Abstract: The semiconductor device includes: a semiconductor module including a plate-shaped semiconductor element, a conductor electrically connected to one surface of the semiconductor element, a heat dissipation plate of which one surface is thermally and electrically connected to another surface of the semiconductor element, a resin member sealing the semiconductor element, the conductor, and the heat dissipation plate, and an insulation heat dissipation member thermally connected to another surface of the heat dissipation plate exposed from the resin member; a heatsink thermally connected to the insulation heat dissipation member; and an electric field inhibiting plate including a plate-shaped thin part covering the one surface of the semiconductor element and opposed thereto so as to be separated therefrom, the thin part being sealed by the resin member, and a connection part extending from the thin part to the heatsink and thermally and electrically connected to the heatsink.

Abstract: A radio-frequency module includes a mounting substrate having a first main surface; a first power amplifier that is mounted on the first main surface and that amplifies a first transmission signal in a first frequency band; a second power amplifier that is mounted on the first main surface and that amplifies a second transmission signal in a second frequency band different from the first frequency band; a first output matching circuit that is mounted on the first main surface and that receives the first transmission signal amplified by the first power amplifier; and a second output matching circuit that is mounted on the first main surface and that receives the second transmission signal amplified by the second power amplifier. The first output matching circuit and the second output matching circuit are mounted along a second direction intersecting with the first direction.

Abstract: A power conversion device includes: a power semiconductor module; a capacitor; a heatsink; cooling fins; a first partition; a cooling flow path through which a coolant flows between the heatsink and the first partition; a second partition extending from the first partition; an inflow path extending from a coolant inlet along another surface of the first partition and a surface of the second partition on a first side surface side, and connected to a first side surface side of the cooling flow path; and an outflow path extending from a coolant outlet along the other surface of the first partition and a surface of the second partition on a second side surface side, and connected to a second side surface side of the cooling flow path, wherein a length of the first side surface of the power semiconductor module is greater than a length of the third side surface thereof.

Abstract: A multiplexer includes a common terminal, reception output terminals (120 and 130), a filter (20) that is connected between the common terminal and the reception output terminal (120), a filter (30) that is connected between the common terminal and the reception output terminal (130) and has a pass band different from a pass band of the filter (20), and an impedance matching circuit that is arranged between the common terminal and the filter (30). The impedance matching circuit includes a parallel-arm resonator that is connected between a node (N1) on a path connecting the common terminal to the filter (30) and a ground.

Abstract: The semiconductor device includes: a semiconductor module including a plate-shaped semiconductor element, a conductor electrically connected to one surface of the semiconductor element, a heat dissipation plate of which one surface is thermally and electrically connected to another surface of the semiconductor element, a resin member sealing the semiconductor element, the conductor, and the heat dissipation plate, and an insulation heat dissipation member thermally connected to another surface of the heat dissipation plate exposed from the resin member; a heatsink thermally connected to the insulation heat dissipation member; and an electric field inhibiting plate including a plate-shaped thin part covering the one surface of the semiconductor element and opposed thereto so as to be separated therefrom, the thin part being sealed by the resin member, and a connection part extending from the thin part to the heatsink and thermally and electrically connected to the heatsink.

Abstract: A multiplexer includes a common terminal, a first reception output terminal, a second reception output terminal, a first filter that is connected between the common terminal and the first reception output terminal, a second filter that is connected between the common terminal and the second reception output terminal and that has a passband different from that of the first filter, and an impedance matching circuit that is disposed between the common terminal and the second filter. The impedance matching circuit includes a serial arm resonator disposed in series on a path connecting the common terminal to the second filter.

Abstract: Provided is a semiconductor power module including: a first electrode on which a plurality of element arrays each including a plurality of semiconductor elements arranged in an X direction, are arranged in a Y direction; a first main wiring connected to the respective element arrays mounted on the first electrode; a first sensor mounted on a first detection target element as one of the semiconductor elements, which is least influenced by synthetic inductance of the first main wiring among the semiconductor elements of the plurality of element arrays mounted on the first electrode; a first control terminal disposed on the first electrode; and a control board configured to control a current flowing through the first detection target element based on a detection result of the first sensor obtained via the first control terminal.

