Abstract: A power conversion system has a three-phase AC input, where each AC input phase is linked to a string of cascaded single-phase AC-DC converters placed in series with a three-phase AC-DC converter. Each single-phase AC-DC converter in one embodiment includes a silicon carbide (SiC) pulse width modulated MOSFET H-bridge that placed in series with the three-phase AC-DC converter that includes a silicon (Si) SCR bridge. The single-phase AC-DC converters and the three-phase AC-DC converter together in one embodiment include a mixed silicon-carbide (SiC) and silicon (Si) device topology.

Abstract: A heat sink for cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises at least one thermally conductive material and defines multiple inlet manifolds configured to receive a coolant, multiple outlet manifolds configured to exhaust the coolant, and multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The manifolds and millichannels are disposed proximate to the respective one of the upper and lower contact surface of the electronic device package for cooling the respective surface with the coolant.

Abstract: A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.

Abstract: A method of forming a vertical MOSFET device includes forming a first trench within a semiconductor layer of a first polarity, the first trench generally defining a well region of a second polarity opposite the first polarity; growing a first epitaxial well layer of the second polarity over the original semiconductor layer; growing a second epitaxial source contact layer of the first polarity over the well layer; forming a second trench through the source contact layer and at least a portion of the well layer; growing a third epitaxial layer of the second polarity over the source contact layer; and planarizing at least the first and second epitaxial layers so as to expose an upper surface of the original semiconductor layer, wherein a top surface of the third epitaxial layer is substantially coplanar with a top surface of the source contact layer prior to ohmic contact formation.

Abstract: A capacitor is provided. The capacitor includes a dielectric polymer film comprising a cyanoresin and at least one electrode coupled to the dielectric polymer film. The capacitor has an energy density of at least about 5 J/cc. A method of making a capacitor is provided. The method includes dissolving a cyanoresin in a solvent to form a solution and coating the solution on a substrate to form a dielectric polymer film. The dielectric polymer film has a breakdown strength of at least about 300 kV/mm.

Abstract: A galvanic isolated DC-DC and DC-AC power conversion system is coupled to a plurality of DC sources which are derived from a combination of a plurality of single-phase and three-phase AC-DC converters. The DC-DC and DC-AC power conversion system in one embodiment is configured to provide mixed type outputs (mixed frequency, e.g. DC with 50 or 60 Hz, with 400 Hz; mixed voltage levels).

Abstract: A power conversion system has a three-phase AC input, where each AC input phase is linked to a string of cascaded single-phase AC-DC converters placed in series with a three-phase AC-DC converter. Each single-phase AC-DC converter in one embodiment includes a silicon carbide (SiC) pulse width modulated MOSFET H-bridge that placed in series with the three-phase AC-DC converter that includes a silicon (Si) SCR bridge. The single-phase AC-DC converters and the three-phase AC-DC converter together in one embodiment include a mixed silicon-carbide (SiC) and silicon (Si) device topology.

Abstract: A capacitor is provided. The capacitor includes a dielectric polymer film comprising a cyanoresin and at least one electrode coupled to the dielectric polymer film. The capacitor has an energy density of at least about 5 J/cc. A method of making a capacitor is provided. The method includes dissolving a cyanoresin in a solvent to form a solution and coating the solution on a substrate to form a dielectric polymer film. The dielectric polymer film has a breakdown strength of at least about 300 kV/mm.

Abstract: An apparatus for cooling at least one heated surface includes a base plate defining a number of inlet and outlet manifolds. The inlet manifolds are configured to receive a coolant, and the outlet manifolds exhaust the coolant. The inlet and outlet manifolds are interleaved. The apparatus also includes at least one substrate having inner and outer surfaces. The inner surface is coupled to the base plate and defines a number of microchannels that receive the coolant from the inlet manifolds and deliver the coolant to the outlet manifolds. The microchannels are oriented substantially perpendicular to the inlet and outlet manifolds. The outer surface is in thermal contact with the heated surface. The apparatus also includes an inlet plenum that supplies the coolant to the inlet manifolds, and an outlet plenum that exhausts the coolant from the outlet manifolds. The inlet plenum and outlet plenum are oriented in a plane of the base plate.

Abstract: A current sensing system for estimating current in substantially parallel planar conductors. The system includes a magnetostrictive optical sensor including an optical sensing element coupled to a magnetostrictive element and disposed between substantially parallel planar conductors, wherein the magnetostrictive element is configured to cause a strain in the optical sensing element in the presence of a magnetic field between the substantially parallel planar conductors, and wherein the optical sensing element is configured to receive an optical interrogation signal and provide a wavelength modulated data signal indicative of magnitude of the current flowing through the conductors.

Abstract: A power module includes a substrate that includes an upper layer, an electrical insulator and a thermal coupling layer. The upper layer includes an electrically conductive pattern and is configured for receiving power devices. The electrical insulator is disposed between the upper layer and the thermal coupling layer. The thermal coupling layer is configured for thermal coupling to a heat sink. The power module further includes at least one laminar interconnect that includes first and second electrically conductive layers and an insulating layer disposed between the first and second electrically conductive layers. The first electrically conductive layer of the laminar interconnect is electrically connected to the upper layer of the substrate. Electrical connections connect a top side of the power devices to the second electrically conductive layer of the laminar interconnect.

Abstract: A technique is provided for direct digital phase control of resonant inverters based on sensing of one or more parameters of the resonant inverter. The resonant inverter control system includes a switching circuit for applying power signals to the resonant inverter and a sensor for sensing one or more parameters of the resonant inverter. The one or more parameters are representative of a phase angle. The resonant inverter control system also includes a comparator for comparing the one or more parameters to a reference value and a digital controller for determining timing of the one or more parameters and for regulating operation of the switching circuit based upon the timing of the one or more parameters.

