Patents by Inventor Kunihiro Yamada
Kunihiro Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8754165Abstract: A heat-conductive silicone grease composition is provided comprising (A) a trialkoxysilyl-endcapped organopolysiloxane having a viscosity of 0.1-1,000 Pa·s at 25° C., (B) a specific organopolysiloxane, (C) a heat-conductive filler, and (D) a condensation catalyst. The composition is amenable to coat at the initial, thereafter increases its viscosity with moisture at room temperature rather than curing so that it remains flexible, easy to re-work, and anti-sagging, eliminates a need for cold storage and for hot application, avoids any undesired viscosity buildup, is easy to manufacture, and has good heat transfer.Type: GrantFiled: April 12, 2011Date of Patent: June 17, 2014Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Nobuaki Matsumoto, Ikuo Sakurai, Kunihiro Yamada, Masaya Ueno
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Patent number: 8503245Abstract: A non-volatile semiconductor memory device according to one aspect of an embodiment of the present invention includes: a semiconductor substrate; an element region; a plurality of memory cell transistors which each include a control gate electrode; and programming means for programming data to a programming target memory cell transistor by applying a programming voltage to the programming target memory cell transistor. Moreover, the programming means applies a programming voltage incremented stepwise from an initial programming voltage, to the programming target memory cell transistor while applying a constant initial intermediate voltage to memory cell transistors adjacent to the programming target memory cell transistor.Type: GrantFiled: March 4, 2011Date of Patent: August 6, 2013Assignee: Kabushiki Kaisha ToshibaInventors: Kunihiro Yamada, Naoyuki Shigyo, Michiru Hogyoku, Hideto Horii
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Publication number: 20130105726Abstract: A heat-conductive silicone composition that exhibits reduced thermal contact resistance, while also maintaining high overall thermal conductivity. Specifically, a heat-conductive silicone composition comprising silver particles that undergo an exothermic reaction at a temperature of 260° C. or lower. One embodiment of the composition comprises (A) an organopolysiloxane comprising at least two alkenyl groups within each molecule, and having a kinematic viscosity at 25° C. of 10 to 100,000 mm2/s, (B) an organohydrogenpolysiloxane comprising at least two hydrogen atoms bonded to silicon atoms within each molecule, (C) a platinum-based hydrosilylation reaction catalyst, (D) a reaction retarder, (E) silver particles that undergo an exothermic reaction at a temperature of 260° C. or lower, and (F) a heat-conductive filler, other than the component (E), having a thermal conductivity of at least 10 W/m° C.Type: ApplicationFiled: September 7, 2012Publication date: May 2, 2013Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Kenichi TSUJI, Kunihiro Yamada
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Patent number: 8383005Abstract: A thermally conductive silicone grease composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a kinetic viscosity of 5,000 to 100,000 mm2/s at 25° C.; (B) a hydrolyzable methylpolysiloxane having a trifunctional termination at one end and represented by the following general formula (2): wherein R2 represents an alkyl group having 1 to 6 carbon atoms and b is an integer of 5 to 100; (C) a thermally conductive filler having a thermal conductivity of at least 10 W/m·° C.; (D) an organohydrogenpolysiloxane containing from 2 to 5 hydrogen atoms in one molecule directly bound to silicon atoms (Si—H groups); (E) a bonding aid having a triazine ring and at least one alkenyl group in one molecule; and (F) a catalyst selected from the group consisting of platinum and platinum compounds.Type: GrantFiled: October 27, 2011Date of Patent: February 26, 2013Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Kenichi Tsuji, Kunihiro Yamada, Hiroaki Kizaki, Nobuaki Matsumoto
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Publication number: 20120320698Abstract: A control circuit is configured to set a drain-side select transistor and a source-side select transistor connected to a selected memory string to non-conductive states. The control circuit is configured to apply a first voltage to a non-selected word line connected to a gate of a non-selected memory cell in the selected memory string. The control circuit is configured to apply a second voltage to a selected word line connected to a gate of a selected memory cell in the selected memory string. The second voltage is smaller than the first voltage in an erasing operation.Type: ApplicationFiled: June 11, 2012Publication date: December 20, 2012Applicant: Kabushiki Kaisha ToshibaInventors: Kiyotaro ITAGAKI, Kunihiro YAMADA, Yoshihisa IWATA
