Patents by Inventor Kunihiro Yamada
Kunihiro Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240084182Abstract: A thermally conductive silicone composition including: (A) an organopolysiloxane represented by the following general formula (1) having a kinematic viscosity at 25° C. of 10 to 10,000 mm2/s, (B) an organopolysiloxane other than the component (A), represented by the following general formula (2) and having a kinematic viscosity at 25° C. of 1,000 to 100,000 mm2/s, (C) an organosilane represented by the following general formula (3), and (D) a thermally conductive filler having a thermal conductivity of 10 W/m·° C. or more. A thermally conductive silicone composition which does not cause a thickening phenomenon during preservation and has excellent shift resistance is provided.Type: ApplicationFiled: December 13, 2021Publication date: March 14, 2024Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Kenichi TSUJI, Kunihiro YAMADA, Shota AKIBA
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Patent number: 11919593Abstract: A cover member configured to cover a drive-power transmission member is fixed to a swing arm with a simple structure. A saddle-ride type vehicle includes a swing arm swingable up and down, a rear wheel supported at a rear end portion of the swing arm, an endless drive-power transmission member extending along the swing arm in a front-rear direction and configured to transmit drive power of a power unit to the rear wheel, a cover member fixed to the swing arm and covering the drive-power transmission member, and a slider provided on an upper face of the swing arm and configured to receive the drive-power transmission member. The cover member includes a fastening portion that is fastened to the swing arm by a fastener and an engagement portion that engages with the slider.Type: GrantFiled: December 23, 2020Date of Patent: March 5, 2024Assignee: HONDA MOTOR CO., LTD.Inventors: Kei Mayuzumi, Keita Mikura, Masaomi Yamada, Kunihiro Notsu, Masayuki Hiramaru
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Publication number: 20230183540Abstract: A thermal conductive silicone composition includes (A) 100 parts by mass of an organopolysiloxane having a kinematic viscosity at 25° C. of 10 to 500,000 mm2/s; (B) 10 to 2,000 parts by mass of a thermal conductive filler having an average particle size of 0.01 to 100 ?m; and (C) 1,000 to 10,000 parts by mass of gallium or a gallium alloy having a melting point of ?20 to 100° C. The resulting thermal conductive silicone composition has excellent thermal conduction property.Type: ApplicationFiled: March 29, 2021Publication date: June 15, 2023Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventor: Kunihiro YAMADA
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Publication number: 20220380652Abstract: Provided is a thermally conductive silicone composition whose cured product exhibits no cracks and voids, and has a favorable thermal conductivity. The thermally conductive silicone composition contains: (A) an organopolysiloxane having at least two silicon atom-bonded aliphatic unsaturated hydrocarbon groups per each molecule, and having a kinetic viscosity of 10 to 1,000,000 mm2/s at 25° C.; (B) an organohydrogenpolysiloxane; (C) gallium and/or a gallium alloy that have a melting point of ?20 to 70° C.; (D) a thermally conductive filler having an average particle size of 0.1 to 100 pin; (E) a platinum group metal catalyst; (F) a palladium powder; and (G-1) an organopolysiloxane represented by the following general formula (1): wherein R1 independently represents an aliphatic unsaturated bond-free substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; R2 independently represents an alkyl group, an alkenyl group or an acyl group.Type: ApplicationFiled: May 24, 2022Publication date: December 1, 2022Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Narimi MARUYAMA, Kunihiro YAMADA
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Publication number: 20220380548Abstract: A thermally conductive silicone composition that has high thermal conductivity and excellent workability and misalignment resistance, and contains, in specific ratios: a silicone gel cross-linked product (A); a silicone oil (B) not containing either aliphatic unsaturated bonds or SiH groups and being used as a surface treatment agent for components (C) and (D); an aluminum powder (C) including (C-1)-(C-3), (C-1) being an aluminum powder having an average particle diameter of 40-100 ?m, (C-2) being an aluminum powder having an average particle diameter of at least 6 ?m and less than 40 ?m, and (C-3) being an aluminum powder having an average particle diameter of at least 0.4 ?m and less than 6 ?m; a zinc oxide powder (D) having an average particle diameter of 0.1-10 ?m; and a volatile solvent (E).Type: ApplicationFiled: October 1, 2020Publication date: December 1, 2022Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Kunihiro YAMADA, Kenichi TSUJI, Keita KITAZAWA
