Patents by Inventor Kunihiro Yamada
Kunihiro Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9783723Abstract: Provided is a thermal conductive silicone composition having a superior thermal conductivity. The thermal conductive silicone composition contains: (A) an organopolysiloxane that exhibits a kinetic viscosity of 10 to 100,000 mm2/s at 25° C., and is represented by the following average composition formula (1) R1aSiO(4-a)/2??(1) wherein R1 represents a hydrogen atom or at least one group selected from a hydroxy group and a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms, and a satisfies 1.8?a?2.2; and (B) a silver powder having a tap density of not lower than 3.0 g/cm3 and a specific surface area of not larger than 2.0 m2/g, such silver powder being in an amount of 300 to 11,000 parts by mass with respect to 100 parts by mass of the component (A).Type: GrantFiled: September 30, 2016Date of Patent: October 10, 2017Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Shota Akiba, Kenichi Tsuji, Kunihiro Yamada
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Publication number: 20170249605Abstract: According to an embodiment, a system for dynamically generating user interfaces for electronic receipts is disclosed. An electronic receipt management server receives and stores a first electronic receipt generated for a transaction made by a customer at a physical store, a customer identifier, and first additional information unique to the physical store. The server receives and stores a second electronic receipt for a transaction made by the customer at an online store, the customer identifier, and second additional information unique to the online store. The server transmits the first and second electronic receipts, the customer identifier, and the first and second additional information, in response to an inquiry containing the customer code. A client device displays a first graphical user interface including a first selectable object to view an image of the first electronic receipt and a second selectable object to view an image of the second electronic receipt.Type: ApplicationFiled: May 16, 2017Publication date: August 31, 2017Inventors: Akiko SUSAKI, Shinya TAKAKURA, Hiroaki IMAI, Kunihiro YAMADA, Masayoshi NAKATANI, Takamitsu MUKUNASHI, Tsuyoshi GOTANDA, Keiko AKAMINE, Yuko TAKAHASHI
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Patent number: 9698077Abstract: Provided is a heat conductive silicone composition disposed between a heat generating electronic component and a member for dispersing heat, wherein the heat conductive silicone composition contains (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a dynamic viscosity at 25° C. of 10 to 100,000 mm2/s, (B) a hydrolyzable dimethylpolysiloxane having three functional groups at one end expressed by formula (1), (C) a heat conductive filler having a heat conductivity of 10 W/m° C. or higher, (D) an organohydrogenpolysiloxane expressed by formula (2), (E) an organohydrogenpolysiloxane containing a hydrogen directly bonded to at least two silicon atoms in one molecule other than component (D), and (F) a catalyst selected from the group consisting of platinum and platinum compounds.Type: GrantFiled: December 20, 2013Date of Patent: July 4, 2017Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Kenichi Tsuji, Kunihiro Yamada, Hiroaki Kizaki, Nobuaki Matsumoto
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Publication number: 20170096591Abstract: Provided is a thermal conductive silicone composition having a superior thermal conductivity. The thermal conductive silicone composition contains: (A) an organopolysiloxane that exhibits a kinetic viscosity of 10 to 100,000 mm2/s at 25° C., and is represented by the following average composition formula (1) R1aSiO(4-a)/2??(1) wherein R1 represents a hydrogen atom or at least one group selected from a hydroxy group and a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms, and a satisfies 1.8?a?2.2; and (B) a silver powder having a tap density of not lower than 3.0 g/cm3 and a specific surface area of not larger than 2.0 m2/g, such silver powder being in an amount of 300 to 11,000 parts by mass with respect to 100 parts by mass of the component (A).Type: ApplicationFiled: September 30, 2016Publication date: April 6, 2017Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Shota AKIBA, Kenichi TSUJI, Kunihiro YAMADA
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Patent number: 9481851Abstract: Provided is a thermally-curable heat-conductive silicone grease composition which has a high shape-retaining property in an early stage even when the viscosity of the composition is low (i.e., the composition is easy to apply) in the early stage, and which becomes soft (has low hardness) after being cured. A thermally-curable heat-conductive silicone grease composition comprising, as essential components: (A) an organopolysiloxane having a viscosity of 100 to 100,000 mPa·s at 25° C.Type: GrantFiled: March 15, 2013Date of Patent: November 1, 2016Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Nobuaki Matsumoto, Kunihiro Yamada, Kenichi Tsuji
