Patents by Inventor Kwang-Il Park
Kwang-Il Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240168434Abstract: Disclosed is an apparatus for measuring texture characteristics of a holographic image that is reconstructed optically by a holographic display device. Provided is an apparatus for measuring texture characteristics of a holographic image, which measures texture characteristics of a holographic image that is reconstructed optically by a holographic display device.Type: ApplicationFiled: November 14, 2023Publication date: May 23, 2024Applicant: Korea Photonics Technology InstituteInventors: Kwang Hoon LEE, Hoe Min KIM, Kyung Il JOO, Min Kyu PARK
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Publication number: 20240169903Abstract: An electronic device may include an electronic display having a gate-on-array (GOA) that generates gate signals in response to an activation signal, pixels that activate in response to a combination of the gate signals and data signals indicative of image data, and sensing circuitry. The sensing circuitry may measure a characteristic response of a gate signal a characteristic response of one or more pixels, or both and compare the characteristic responses to baselines. The electronic device may also include compensation circuitry that applies a compensation to the activation signal and/or to the image data based on the comparisons between the characteristic responses and the baselines.Type: ApplicationFiled: September 19, 2023Publication date: May 23, 2024Inventors: Sun-Il Chang, Kwang Soon Park, Hao-Lin Chiu, Jie Won Ryu, Hyunsoo Kim, Hyunwoo Nho, Wei Xiong, Patrick R. Cruce
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Publication number: 20240096725Abstract: In one example, an electronic device includes an embedded module, which includes a module substrate and module components coupled to the module substrate. A device substrate is coupled to the first module substrate. Device terminals are coupled to the module components and a device encapsulant structure encapsulates the embedded module, the device substrate, and the device terminals. A portion of the device substrate is exposed from the device encapsulant structure and portions of the device terminals are exposed from the device encapsulant structure. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: August 18, 2023Publication date: March 21, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Dae Young PARK, Byong Jin KIM, Gi Jeong KIM, Hyeong Il JEON, Kwang Soo SANG, Jin Young KHIM
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Publication number: 20240097799Abstract: Disclosed is an amplification circuit, which includes a first amplifier that receives an external signal and performs first band pass filtering on the external signal to output a first filter signal, and a second amplifier that receives the first filter signal and performs second band pass filtering on the first filter signal to output a second filter signal, and a frequency pass bandwidth of the second band pass filtering is narrower than a frequency pass bandwidth of the first band pass filtering.Type: ApplicationFiled: June 26, 2023Publication date: March 21, 2024Applicant: Electronics and Telecommunications Research InstituteInventors: Sung Eun KIM, Tae Wook KANG, Hyuk KIM, Kyung Hwan PARK, Mi Jeong PARK, Hyung-IL PARK, Kyung Jin BYUN, Kwang IL OH, Jae-Jin LEE, In Gi LIM
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Patent number: 11923882Abstract: A hybrid communication device, an operation method thereof, and a communication system including the same are provided. The hybrid communication device includes a contact unit that includes an antenna for receiving a first communication signal and an electrode for receiving a second signal, a switch controller that includes a first switch and a second switch and controls the first switch and the second switch based on a change in capacitance of the electrode, and a signal processing unit that receives at least one of the first communication signal and the second communication signal from the contact unit via the first switch and processes the received signal. The first switch is connected to the contact unit, and the signal processing unit is connected to the first switch.Type: GrantFiled: March 25, 2021Date of Patent: March 5, 2024Assignee: Electronics and Telecommunications Research InstituteInventors: Tae Wook Kang, Sung Eun Kim, Hyung-Il Park, Jae-Jin Lee, Hyuk Kim, Kyung Hwan Park, Mi Jeong Park, Kyung Jin Byun, Kwang Il Oh, In Gi Lim
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Patent number: 11881342Abstract: A coil electronic component includes a support substrate having a first surface and a second surface opposing each other, a coil pattern disposed on the first surface of the support substrate, first and second conductive vias penetrating the support substrate and connected to one end and the other end of the coil pattern, respectively, an encapsulant encapsulating the support substrate and the coil pattern, and first and second external electrodes disposed on a lower surface of the encapsulant and electrically connected to the first and second conductive vias, respectively. The support substrate is disposed between the lower surface of the encapsulant and the coil pattern.Type: GrantFiled: August 28, 2019Date of Patent: January 23, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTDInventors: Kwang Il Park, Jong Min Lee
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Patent number: 11861280Abstract: A method of reinforcement learning of a neural network device for generating a verification vector for verifying a circuit design comprising a circuit block includes inputting a test vector to the circuit block, generating one or more rewards based on a coverage corresponding to the test vector, the coverage being determined based on a state transition of the circuit block based on the test vector, and applying the one or more rewards to a reinforcement learning.Type: GrantFiled: March 11, 2022Date of Patent: January 2, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: In Huh, Jeong-hoon Ko, Hyo-jin Choi, Seung-ju Kim, Chang-wook Jeong, Joon-wan Chai, Kwang-il Park, Youn-sik Park, Hyun-sun Park, Young-min Oh, Jun-haeng Lee, Tae-ho Lee
