in an etching step.

Abstract: In an SOI substrate, an active zone is completely surrounded by a trench filled with insulating material. Disposed adjacent to the trench is a first doped zone which is formed, in particular, by out-diffusion from a doped layer disposed on the wall of the trench. The first doped zone and a second doped zone form a p-n junction of a photodiode.

Abstract: A method and apparatus is provided for exposing the recording material. A light beam is generated by a light source. The light beam passes through an optical isolator, through a light modulator, and then exposes recording material point-by-point and line-by-line. The modulator is activated during exposing of each line in an exposing time span, the modulator being deactivated at least at times within a return time span for each line. The optical isolator is enabled during the exposing time span. To compensate for heating of the optical isolator, the optical isolator is also activated for at least a portion of the return time span. A sum of time extents of the exposing time span and the compensation time span are approximately a constant for each line. Activation of the isolator during the compensation time span compensates for thermal effects which occur in the optical isolator as a result of activation and de-activation thereof.