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Patent number: 9412454Abstract: According to one embodiment, a semiconductor memory device includes: semiconductor member; electrode member; charge accumulation member; a memory unit; and a control unit. Memory cell is formed at each crossing portion of the semiconductor member and the electrode member. The memory unit retains information indicating that the memory cell belongs to first group or second group. The control unit performs first step and second step, when reducing the charge accumulated in the charge accumulation member. In the first step, first voltage is applied both between the semiconductor member and the electrode member of the first group and between the semiconductor member and the electrode member of the second group. In the second step, second voltage is applied between the semiconductor member and the electrode member constituting the memory cell belonging to the second group.Type: GrantFiled: July 27, 2015Date of Patent: August 9, 2016Assignee: Kabushiki Kaisha ToshibaInventor: Kunihiro Yamada
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Publication number: 20160208156Abstract: A silicone composition that contains an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, a filler containing an aluminum powder and a zinc oxide powder, an organohydrogenpolysiloxane having two or more SiH groups per molecule, and a platinum group metal catalyst, in which when a storage and loss elastic modulus G? of the silicone composition is measured by means a viscoelasticity measurement apparatus capable of measuring shear modulus, the silicone composition can provide a cured product wherein G? after 3,000 seconds from the start of holding is 10,000 Pa or less, G? after 7,200 seconds from the start of holding is 100,000 Pa or less, and G? exceeds G? after 800 seconds or more from the start of holding. As a result, there is provided a silicone composition excellent in crushability, spreadability, and heat conductivity, and further provided a method for manufacturing a heat-conductive silicone composition.Type: ApplicationFiled: June 13, 2014Publication date: July 21, 2016Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Keita KITAZAWA, Kunihiro YAMADA
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Patent number: 9321950Abstract: The present invention provides a thermally conductive grease composition which scarcely increases in hardness during high-temperature heating and has a minimized reduction in growth, containing: (A) an organopolysiloxane including at least two alkenyl groups per molecule, the 25° C. kinetic viscosity being 5,000 to 100,000 mm2/s; (B) a hydrolysable methyl polysiloxane, trifunctional at one terminus, represented by general formula (1) (R1 is a C1-6 alkyl group, and a is an integer 5 to 100); (C) a thermally conductive filler having a thermal conductivity of 10 W/m·° C. or greater; (D) an organohydrogenpolysiloxane containing two to five hydrogen atoms directly bonded to a silicon atom (Si—H group) per molecule; (E) an adhesion promoter having a triazine ring and at least one alkenyl group per molecule; and (F) a catalyst selected from the group consisting of platinum and platinum compounds.Type: GrantFiled: May 11, 2012Date of Patent: April 26, 2016Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Kenichi Tsuji, Kunihiro Yamada, Hiroaki Kizaki, Nobuaki Matsumoto
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Publication number: 20160078943Abstract: According to one embodiment, a semiconductor memory device includes: semiconductor member; electrode member; charge accumulation member; a memory unit; and a control unit. Memory cell is formed at each crossing portion of the semiconductor member and the electrode member. The memory unit retains information indicating that the memory cell belongs to first group or second group. The control unit performs first step and second step, when reducing the charge accumulated in the charge accumulation member. In the first step, first voltage is applied both between the semiconductor member and the electrode member of the first group and between the semiconductor member and the electrode member of the second group. In the second step, second voltage is applied between the semiconductor member and the electrode member constituting the memory cell belonging to the second group.Type: ApplicationFiled: July 27, 2015Publication date: March 17, 2016Applicant: Kabushiki Kaisha ToshibaInventor: Kunihiro YAMADA
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Publication number: 20160060462Abstract: A silicone composition that contains (A) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, (B) a filler containing an aluminum powder and a zinc oxide powder, (C) an organohydrogenpolysiloxane having two or more silicon-bonded hydrogen atoms per molecule, and (D) a platinum group metal catalyst, in which a cured product of the silicone composition exhibits a ratio of a storage elastic modulus after 3,600 seconds from the start of measurement to a storage elastic modulus after 7,200 seconds from the start of measurement of 0.7 or less, the storage elastic modulus G? being measured by constructing a program for holding a sample at 150° C. for 7,200 seconds after the sample is heated from 25° C. to 125° C. at a temperature increase rate of 10° C./min, from 125° C. to 145° C. at a temperature increase rate of 2° C./min, and from 145° C. to 150° C. at a temperature increase rate of 0.5° C./min.Type: ApplicationFiled: May 2, 2014Publication date: March 3, 2016Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Keita KITAZAWA, Kunihiro YAMADA