Abstract: An object of the present disclosure is to suppress variation in currents flowing through semiconductor elements and thereby to achieve size reduction of the semiconductor elements. The semiconductor power module includes electrode terminals for connecting a first electrode to a first external electric component, a second electrode joined to upper surfaces of a plurality of semiconductor elements, and a second electrode extension portion for connecting the second electrode to a second external electric component. The sum of a current path length from the electrode terminal to the semiconductor element in the first electrode and a current path length from the semiconductor element to a second electrode terminal portion in the second electrode, is set to be the same among the plurality of semiconductor elements.

Abstract: It provides an operation part calculating an energy recovered by the heat exchanger in the heat exchanger and energies consumed by the air blower for absorption and the air blower for discharge and determining which of the energy recovered by the heat exchange and the energies consumed by the air blower for absorption and the air blower for discharge is greater, and a control part controlling at least one of the air blower for absorption and the air blower for discharge so that the energy consumed by the air blower for absorption and the air blower for discharge becomes small when the operation part determines that the energy consumed by the air blower for absorption and the air blower for discharge is greater than the energy recovered by the heat exchanger.

Abstract: Even when frequency characteristics are changed in association with multiple communication bands, an attenuation required for a specific frequency band outside a pass band is obtained. A frequency-variable filter (10) includes multiple series-arm resonators (111, 112, 113), multiple parallel-arm resonators (121, 122, 123), a variable capacitor (21), and an inductor (31) having a fixed inductance. The multiple series-arm resonators (111, 112, 113) and the multiple parallel-arm resonators (121, 122, 123) are connected in a ladder shape. The variable capacitor (21) is connected in series with the parallel-arm resonator (121). The fixed inductor (31) is connected in series with the parallel-arm resonator (123).

Abstract: Filters 10 and 20 having respective pass bands different from each other, a common terminal to which a terminal 11 of the filter 10 and a terminal of the filter 20 are connected, and an inductor of which one end is connected to the terminal 11 and another end is connected to the common terminal. The filter 10 includes a longitudinally coupled resonator formed of a resonator 132 and resonators 131 and 133 disposed on both sides of the resonator 132, in which the resonator 132 is connected to the terminal 11, and a parallel resonator of which one end is connected to the resonator 132 and another end is connected to a ground electrode, and the resonator 132 and the parallel resonator of the resonators included in the filter 10 are connected to a signal path between the resonator 132 and the terminal 11.

Abstract: Provided is a semiconductor power module including: a first electrode on which a plurality of element arrays each including a plurality of semiconductor elements arranged in an X direction, are arranged in a Y direction; a first main wiring connected to the respective element arrays mounted on the first electrode; a first sensor mounted on a first detection target element as one of the semiconductor elements, which is least influenced by synthetic inductance of the first main wiring among the semiconductor elements of the plurality of element arrays mounted on the first electrode; a first control terminal disposed on the first electrode; and a control board configured to control a current flowing through the first detection target element based on a detection result of the first sensor obtained via the first control terminal.

Abstract: A multiplexer includes a common terminal, a first acoustic wave filter having a first frequency band as a pass band, and having a first input/output terminal connected to the common terminal, a second acoustic wave filter having a second frequency band higher than the first frequency band as a pass band, and having a second input/output terminal connected to the common terminal, an inductance element, and a first capacitance element. The first acoustic wave filter has a parallel resonator of which one end is connected to the first input/output terminal and another end is connected to a ground electrode, and the first input/output terminal is connected to the common terminal via the inductance element, and the first capacitance element is connected between a signal path between the one end of the parallel resonator and the inductance element, and a ground electrode.