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Publication number: 20220351158Abstract: According to an embodiment, a system for dynamically generating user interfaces for electronic receipts is disclosed. An electronic receipt management server receives and stores a first electronic receipt generated for a transaction made by a customer at a physical store, a customer identifier, and first additional information unique to the physical store. The server receives and stores a second electronic receipt for a transaction made by the customer at an online store, the customer identifier, and second additional information unique to the online store. The server transmits the first and second electronic receipts, the customer identifier, and the first and second additional information, in response to an inquiry containing the customer code. A client device displays a first graphical user interface including a first selectable object to view an image of the first electronic receipt and a second selectable object to view an image of the second electronic receipt.Type: ApplicationFiled: July 19, 2022Publication date: November 3, 2022Inventors: Akiko SUSAKI, Shinya TAKAKURA, Hiroaki IMAI, Kunihiro YAMADA, Masayoshi NAKATANI, Takamitsu MUKUNASHI, Tsuyoshi GOTANDA, Keiko AKAMINE, Yuko TAKAHASHI
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Patent number: 11397927Abstract: According to an embodiment, a system for dynamically generating user interfaces for electronic receipts is disclosed. An electronic receipt management server receives and stores a first electronic receipt generated for a transaction made by a customer at a physical store, a customer identifier, and first additional information unique to the physical store. The server receives and stores a second electronic receipt for a transaction made by the customer at an online store, the customer identifier, and second additional information unique to the online store. The server transmits the first and second electronic receipts, the customer identifier, and the first and second additional information, in response to an inquiry containing the customer code. A client device displays a first graphical user interface including a first selectable object to view an image of the first electronic receipt and a second selectable object to view an image of the second electronic receipt.Type: GrantFiled: January 27, 2020Date of Patent: July 26, 2022Assignee: TOSHIBA TEC KABUSHIKI KAISHAInventors: Akiko Susaki, Shinya Takakura, Hiroaki Imai, Kunihiro Yamada, Masayoshi Nakatani, Takamitsu Mukunashi, Tsuyoshi Gotanda, Keiko Akamine, Yuko Takahashi
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Publication number: 20220145156Abstract: This thermally-conductive silicone composition contains specific proportions of (A) an organopolysiloxane having a thixotropic index ? of 1.51-2.00, and a viscosity of 10-1,000,000 mPa·s as measured at 25° C. using a B-type rotational viscometer at a rotor rotational speed of 2 rpm (provided that the thixotropic index ? is a value calculated by ?=?1/?2, where ?1 and ?2 respectively represent viscosities at rotor rotational speeds of 2 rpm and 4 rpm, as measured at 25° C. using a B-type rotational viscometer), (B) a thermally-conductive inorganic filler having a Mohs hardness not more than 5 and an average particle size of 0.1-200 ?m, and (C) a volatile solvent in which the components (A) and (B) can be dispersed or dissolved, wherein the thermally-conductive silicone composition does not contain a thermally-conductive inorganic filler having a Mohs hardness of more than 5.Type: ApplicationFiled: December 23, 2019Publication date: May 12, 2022Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventor: Kunihiro YAMADA
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Publication number: 20220044983Abstract: Provided are a thermal conductive silicone composition having a favorable heat dissipation property; and a semiconductor device using such composition. The thermal conductive silicone composition contains: (A) an organopolysiloxane that has a kinetic viscosity of 10 to 100,000 mm2/s at 25° C., and is represented by the following average composition formula (1) R1aSiO(4-a)/2??(1) wherein R1 represents a hydrogen atom, a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms or a hydroxy group, and a represents a number satisfying 1.8?a?2.2; (B) a silver powder having a tap density of not lower than 3.0 g/cm3, a specific surface area of not larger than 2.0 m2/g and an aspect ratio of 1 to 30; (C) an elemental gallium and/or gallium alloy having a melting point of 0 to 70° C. and being present at a mass ratio [Component (C)/{Component (B)+Component (C)}] of 0.001 to 0.1; and (D) a catalyst.Type: ApplicationFiled: November 27, 2019Publication date: February 10, 2022Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Shota AKIBA, Kunihiro YAMADA, Kenichi TSUJI
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Patent number: 11236203Abstract: Provided is a thermal conductive silicone composition containing: (A) an organopolysiloxane having a kinetic viscosity of 10 to 100,000 mm2/s at 25° C., and represented by the following average composition formula (1) R1aSiO(4-a)/2??(1) wherein R1 represents a hydrogen atom or a monovalent hydrocarbon group, and a represents a number satisfying 1.8?a?2.2; (B) silver nanoparticles having an average particle size of 3 to 600 nm; (C) a thermal conductive filler other than the component (B), having an average particle size of 0.7 to 100 ?m and a thermal conductivity of 10 W/m° C. or higher; and (D) a catalyst selected from the group consisting of a platinum based catalyst, an organic peroxide and a catalyst for condensation reaction.Type: GrantFiled: October 18, 2017Date of Patent: February 1, 2022Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Shota Akiba, Kenichi Tsuji, Kunihiro Yamada