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Publication number: 20150357261Abstract: Provided is a heat conductive silicone composition disposed between a heat generating electronic component and a member for dispersing heat, wherein the heat conductive silicone composition contains (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a dynamic viscosity at 25° C. of 10 to 100,000 mm2/s, (B) a hydrolyzable dimethylpolysiloxane having three functional groups at one end expressed by formula (1), (C) a heat conductive filler having a heat conductivity of 10 W/m° C. or higher, (D) an organohydrogenpolysiloxane expressed by formula (2), (E) an organohydrogenpolysiloxane containing a hydrogen directly bonded to at least two silicon atoms in one molecule other than component (D), and (F) a catalyst selected from the group consisting of platinum and platinum compounds.Type: ApplicationFiled: December 20, 2013Publication date: December 10, 2015Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Kenichi TSUJI, Kunihiro YAMADA, Hiroaki KIZAKI, Nobuaki MATSUMOTO
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Publication number: 20150148273Abstract: Provided is a thermally-curable heat-conductive silicone grease composition which has a high shape-retaining property in an early stage even when the viscosity of the composition is low (i.e., the composition is easy to apply) in the early stage, and which becomes soft (has low hardness) after being cured. A thermally-curable heat-conductive silicone grease composition comprising, as essential components: (A) an organopolysiloxane having a viscosity of 100 to 100,000 mPa·s at 25° C.Type: ApplicationFiled: March 15, 2013Publication date: May 28, 2015Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Nobuaki Matsumoto, Kunihiro Yamada, Kenichi Tsuji
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Patent number: 9025377Abstract: According to one embodiment, a method of operating a semiconductor memory device is disclosed. The method can include storing read-only data in at least one selected from a memory cell of an uppermost layer and a memory cell of a lowermost layer of a plurality of memory cells connected in series via a channel body. The channel body extends upward from a substrate to intersect a plurality of electrode layers stacked on the substrate. The method can include prohibiting a data erase operation of the read-only memory cell having the read-only data stored in the read-only memory cell.Type: GrantFiled: March 21, 2011Date of Patent: May 5, 2015Assignee: Kabushiki Kaisha ToshibaInventors: Kunihiro Yamada, Hideaki Aochi, Masaru Kito, Tomoko Fujiwara, Yoshiaki Fukuzumi, Ryouhei Kirisawa, Yoshimasa Mikajiri, Kaori Kawasaki
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Publication number: 20150001439Abstract: The present invention provides a thermally conductive grease composition which scarcely increases in hardness during high-temperature heating and has a minimized reduction in growth, containing: (A) an organopolysiloxane including at least two alkenyl groups per molecule, the 25° C. kinetic viscosity being 5,000 to 100,000 mm2/s; (B) a hydrolysable methyl polysiloxane, trifunctional at one terminus, represented by general formula (1) (R1 is a C1-6 alkyl group, and a is an integer 5 to 100); (C) a thermally conductive filler having a thermal conductivity of 10 W/m·° C. or greater; (D) an organohydrogenpolysiloxane containing two to five hydrogen atoms directly bonded to a silicon atom (Si—H group) per molecule; (E) an adhesion promoter having a triazine ring and at least one alkenyl group per molecule; and (F) a catalyst selected from the group consisting of platinum and platinum compounds.Type: ApplicationFiled: May 11, 2012Publication date: January 1, 2015Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Kenichi Tsuji, Kunihiro Yamada, Hiroaki Kizaki, Nobuaki Matsumoto
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Publication number: 20140334231Abstract: A control circuit is configured to set a drain-side select transistor and a source-side select transistor connected to a selected memory string to non-conductive states. The control circuit is configured to apply a first voltage to a non-selected word line connected to a gate of a non-selected memory cell in the selected memory string. The control circuit is configured to apply a second voltage to a selected word line connected to a gate of a selected memory cell in the selected memory string. The second voltage is smaller than the first voltage in an erasing operation.Type: ApplicationFiled: July 23, 2014Publication date: November 13, 2014Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Kiyotaro ITAGAKI, Kunihiro YAMADA, Yoshihisa IWATA