Abstract: A multiplexer includes first, second, and third filters with first, second, and third frequency bands different from each other, a first connection point connected to a common terminal, a second connection point connected to one end of the first filter and one end of the second filter, a first switch that switches connection and disconnection between the first and second connection points, a reactance element whose one end is connected to a signal path connecting the second connection point and the first switch, a second switch that switches connection and disconnection between the other end of the reactance element and the first connection point, and a third switch that switches connection and disconnection between one end of the third filter and the first connection point. The first and second frequency bands are adjacent to each other among the first, second, and third frequency bands.

Abstract: A cooler configured to cool an electronic device includes: a refrigerant inlet portion configured to guide refrigerant from an outside of a casing to an inside of the casing; a refrigerant outlet portion configured to guide the refrigerant from the inside of the casing to the outside of the casing; and a metal member located inside the casing and configured to define a flow path region in which the refrigerant is caused to flow from the refrigerant inlet portion to the refrigerant outlet portion. The metal member includes: a plurality of opening portions configured to cause the refrigerant to pass therethrough; and a capture and reduction portion having such a shape as to capture air bubbles, which are generated through a connection surface between the casing and the electronic device. The air bubbles are reduced through cooling by the refrigerant when the electronic device is cooled.

Abstract: Even when frequency characteristics are changed in association with multiple communication bands, an attenuation required for a specific frequency band outside a pass band is obtained. A multiplexer includes a transmission filter, a reception filter, and a common connection point. An antenna-side end of the transmission filter and an antenna-side end of the reception filter are connected to the common connection point. The transmission filter includes multiple resonators including a parallel-arm resonator and a variable capacitor that is connected in series with the parallel-arm resonator. An inductor for forming an attenuation pole is provided between the antenna-side end of the reception filter and the common connection point. By the inductor for forming an attenuation pole and the reception filter, which is capacitive, an attenuation pole at a frequency close to or equal to a specific frequency outside the pass band of a transmission signal is formed.

Abstract: A plurality of semiconductor elements have sources which are commonly connected, and drains which are commonly connected. A voltage measurement unit measures an ON voltage between the source of a first semiconductor element of the plurality of semiconductor elements and the drain of the first semiconductor element. A determination unit receives information indicating a magnitude of an ON current between the source of the first semiconductor element and the drain of the first semiconductor element, and a measured value of the ON voltage in the voltage measurement unit, and determines whether the plurality of semiconductor elements are in a normal state or in an overheated state based on the measured value of the ON voltage and the received information indicating the magnitude of the ON current.

Abstract: In the application, since the flow of air outside the vehicle compartment flowing through the upstream heat exchange part and the flow of air outside the vehicle compartment flowing through the downstream heat exchange part are opposite flows, a second heat exchanger through which the air outside the vehicle compartment flowing from the first fan through the downstream heat exchange part flows, a first heat exchanger is an orthogonal heat exchanger, the second heat exchanger that is a component of a refrigeration cycle execution system, the air in the vehicle compartment, which flows in from the inside air inlet by the rotation of the second fan and is discharged from the outlet outside the vehicle through the first heat exchanger, and the air outside the vehicle compartment, are exchanged with the first heat exchanger, it can be miniaturized along with the improvement of electricity cost.

Abstract: A plurality of semiconductor elements have sources which are commonly connected, and drains which are commonly connected. A voltage measurement unit measures an ON voltage between the source of a first semiconductor element of the plurality of semiconductor elements and the drain of the first semiconductor element. A determination unit receives information indicating a magnitude of an ON current between the source of the first semiconductor element and the drain of the first semiconductor element, and a measured value of the ON voltage in the voltage measurement unit, and determines whether the plurality of semiconductor elements are in a normal state or in an overheated state based on the measured value of the ON voltage and the received information indicating the magnitude of the ON current.

Abstract: In a power converting device, an anode lead plate and a cathode lead plate are disposed opposed in an interior of an insulating plate, whereby the respective current directions are opposed and a magnetic field is negated, because of which inductance is reduced. Also, as external connection terminals, which are end portions of the anode lead plate and the cathode lead plate, pass through the interior of the insulating plate and are disposed in another space of the case from a lower portion of the insulating plate, the wiring distance between a capacitor element and a power semiconductor module is short, and inductance can be reduced.