Abstract: A lamp having a lighting source, integral electronics, and a thermal distribution mechanism disposed in a housing. The thermal distribution mechanism may include a For example, the lamp may include a thermal shield between the lighting source and the integral electronics. The lamp also may have a forced convection mechanism, such as an air-moving device, disposed adjacent the integral electronics. A heat pipe, a heat sink, or another conductive heat transfer member also may be disposed in thermal communication with one or more of the integral electronics. For example, the integral electronics may be mounted to a thermally conductive board. The housing itself also may be thermally conductive to conductively spread the heat and convect/radiate the heat away from the lamp.

Abstract: An apparatus for cooling at least one heated surface includes a base plate defining a number of inlet and outlet manifolds. The inlet manifolds are configured to receive a coolant, and the outlet manifolds exhaust the coolant. The inlet and outlet manifolds are interleaved. The apparatus also includes at least one substrate having inner and outer surfaces. The inner surface is coupled to the base plate and defines a number of microchannels that receive the coolant from the inlet manifolds and deliver the coolant to the outlet manifolds. The microchannels are oriented substantially perpendicular to the inlet and outlet manifolds. The outer surface is in thermal contact with the heated surface. The apparatus also includes an inlet plenum that supplies the coolant to the inlet manifolds, and an outlet plenum that exhausts the coolant from the outlet manifolds. The inlet plenum and outlet plenum are oriented in a plane of the base plate.

Abstract: An X-ray localizer light system comprises: a long life X-ray localizer light source; an optical concentrator, the light source being situated at a first focal spot, the optical concentrator being configured for concentrating X-ray localizer light from the light source to a second focal spot; and an opaque shield having an aperture therein situated proximate to the second focal spot and being of such a geometrical shape so as to maximize light throughput while meeting light field edge contrast requirements. In another light system, the optical concentrator comprises a reflector comprising a quasi-ellipsoidal portion within which the light source is situated, a cylindrical portion situated between the quasi-ellipsoidal portion and the shield for reflecting stray light, a back reflector portion situated proximate to the shield, and a centrally-mounted portion situated between the aperture and the light source for directing back-reflected light in the direction of the aperture.

Abstract: An X-ray localizer light system comprises: a long life X-ray localizer light source; an optical concentrator, the light source being situated at a first focal spot, the optical concentrator being configured for concentrating X-ray localizer light from the light source to a second focal spot; and an opaque shield having an aperture therein situated proximate to the second focal spot and being of such a geometrical shape so as to maximize light throughput while meeting light field edge contrast requirements. In another light system, the optical concentrator comprises a reflector comprising a quasi-ellipsoidal portion within which the light source is situated, a cylindrical portion situated between the quasi-ellipsoidal portion and the shield for reflecting stray light, a back reflector portion situated proximate to the shield, and a centrally-mounted portion situated between the aperture and the light source for directing back-reflected light in the direction of the aperture.

Abstract: An X-ray localizer light system comprises: a long life X-ray localizer light source; an optical concentrator, the light source being situated at a first focal spot, the optical concentrator being configured for concentrating X-ray localizer light from the light source to a second focal spot; and an opaque shield having an aperture therein situated proximate to the second focal spot and being of such a geometrical shape so as to maximize light throughput while meeting light field edge contrast requirements. In another light system, the optical concentrator comprises a reflector comprising a quasi-ellipsoidal portion within which the light source is situated, a cylindrical portion situated between the quasi-ellipsoidal portion and the shield for reflecting stray light, a back reflector portion situated proximate to the shield, and a centrally-mounted portion situated between the aperture and the light source for directing back-reflected light in the direction of the aperture.

Abstract: An LED light device comprising an LED for generating a light beam, and a reflector that concentrates the light beam to have bright illumination, uniform light field, and sharp edge contrast. The LED light device may be used in an x-ray collimator to facilitate positioning a patient and an x-ray machine relative to each other so that an x-ray beam is directed along a defined axis and onto a specified target zone on the patient. The collimator comprises at least one high energy LED array for generating a light beam and directing the light beam along the defined axis, wherein the light beam expands outward from the LED array at a beam cone angle, and an optical concentrator having a reflective surface, wherein the light beam is emitted from the LED array at a beam cone angle defined by the reflective surface of the optical concentrator.

Abstract: A lamp having a lighting source, integral electronics, and a thermal distribution mechanism disposed in a housing. The thermal distribution mechanism may include a variety of insulative, radiative, conductive, and convective heat distribution techniques. For example, the lamp may include a thermal shield between the lighting source and the integral electronics. The lamp also may have a forced convection mechanism, such as an air-moving device, disposed adjacent the integral electronics. A heat pipe, a heat sink, or another conductive heat transfer member also may be disposed in thermal communication with one or more of the integral electronics. For example, the integral electronics may be mounted to a thermally conductive board. The housing itself also may be thermally conductive to conductively spread the heat and convect/radiate the heat away from the lamp.

Abstract: An X-ray localizer light system comprises: a long life X-ray localizer light source; an optical concentrator, the light source being situated at a first focal spot, the optical concentrator being configured for concentrating X-ray localizer light from the light source to a second focal spot; and an opaque shield having an aperture therein situated proximate to the second focal spot and being of such a geometrical shape so as to maximize light throughput while meeting light field edge contrast requirements. In another light system, the optical concentrator comprises a reflector comprising a quasi-ellipsoidal portion within which the light source is situated, a cylindrical portion situated between the quasi-ellipsoidal portion and the shield for reflecting stray light, a back reflector portion situated proximate to the shield, and a centrally-mounted portion situated between the aperture and the light source for directing back-reflected light in the direction of the aperture.