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Publication number: 20140249971Abstract: An electronic receipt management server includes an electronic receipt management unit for managing a code of each consumer and electronic receipt information in correlation with each other, a first receiving unit for receiving from an information processing device of a consumer a selection of electronic receipt information that is an object of grouping, among the electronic receipt information correlated with the code, and a first grouping unit for grouping the selected electronic receipt information into a group to be managed by the electronic receipt management unit.Type: ApplicationFiled: February 28, 2014Publication date: September 4, 2014Applicant: TOSHIBA TEC KABUSHIKI KAISHAInventors: Akiko SUSAKI, Shinya TAKAKURA, Hiroaki IMAI, Kunihiro YAMADA, Masayoshi NAKATANI, Takamitsu MUKUNASHI, Kou TANAKA, Takeshi YOSHIMURA, Naomichi YAMAMOTO, Kento DOAMI, Jun SUGIYAMA, Tomoyuki ANAMI, Tsuyoshi GOTANDA
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Publication number: 20140249970Abstract: According to one embodiment, an electronic receipt system includes an electronic receipt collective management unit, an electronic receipt transmission unit, and an electronic receipt display unit. The electronic receipt collective management unit manages electronic receipt information as digitized sales information related to in-store shopping in association with an first code for identifying a customer, and manages sales information, which is associated with a second code, from on-line shopping at a virtual store on a network as electronic receipt information by associating the second code with the first code. The electronic receipt transmission unit transmits the electronic receipt information associated with the first code to an information processing apparatus. The electronic receipt display unit displays the electronic receipt information transmitted to the information processing apparatus.Type: ApplicationFiled: February 28, 2014Publication date: September 4, 2014Applicant: TOSHIBA TEC KABUSHIKI KAISHAInventors: Akiko SUSAKI, Shinya TAKAKURA, Hiroaki IMAI, Kunihiro YAMADA, Masayoshi NAKATANI, Takamitsu MUKUNASHI, Tsuyoshi GOTANDA, Keiko AKAMINE, Yuko TAKAHASHI
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Publication number: 20140249997Abstract: An electronic receipt system includes an electronic receipt generation unit configured to generate electronic receipt information relating to merchandise sales data, and correlate the electronic receipt information with a code of a consumer, an electronic receipt management unit configured to associate the electronic receipt information with a company code, an electronic receipt collective management unit configured to manage the electronic receipt information collectively for a plurality of the companies, a group associating unit configured to define a group by associating codes of different consumers with the group, and an electronic receipt transmission unit configured to transmit the electronic receipt information to information processing devices that are correlated with the codes that are associated with the group. An electronic receipt display unit of an information processing device is configured to display the electronic receipt information transmitted by the electronic receipt transmission unit.Type: ApplicationFiled: February 28, 2014Publication date: September 4, 2014Applicant: Toshiba Tec Kabushiki KaishaInventors: Akiko SUSAKI, Shinya TAKAKURA, Hiroaki IMAI, Kunihiro YAMADA, Masayoshi NAKATANI, Takamitsu MUKUNASHI
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Patent number: 8817538Abstract: A control circuit is configured to set a drain-side select transistor and a source-side select transistor connected to a selected memory string to non-conductive states. The control circuit is configured to apply a first voltage to a non-selected word line connected to a gate of a non-selected memory cell in the selected memory string. The control circuit is configured to apply a second voltage to a selected word line connected to a gate of a selected memory cell in the selected memory string. The second voltage is smaller than the first voltage in an erasing operation.Type: GrantFiled: June 11, 2012Date of Patent: August 26, 2014Assignee: Kabushiki Kaisha ToshibaInventors: Kiyotaro Itagaki, Kunihiro Yamada, Yoshihisa Iwata
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Patent number: 8802763Abstract: A curable organopolysiloxane composition in grease or paste form, which including: (A) an organopolysiloxane having at least two alkenyl groups bonded to silicon atom in one molecule; (B) an organohydrogenpolysiloxane having at least two hydrogen atoms bonded to silicone atom in the molecule; (C) gallium and/or a gallium alloy having a melting point of 0 to 70° C.; (D) a thermally conductive filler having an average particle size of 0.1 to 100 ?m; (E) a platinum-based catalyst; and (F) a polysiloxane of the following general formula (1): wherein R1 may be the same or different and represents a monovalent hydrocarbon group, R2 represents an alkyl group, an alkoxyl group, an alkenyl group or an acyl group, a is an integer of 5 to 100, and b is an integer of 1 to 3.Type: GrantFiled: October 3, 2012Date of Patent: August 12, 2014Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Kunihiro Yamada, Nobuaki Matsumoto, Kenichi Tsuji