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Publication number: 20210284803Abstract: Provided is a thermal conductive silicone composition containing: (A) an organopolysiloxane having a kinetic viscosity of 10 to 100,000 mm2/s at 25° C., and represented by the following average composition formula (1) R1aSiO(4-a)/2 ??(1) wherein R1 represents a hydrogen atom or a monovalent hydrocarbon group, and a represents a number satisfying 1.8?a?2.2; (B) silver nanoparticles having an average particle size of 3 to 600 nm; (C) a thermal conductive filler other than the component (B), having an average particle size of 0.7 to 100 ?m and a thermal conductivity of 10 W/m° C. or higher; and (D) a catalyst selected from the group consisting of a platinum based catalyst, an organic peroxide and a catalyst for condensation reaction.Type: ApplicationFiled: October 18, 2017Publication date: September 16, 2021Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Shota AKIBA, Kenichi TSUJI, Kunihiro YAMADA
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Patent number: 10745603Abstract: A thermosoftening and heat conductive silicone grease composition including: (A) a silicone wax having a melting point of 30-80° C.; (B) a organopolysiloxane indicated by formula R1aSiO(4-a)/2 (R1 indicating a monovalent hydrocarbon group and a being 1.8?a?2.2) and having a kinematic viscosity of 10-500,000 mm2/s at 25° C.; and (C) a heat conductive filler material having a heat conductivity of at least 10 W/(m·K).Type: GrantFiled: September 12, 2016Date of Patent: August 18, 2020Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventor: Kunihiro Yamada
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Publication number: 20200160287Abstract: According to an embodiment, a system for dynamically generating user interfaces for electronic receipts is disclosed. An electronic receipt management server receives and stores a first electronic receipt generated for a transaction made by a customer at a physical store, a customer identifier, and first additional information unique to the physical store. The server receives and stores a second electronic receipt for a transaction made by the customer at an online store, the customer identifier, and second additional information unique to the online store. The server transmits the first and second electronic receipts, the customer identifier, and the first and second additional information, in response to an inquiry containing the customer code. A client device displays a first graphical user interface including a first selectable object to view an image of the first electronic receipt and a second selectable object to view an image of the second electronic receipt.Type: ApplicationFiled: January 27, 2020Publication date: May 21, 2020Inventors: Akiko SUSAKI, Shinya TAKAKURA, Hiroaki IMAI, Kunihiro YAMADA, Masayoshi NAKATANI, Takamitsu MUKUNASHI, Tsuyoshi GOTANDA, Keiko AKAMINE, Yuko TAKAHASHI
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Patent number: 10202529Abstract: A silicone composition that contains an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, a filler containing an aluminum powder and a zinc oxide powder, an organohydrogenpolysiloxane having two or more SiH groups per molecule, and a platinum group metal catalyst, in which when a storage and loss elastic modulus G? of the silicone composition is measured by means a viscoelasticity measurement apparatus capable of measuring shear modulus, the silicone composition can provide a cured product wherein G? after 3,000 seconds from the start of holding is 10,000 Pa or less, G? after 7,200 seconds from the start of holding is 100,000 Pa or less, and G? exceeds G? after 800 seconds or more from the start of holding. As a result, there is provided a silicone composition excellent in crushability, spreadability, and heat conductivity.Type: GrantFiled: November 22, 2017Date of Patent: February 12, 2019Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Keita Kitazawa, Kunihiro Yamada
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Publication number: 20180291249Abstract: A thermosoftening and heat conductive silicone grease composition including: (A) a silicone wax having a melting point of 30-80° C.; (B) a organopolysiloxane indicated by formula R1aSiO(4-a)/2 (R1 indicating a monovalent hydrocarbon group and a being 1.8?a?2.2) and having a kinematic viscosity of 10-500,000 mm2/s at 25° C.; and (C) a heat conductive filler material having a heat conductivity of at least 10 W/(m·K).Type: ApplicationFiled: September 12, 2016Publication date: October 11, 2018Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventor: Kunihiro YAMADA