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Patent number: 11842834Abstract: A coil component includes a body, a support substrate embedded in the body and having one end surface exposed to an external surface of the body, a coil portion disposed on the support substrate to be embedded in the body and having one end portion exposed to the external surface of the body together with the one end surface of the support substrate, and an external electrode disposed on the external surface of the body to be connected to the one end portion of the coil portion. The external electrode has an opening exposing at least a portion of the one end surface of the support substrate.Type: GrantFiled: April 30, 2020Date of Patent: December 12, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwang Il Park, Young Sun Kim, Jong Min Lee
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Patent number: 11769619Abstract: A coil component includes a support substrate, a coil portion disposed on one surface of the support substrate and having one end and the other end connected by a plurality of turns, a body in which the support substrate and the coil portion are embedded, a lead portion extending from one end of the coil portion, and an auxiliary lead portion disposed between one end of the coil portion and the other end of the coil portion, and extending from the coil portion to be spaced apart from the lead portion, on one surface of the support substrate. The lead portion and the auxiliary lead portion are exposed to an external surface of the body to be spaced apart from each other.Type: GrantFiled: July 2, 2020Date of Patent: September 26, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Kwang Il Park
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Publication number: 20230207189Abstract: An inductor component includes a body including a first surface and a second surface opposing each other in a first direction, and a third surface and a fourth surface connected to the first surface and the second surface and opposing each other in a second direction, a first conductor disposed in the body and extending in the first direction, a second conductor disposed adjacent to the first conductor in the body and extending in the first direction, a first pad and a second pad disposed on the third surface of the body, a first conductive via extending in the second direction and connecting the first conductor and the first pad, and a second conductive via extending in the second direction and connecting the second conductor and the second pad. The second conductor is disposed to be shifted with respect to the first conductor in the first direction.Type: ApplicationFiled: May 19, 2022Publication date: June 29, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Kwang Il PARK
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Patent number: 11664149Abstract: A coil electronic component includes a support substrate having a through-hole. First and second coil patterns are disposed on a first surface and a second surface of the support substrate opposing each other, respectively, and each surround the through-hole and are coiled. An encapsulant encapsulates at least portions of the support substrate and the first and second coil patterns, and external electrodes are disposed externally of the encapsulant and are each connected to a respective lead-out pattern connected to a respective one of the first and second coil patterns. A groove penetrates the first surface of the support substrate in a region of the first surface in which the first coil pattern is not disposed, and the second coil pattern is disposed in a region of the second surface of the support substrate that overlaps along a thickness direction with the groove penetrating the first surface.Type: GrantFiled: August 26, 2019Date of Patent: May 30, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwang Il Park, Jong Min Lee
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Patent number: 11600427Abstract: A coil component includes a body having a first surface and a second surface facing each other, and having a plurality of wall surfaces connecting the first surface to the second surface; an insulating substrate; a coil portion comprising a first lead-out pattern and a second lead-out pattern each covered with the body and disposed on the insulating substrate; a first external electrode and a second external electrode disposed on the first surface of the body and spaced apart from each other; a first connection electrode and a second connection electrode respectively extending from the first and second lead-out patterns to the first and second external electrodes; and a first support portion and a second support portion respectively extending from the coil portion to be exposed to one of the plurality of wall surfaces, and respectively disposed to be spaced apart from the first and second lead-out patterns.Type: GrantFiled: October 29, 2019Date of Patent: March 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwang Il Park, Jong Min Lee
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Patent number: 11574763Abstract: A coil component includes a body having both end surfaces opposing each other in a length direction; a support substrate disposed in the body; a coil portion disposed on the support substrate in a width direction of the body, and including first and second lead-out portions each exposed to a first surface and a second surface of the body opposing each other in a thickness direction of the body, respectively, and disposed on the support substrate; and first and second external electrodes disposed on the first surface of the body, spaced apart from each other, and connected to one ends of the first and second lead-out portions exposed to the first surface of the body, respectively.Type: GrantFiled: May 13, 2020Date of Patent: February 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwang Il Park, In Suk Kim, Young Sun Kim, Sung Hee Kim, In Young Kang