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Publication number: 20120119137Abstract: A thermally conductive silicone grease composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a kinetic viscosity of 5,000 to 100,000 mm2/s at 25° C.; (B) a hydrolyzable methylpolysiloxane having a trifunctional termination at one end and represented by the following general formula (2): wherein R2 represents an alkyl group having 1 to 6 carbon atoms and b is an integer of 5 to 100; (C) a thermally conductive filler having a thermal conductivity of at least 10 W/m·° C.; (D) an organohydrogenpolysiloxane containing from 2 to 5 hydrogen atoms in one molecule directly bound to silicon atoms (Si—H groups); (E) a bonding aid having a triazine ring and at least one alkenyl group in one molecule; and (F) a catalyst selected from the group consisting of platinum and platinum compounds.Type: ApplicationFiled: October 27, 2011Publication date: May 17, 2012Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Kenichi Tsuji, Kunihiro Yamada, Hiroaki Kizaki, Nobuaki Matsumoto
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Patent number: 8119758Abstract: Provided is a heat-conductive silicone composition, including: (A) 100 parts by volume of an organopolysiloxane having a specific structure, (B) 0.1 to 50 parts by volume of an organosilicon compound that functions as a wetter and contains a triorganooxysilyl group bonded to one terminal via an alkylene group that may be branched, (C) 100 to 2,500 parts by volume of a heat-conductive filler, and (D) an effective quantity of a curing agent. Also provided is a heat-conductive silicone cured product obtained by curing this composition. The heat-conductive silicone composition, even when filled with a large quantity of a heat-conductive filler in order to provide superior thermal conductivity, exhibits a minimal increase in viscosity or plasticity, and retains favorable handling properties and moldability. The heat-conductive silicone cured product exhibits excellent flexibility even when filled with a large quantity of a heat-conductive filler.Type: GrantFiled: August 29, 2007Date of Patent: February 21, 2012Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Ikuo Sakurai, Nobuaki Matsumoto, Kei Miyoshi, Kunihiro Yamada
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Publication number: 20120026775Abstract: According to one embodiment, a method of operating a semiconductor memory device is disclosed. The method can include storing read-only data in at least one selected from a memory cell of an uppermost layer and a memory cell of a lowermost layer of a plurality of memory cells connected in series via a channel body. The channel body extends upward from a substrate to intersect a plurality of electrode layers stacked on the substrate. The method can include prohibiting a data erase operation of the read-only memory cell having the read-only data stored in the read-only memory cell.Type: ApplicationFiled: March 21, 2011Publication date: February 2, 2012Applicant: Kabushiki Kaisha ToshibaInventors: Kunihiro Yamada, Hideaki Aochi, Masaru Kito, Tomoko Fujiwara, Yoshiaki Fukuzumi, Ryouhei Kirisawa, Yoshimasa Mikajiri, Kaori Kawasaki
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Publication number: 20110248211Abstract: A heat-conductive silicone grease composition is provided comprising (A) a trialkoxysilyl-endcapped organopolysiloxane having a viscosity of 0.1-1,000 Pa·s at 25° C., (B) a specific organopolysiloxane, (C) a heat-conductive filler, and (D) a condensation catalyst. The composition is amenable to coat at the initial, thereafter increases its viscosity with moisture at room temperature rather than curing so that it remains flexible, easy to re-work, and anti-sagging, eliminates a need for cold storage and for hot application, avoids any undesired viscosity buildup, is easy to manufacture, and has good heat transfer.Type: ApplicationFiled: April 12, 2011Publication date: October 13, 2011Inventors: NOBUAKI MATSUMOTO, IKUO SAKURAI, KUNIHIRO YAMADA, MASAYA UENO
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Publication number: 20110228610Abstract: A non-volatile semiconductor memory device according to one aspect of an embodiment of the present invention includes: a semiconductor substrate; an element region; a plurality of memory cell transistors which each include a control gate electrode; and programming means for programming data to a programming target memory cell transistor by applying a programming voltage to the programming target memory cell transistor. Moreover, the programming means applies a programming voltage incremented stepwise from an initial programming voltage, to the programming target memory cell transistor while applying a constant initial intermediate voltage to memory cell transistors adjacent to the programming target memory cell transistor.Type: ApplicationFiled: March 4, 2011Publication date: September 22, 2011Applicant: Kabushiki Kaisha ToshibaInventors: Kunihiro Yamada, Naoyuki Shigyo, Michiru Hogyoku, Hideto Horii