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Patent number: 10023741Abstract: A silicone composition that contains (A) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, (B) a filler containing an aluminum powder and a zinc oxide powder, (C) an organohydrogenpolysiloxane having two or more silicon-bonded hydrogen atoms per molecule, and (D) a platinum group metal catalyst, in which a cured product of the silicone composition exhibits a ratio of a storage elastic modulus after 3,600 seconds from the start of measurement to a storage elastic modulus after 7,200 seconds from the start of measurement of 0.7 or less, the storage elastic modulus G? being measured by constructing a program for holding a sample at 150° C. for 7,200 seconds after the sample is heated from 25° C. to 125° C. at a temperature increase rate of 10° C./min, from 125° C. to 145° C. at a temperature increase rate of 2° C./min, and from 145° C. to 150° C. at a temperature increase rate of 0.5° C./min.Type: GrantFiled: May 2, 2014Date of Patent: July 17, 2018Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Keita Kitazawa, Kunihiro Yamada
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Patent number: 9976032Abstract: A silicone composition that contains (A) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, (B) a filler containing an aluminum powder and a zinc oxide powder, (C) an organohydrogenpolysiloxane having two or more silicon-bonded hydrogen atoms per molecule, and (D) a platinum group metal catalyst, in which a cured product of the silicone composition exhibits a ratio of a storage elastic modulus after 3,600 seconds from the start of measurement to a storage elastic modulus after 7,200 seconds from the start of measurement of 0.7 or less, the storage elastic modulus G? being measured by constructing a program for holding a sample at 150° C. for 7,200 seconds after the sample is heated from 25° C. to 125° C. at a temperature increase rate of 10° C./min, from 125° C. to 145° C. at a temperature increase rate of 2° C./min, and from 145° C. to 150° C. at a temperature increase rate of 0.5° C./min.Type: GrantFiled: May 2, 2014Date of Patent: May 22, 2018Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Keita Kitazawa, Kunihiro Yamada
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Patent number: 9969919Abstract: A silicone composition that contains an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, a filler containing an aluminum powder and a zinc oxide powder, an organohydrogenpolysiloxane having two or more SiH groups per molecule, and a platinum group metal catalyst, in which when a storage and loss elastic modulus G? of the silicone composition is measured by means a viscoelasticity measurement apparatus capable of measuring shear modulus, the silicone composition can provide a cured product wherein G? after 3,000 seconds from the start of holding is 10,000 Pa or less, G? after 7,200 seconds from the start of holding is 100,000 Pa or less, and G? exceeds G? after 800 seconds or more from the start of holding. As a result, there is provided a silicone composition excellent in crushability, spreadability, and heat conductivity, and further provided a method for manufacturing a heat-conductive silicone composition.Type: GrantFiled: June 13, 2014Date of Patent: May 15, 2018Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Keita Kitazawa, Kunihiro Yamada
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Patent number: 9932508Abstract: A silicone composition that contains an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, a filler containing an aluminum powder and a zinc oxide powder, an organohydrogenpolysiloxane having two or more SiH groups per molecule, and a platinum group metal catalyst, in which when a storage and loss elastic modulus G? of the silicone composition is measured by means a viscoelasticity measurement apparatus capable of measuring shear modulus, the silicone composition can provide a cured product wherein G? after 3,000 seconds from the start of holding is 10,000 Pa or less, G? after 7,200 seconds from the start of holding is 100,000 Pa or less, and G? exceeds G? after 800 seconds or more from the start of holding. As a result, there is provided a silicone composition excellent in crushability, spreadability, and heat conductivity, and further provided a method for manufacturing a heat-conductive silicone composition.Type: GrantFiled: June 13, 2014Date of Patent: April 3, 2018Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Keita Kitazawa, Kunihiro Yamada
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Publication number: 20180086960Abstract: A silicone composition that contains an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, a filler containing an aluminum powder and a zinc oxide powder, an organohydrogenpolysiloxane having two or more SiH groups per molecule, and a platinum group metal catalyst, in which when a storage and loss elastic modulus G? of the silicone composition is measured by means a viscoelasticity measurement apparatus capable of measuring shear modulus, the silicone composition can provide a cured product wherein G? after 3,000 seconds from the start of holding is 10,000 Pa or less, G? after 7,200 seconds from the start of holding is 100,000 Pa or less, and G? exceeds G? after 800 seconds or more from the start of holding. As a result, there is provided a silicone composition excellent in crushability, spreadability, and heat conductivity.Type: ApplicationFiled: November 22, 2017Publication date: March 29, 2018Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Keita KITAZAWA, Kunihiro YAMADA