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Patent number: 11574767Abstract: A coil component includes a body having one surface and another surface opposing each other in one direction, a plurality of walls each connecting the one surface to the other surface, and a coil portion disposed therein. A recess extends along at least portions of edges common to the one surface and to walls of the plurality of walls. A lower insulating layer is disposed in the recess and on the one surface. First and second external electrodes penetrate through the lower insulating layer, are spaced apart from each other on the one surface of the body, and are connected to the coil portion. A shielding layer is disposed on the other surface of the body and the plurality of walls of the body, and extends to the one surface of the body to be spaced apart from the first and second external electrodes.Type: GrantFiled: March 6, 2019Date of Patent: February 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwang Il Park, Hye Yeon Cha, Young Sun Kim
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Patent number: 11564962Abstract: The present invention relates to a pharmaceutical composition comprising a maple leaf extract or fraction thereof for preventing or treating a retinal disease, a method for preventing or treating a retinal disease using the pharmaceutical composition, and a food composition comprising a maple leaf extract or fraction thereof for ameliorating the symptoms of a retinal disease. The pharmaceutical composition according to the present invention, which is effective for the treatment of a retinal disease, can be used pharmaceutically as a composition for preventing or treating a retinal disease, and can also be used advantageously as a health functional food.Type: GrantFiled: August 11, 2017Date of Patent: January 31, 2023Assignee: KOREA INSTITUTE OF ORIENTAL MEDICINEInventors: Jin Yeul Ma, Kwang Il Park, Yeoun-Hee Kim, Tae Woo Oh, Won Kyung Cho, Dong-Gun Kim, Eun Hee Park
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Publication number: 20220198111Abstract: A method of reinforcement learning of a neural network device for generating a verification vector for verifying a circuit design comprising a circuit block includes inputting a test vector to the circuit block, generating one or more rewards based on a coverage corresponding to the test vector, the coverage being determined based on a state transition of the circuit block based on the test vector, and applying the one or more rewards to a reinforcement learning.Type: ApplicationFiled: March 11, 2022Publication date: June 23, 2022Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: In Huh, Jeong-hoon Ko, Hyo-jin Choi, Seung-ju Kim, Chang-wook Jeong, Joon-wan Chai, Kwang-il Park, Youn-sik Park, Hyun-sun Park, Young-min Oh, Jun-haeng Lee, Tae-ho Lee
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Patent number: 11281832Abstract: A device for verifying a circuit design including a first circuit block and a second circuit block includes a verification vector generator and a design verifier. The verification vector generator determines a first verification vector by performing reinforcement learning through neural network computation based on a coverage corresponding to a first test vector, the coverage being determined based on a state transition of the first circuit block generated by inputting the first test vector to the first circuit block. The design verifier performs design verification for the first circuit block by using the first verification vector.Type: GrantFiled: February 12, 2020Date of Patent: March 22, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: In Huh, Jeong-hoon Ko, Hyo-jin Choi, Seung-ju Kim, Chang-wook Jeong, Joon-wan Chai, Kwang-il Park, Youn-sik Park, Hyun-sun Park, Young-min Oh, Jun-haeng Lee, Tae-ho Lee
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Patent number: 11282634Abstract: A coil electronic component includes a body and external electrodes disposed on an external surface of the body. The body includes a support member including a through-hole, upper and lower coils supported by the support member and including a plurality of coil patterns, a via connecting the upper and lower coils to each other, and an insulating wall supported by the support member and insulating adjacent coil patterns from each other. The via is formed on at least a portion of a interface of the through-hole.Type: GrantFiled: July 31, 2018Date of Patent: March 22, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Sun Kim, Kwang Il Park
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Patent number: 11216339Abstract: A semiconductor memory device includes an error correction code (ECC) engine, a memory cell array, an input/output (I/O) gating circuit and a control logic circuit. The memory cell array includes a normal cell region configured to store main data and a parity cell region configured to selectively store parity data which the ECC engine generates based on the main data, and sub data received from outside of the semiconductor memory device. The control logic circuit controls the ECC engine to selectively perform an ECC encoding and an ECC decoding on the main data and controls the I/O gating circuit to store the sub data in at least a portion of the parity cell region.Type: GrantFiled: November 25, 2020Date of Patent: January 4, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Young-Hun Seo, Kwang-Il Park, Seung-Jun Bae, Sang-Uhn Cha
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Publication number: 20210210276Abstract: A coil component includes a support substrate, a coil portion disposed on one surface of the support substrate and having one end and the other end connected by a plurality of turns, a body in which the support substrate and the coil portion are embedded, a lead portion extending from one end of the coil portion, and an auxiliary lead portion disposed between one end of the coil portion and the other end of the coil portion, and extending from the coil portion to be spaced apart from the lead portion, on one surface of the support substrate. The lead portion and the auxiliary lead portion are exposed to an external surface of the body to be spaced apart from each other.Type: ApplicationFiled: July 2, 2020Publication date: July 8, 2021Inventor: Kwang Il PARK