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Patent number: 8017684Abstract: Provided is a heat conductive silicone grease composition, including: (A) 100 parts by volume of an organopolysiloxane with a specific structure and with a kinematic viscosity at 25° C. of 10 to 10,000 mm2/s, (B) 0.1 to 50 parts by volume of an alkoxysilane with a specific structure, and (C) 100 to 2,500 parts by volume of a heat conductive filler. The composition exhibits high thermal conductivity, retains excellent fluidity meaning the composition exhibits favorable workability, and is capable of filling fine indentations, thereby reducing contact resistance and providing excellent heat radiation performance. Also, the durability, under conditions of high temperature and high humidity, of the composition is improved, thereby improving the reliability of the composition during actual use. Heat generated by a heat-generating body can be dissipated into a heat-radiating body by sandwiching the composition between the heat-generating body and the heat-radiating body.Type: GrantFiled: December 26, 2006Date of Patent: September 13, 2011Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Akihiro Endo, Kei Miyoshi, Kunihiro Yamada, Hiroaki Kizaki
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Patent number: 7814353Abstract: A power management system for a communication device, including an accessory-signal generating device; the communication device; and a power management device for supplying electric power to the communication device if the accessory-signal generating device is not generating accessory signals and the communication device is in a communication-ready state.Type: GrantFiled: September 25, 2006Date of Patent: October 12, 2010Assignee: Aisin AW Co., Ltd.Inventors: Mitsuhiro Naitou, Kunihiro Yamada, Satoshi Ogawa
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Patent number: 7786056Abstract: A silicone grease composition comprising 3-30 wt % of an organopolysiloxane and 60-96.9 wt % of a heat conductive filler is diluted with a least volatile isoparaffin having a boiling point of 260-360° C. Despite a heavy loading of heat conductive filler, the grease composition is easily applicable to heat sinks as a thin uniform coating. The composition is drastically increased in shelf stability at room temperature, easy to handle, and provides for good heat dissipation.Type: GrantFiled: March 31, 2008Date of Patent: August 31, 2010Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Nobuaki Matsumoto, Kunihiro Yamada, Kei Miyoshi, Ikuo Sakurai, Kenichi Isobe
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Publication number: 20100130673Abstract: An invention of a heat-dissipating grease composition characterized by comprising of the following components (A)-(C) is disclosed. Component (A): 100 mass parts of organopolysiloxane wherein a thixotropicity degree ? is 1.03-1.50, a viscosity is 100-1,000,000 mPa·s at 25° C.; in this regard, the thixotropicity degree ? is ?1/?2. Herein, ?1 is a measured viscosity at 25° C. measured by a B type rotation viscometer at 6 rpm of a rotor, ?2 is a measured viscosity at 25° C. measured by a B type rotation viscometer at 12 rpm of the rotor. Component (B): 5-200 mass parts of hydrolysable organopolysiloxane having three functional groups at one end represented by the following general formula (1); R1 in the formula is an alkyl group having 1-6 carbon atoms, R2 is at least one kind of groups having 1-18 carbon atoms selected from a group consisting of substituted or unsubstituted monovalent hydrocarbon groups, a is an integer of 5-120.Type: ApplicationFiled: November 24, 2009Publication date: May 27, 2010Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Kazutoshi ITO, Hiroaki Kizaki, Kunihiro Yamada, Osamu Uchida
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Patent number: 7538075Abstract: A heat dissipating silicone grease composition comprising: (A) 3% to 30% by weight of an organo polysiloxane represented by the general formula, R1aSiO(4?a)/2(R1 is one or two or more groups selected from a group of saturated or unsaturated monovalent hydrocarbon groups containing one to eighteen carbon atoms, and a is a positive number defined by 1.8?a?2.2) having a dynamic viscosity at 25° C. of 50 mm2/s to 500,000 mm2/s; (B) 60% to 96.9% by weight of a thermally conductive filler having a thermal conductivity of at least 10 W/(m·K); and (C) 0.1% to 10% by weight of a solvent that disperses or dissolves component (A).Type: GrantFiled: November 26, 2004Date of Patent: May 26, 2009Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Kunihiro Yamada, Hiroaki Tetsuka
