Patents by Inventor Mark Lin

Mark Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6552902
    Abstract: A heat sink (10) includes a circular base (20), a plurality of fins (30), and a central post (40). The base is adapted to be in thermal contact with an electronic device, to remove heat therefrom. The post extends from a top surface (26) of the base. The post has a first surface connected to the top surface and a second surface (44) dimensioned according to a heat sink fan to be attached thereon. The post also has a concave side surface (42) between the second surface of the post and the top surface of the base, for directing airflow. The fins are identical in height to the post. The fins are curved, aligned and spaced from each other at uniform intervals corresponding to directions of airflow generated from the fan. These minimize resistance to cooling air entering or exiting the heat sink.
    Type: Grant
    Filed: March 29, 2001
    Date of Patent: April 22, 2003
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Eric Cho, Carey Lai, Mark Lin
  • Publication number: 20030041395
    Abstract: A method for manufacturing the body of a shaft shoe; it is characterized in that: before the body of safety shoe is molded, multi-layered cloth obtained by wearing glass fibers, or carbon fibers, or the mixed fibers of glass fibers and carbon fibers in a plurality of directions is coated with epoxy resins onto its two surfaces, and then, said cloth is put between the outer and inner layers of leather. It is preferably to be put at an enforced portion, such as the head portion of a shoe. Then the molded shoe is light in weight, excellent in strength and can be quickly molded.
    Type: Application
    Filed: August 31, 2001
    Publication date: March 6, 2003
    Inventors: Mark Lin, Kun-Chiu Yu
  • Patent number: 6370964
    Abstract: A diagnostic layer having a network of actuators and sensors may be incorporated into or on the surface of composite, metallic, and laminated materials for monitoring the structural health of the material. The diagnostic layer is adapted for detecting and measuring changes in the condition of the material, e.g., the site and extent of damage in the material. In a preferred embodiment, piezoelectric devices are embedded in the diagnostic layer in a network, and serve as actuators and sensors. Signals emitted from the sensors in response to physical deformation, either by an impact or as a result of stress waves generated by the actuators, are diagnostic of the current condition of the diagnostic layer. The diagnostic layer is also adapted to monitor the curing process of a composite material and accurately determine when curing is complete. Methods for monitoring changes in conditions of a material are also disclosed.
    Type: Grant
    Filed: November 23, 1999
    Date of Patent: April 16, 2002
    Assignee: The Board of Trustees of the Leland Stanford Junior University
    Inventors: Fu-Kuo Chang, Mark Lin
  • Publication number: 20020036893
    Abstract: A heat sink (10) includes a circular base (20), a plurality of fins (30), and a central post (40). The base is adapted to be in thermal contact with an electronic device, to remove heat therefrom. The post extends from a top surface (26) of the base. The post has a first surface connected to the top surface and a second surface (44) dimensioned according to a heat sink fan to be attached thereon. The post also has a concave side surface (42) between the second surface of the post and the top surface of the base, for directing airflow. The fins are identical in height to the post. The fins are curved, aligned and spaced from each other at uniform intervals corresponding to directions of airflow generated from the fan. These minimize resistance to cooling air entering or exiting the heat sink.
    Type: Application
    Filed: March 29, 2001
    Publication date: March 28, 2002
    Inventors: Eric Cho, Carey Lai, Mark Lin
  • Patent number: 6311766
    Abstract: A heat sink assembly includes a heat sink (50), a fan (10), and a fixing device (30). The heat sink has a chassis (56) which defines a pair of diagonally opposite grooves (58) in respective opposite side walls thereof. The fan defines a vertical through hole (12) at each comer. The fixing device has a rectangular base (35). A pole (32) having a barb (36) extends upwardly from each comer of the base, for engaging with the corresponding through hole. A pair of legs (40) depends from each side of the base. A catch (42) is formed at a distal end of each leg, for engaging with the heat sink. Two guard boards (46) depend from each side of the base. A pair of bosses (48) is formed at distal ends of two diagonally opposite guard boards, for engaging with the grooves of the heat sink.
    Type: Grant
    Filed: December 26, 2000
    Date of Patent: November 6, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Mark Lin, Carey Lai, Hans Wan
  • Patent number: 6093646
    Abstract: The present invention provides a manufacturing method for a poly film with an anti-reflection rough surface is provided. The method comprises steps of, at first, a thin film is formed over a substrate, and a amorphous silicon layer is formed over the thin film. Next, in situ a first annealing procedure is performed over the amorphous silicon layer. The amorphous silicon layer is changed into a polysilicon layer with the anti-reflection rough surface. Next, in situ a second annealing procedure is selectively performed. The polysilicon layer with the anti-reflection rough surface is doped by reacting with a gas induced. Then, the thin film and the polysilicon layer with the anti-reflection rough surface is defined, whereby the poly film with an anti-reflection rough surface is formed over the substrate.
    Type: Grant
    Filed: March 2, 1998
    Date of Patent: July 25, 2000
    Assignee: United Semiconductor Corp.
    Inventors: Jacky Kuo, Mark Lin, Steven Hsiao
  • Patent number: 6081847
    Abstract: A Fibre Channel network is provided with an efficient implementation of the loop initialization process. In one embodiment, the network comprises nodes coupled by unidirectional serial communications links in a ring topology. The nodes typically include a serial communications transceiver, a transmit controller, a receive controller, and a memory unit. The serial communications transceiver operates to drive transmit signals on the outgoing serial communications link and to buffer receive signals from the incoming serial communications link. The memory unit includes transmit and receive buffers that are coupled to the transceiver via transmit and receive controllers. One or more of the nodes may also include a control register having an "autoswap" bit. The autoswap bit is initially reset to 0 when the node enters the initialization mode.
    Type: Grant
    Filed: February 27, 1998
    Date of Patent: June 27, 2000
    Assignee: LSI Logic Corporation
    Inventor: Mark Lin
  • Patent number: 6068532
    Abstract: A method for forming a vacuum display device elongated spacers therein and devices formed by such method are disclosed. In the method, a number of elongated spacers are first mounted in a clamping fixture such that the bottom edges of the spacers extends perpendicularly away from the clamping fixture and are sufficiently exposed. The clamping fixture with the elongated spacers are then pushed onto a substrate that is coated with a layer of adhesive material. After the bottom edges of the spacers are adequately coated with a layer of adhesive material, the clamping fixture is removed from the layer of adhesive and then pushed onto a lower glass panel of the vacuum display device with the spacers contacting spacings provided between active regions on the top surface of the lower glass plate. The completed structure may optionally be subjected to an annealing process at a temperature between about 250.degree. C. and about 600.degree. C. to improve the bond strength and to relieve the bonding stress.
    Type: Grant
    Filed: July 21, 1999
    Date of Patent: May 30, 2000
    Assignee: Industrial Technology Research Institute
    Inventors: Jiun-Tsuen Lai, Mark Lin, Cheng-Chung Lee
  • Patent number: 5222311
    Abstract: A shoe includes an outsole which has a flat tread portion and a peripheral member that extends upwardly from the periphery of the tread portion. The peripheral member has an upper section and a lower section. The tread portion and the lower section of the peripheral member cooperatively define a receptacle. A resilient cushioning wedge is adapted to be received in the receptacle and has an upper base member with a top side and a bottom side. The bottom side is integrally formed with a plurality of downwardly extending cushioning elements which have free ends glued to the tread portion. The base member has a periphery glued to the peripheral member. An insole is glued to the top side of the cushioning wedge. The shoe further includes a vamp which has a bottom end sewed to the insole and a bottom periphery sewed to the upper section of the peripheral member.
    Type: Grant
    Filed: February 10, 1992
    Date of Patent: June 29, 1993
    Inventor: Mark Lin
  • Patent number: D303730
    Type: Grant
    Filed: November 3, 1986
    Date of Patent: October 3, 1989
    Assignee: Autry Industries, Inc.
    Inventors: James C. Autry, Mark Lin