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Patent number: 7510998Abstract: A silicone grease composition is provided comprising (A) 2-40% by weight of an organopolysiloxane having a kinematic viscosity of 50-500,000 mm2/s at 25° C., and (B) 60-98% by weight of at least one heat conductive filler selected from among metal powders, metal oxide powders and ceramic powders having a thermal conductivity of at least 10 W/m° C. and an average particle size of 0.1-15.0 ?m. Coarse particles are removed such that a 500-mesh oversize fraction is not more than 50 ppm and a 325-mesh oversize fraction is substantially zero.Type: GrantFiled: May 20, 2005Date of Patent: March 31, 2009Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Kunihiro Yamada, Akihiro Endo, Kunihiko Mita
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Patent number: 7463972Abstract: A navigation apparatus includes a memory that stores registered routes, wherein each registered route includes a previously traveled route, a corresponding starting point, and a corresponding destination point. The navigation apparatus includes a controller that searches for a route from a specified starting point to a specified destination point, compares the searched route with the registered routes, and utilizes, if a corresponding starting point is substantially identical to the specified starting point or a corresponding destination point is substantially identical to the specified destination point, a portion of a registered route including the substantially identical starting point or the substantially identical destination point as a navigation route.Type: GrantFiled: July 27, 2004Date of Patent: December 9, 2008Assignee: AISIN AW Co., Ltd.Inventors: Kunihiro Yamada, Shino Kimura, Kihachi Hayashida, Minoru Ootake, Akihiro Nakajima, Nobuo Suzuki, Atsuya Ooshima
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Publication number: 20080269084Abstract: A silicone grease composition comprising 3-30 wt % of an organopolysiloxane and 60-96.9 wt % of a heat conductive filler is diluted with a least volatile isoparaffin having a boiling point of 260-360° C. Despite a heavy loading of heat conductive filler, the grease composition is easily applicable to heat sinks as a thin uniform coating. The composition is drastically increased in shelf stability at room temperature, easy to handle, and provides for good heat dissipation.Type: ApplicationFiled: March 31, 2008Publication date: October 30, 2008Applicant: Shin -Etsu Chemical Co., Ltd.Inventors: Nobuaki Matsumoto, Kunihiro Yamada, Kei Miyoshi, Ikuo Sakurai, Kenichi Isobe
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Publication number: 20080260957Abstract: A method for adhering a thermally-conductive silicone composition to a coated surface in which a primer containing a platinum type compound and a solvent but not containing an alkoxy silane is applied and dried on the surface of a metal or an alloy containing at least one metal selected from a group of gold, silver and platinum group, and the thermally-conductive silicone composition is subsequently adhered to the coated surface.Type: ApplicationFiled: October 25, 2007Publication date: October 23, 2008Inventors: Kunihiro Yamada, Akihiro Endo, Kei Miyoshi
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Publication number: 20080213578Abstract: Provided is a heat conductive silicone grease composition, including: an organopolysiloxane containing 2 or more alkenyl groups bonded to silicon atoms within each molecule, an organopolysiloxane with a specific structure and with a kinematic viscosity at 25° C. of 10 to 10,000 mm2/s, an alkoxysilane containing specific substituent groups, an organohydrogenpolysiloxane containing 2 or more SiH groups within each molecule, a heat conductive filler, a platinum-based catalyst, and an addition reaction retarder. The heat conductive silicone grease composition exhibits high thermal conductivity, has excellent fluidity prior to curing and therefore exhibits favorable workability, is capable of filling fine indentations and therefore reduces contact resistance, and is also able to prevent oil separation and bleeding of the heat conductive material following curing, meaning the composition exhibits excellent heat radiation performance and reliability.Type: ApplicationFiled: July 11, 2007Publication date: September 4, 2008Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Akihiro Endo, Kei Miyoshi, Kunihiro Yamada