Abstract: A semiconductor module is provided with a conductive member having one end, in a longitudinal direction, joined to an electrode of a semiconductor element that is mounted on an insulating substrate, the other end of the conductive member in the longitudinal direction being joined to a component different from the electrode. The conductive member is made up of a metal sheet, and has a bent portion at the one end and at the other end. The bent portion provided at the one end has a cut in a leading end portion, in the longitudinal direction, and an end joining section at which the cut is not present is joined to the electrode of the semiconductor element. As a result, a semiconductor module can be realized that allows combination of increased current capacity with improved reliability.

Abstract: A first attenuation circuit is connected between a node and ground, and the node is located between a ladder resonance circuit and a transmitter-side terminal. A second attenuation circuit is connected between a first parallel arm resonator of the ladder resonance circuit and ground and is connected in series to the first parallel arm resonator. The first attenuation circuit includes a second parallel arm resonator and a first switch that switches between a first state in which the second parallel arm resonator is connected to the node and a second state in which the first switch is open. The second attenuation circuit includes a capacitor and a second switch that switches between a first state in which the capacitor is connected to the first parallel arm resonator and a second state in which the first parallel arm resonator is connected to ground.

Abstract: A variable filter circuit includes: a series arm connected in series between a signal input terminal and a signal output terminal; a parallel arm connected between the series arm and a ground terminal that has a resonator; and a variable reactance portion in the parallel arm, and the resonator of a parallel arm at an initial stage connected to the signal input terminal that has a resonant frequency fr and an anti-resonant frequency fa that satisfy 100×(fn?fr)/(fa?fr)?23.9(%) for communication bands for each of which a stop band is set so as to be close to a high-frequency side of a pass band, among the plurality of communication bands, where a resonant frequency is fr, an anti-resonant frequency is fa, and a cutoff frequency at a high-frequency side of a pass band of each communication band is fn.

Abstract: Even when frequency characteristics are changed in association with multiple communication bands, an attenuation required for a specific frequency band outside a pass band is obtained. A frequency-variable filter (10) includes multiple series-arm resonators (111, 112, 113), multiple parallel-arm resonators (121, 122, 123), a variable capacitor (21), and an inductor (31) having a fixed inductance. The multiple series-arm resonators (111, 112, 113) and the multiple parallel-arm resonators (121, 122, 123) are connected in a ladder shape. The variable capacitor (21) is connected in series with the parallel-arm resonator (121). The fixed inductor (31) is connected in series with the parallel-arm resonator (123).

Abstract: Even when frequency characteristics are changed in association with multiple communication bands, an attenuation required for a specific frequency band outside a pass band is obtained. A multiplexer includes a transmission filter, a reception filter, and a common connection point. An antenna-side end of the transmission filter and an antenna-side end of the reception filter are connected to the common connection point. The transmission filter includes multiple resonators including a parallel-arm resonator and a variable capacitor that is connected in series with the parallel-arm resonator. An inductor for forming an attenuation pole is provided between the antenna-side end of the reception filter and the common connection point. By the inductor for forming an attenuation pole and the reception filter, which is capacitive, an attenuation pole at a frequency close to or equal to a specific frequency outside the pass band of a transmission signal is formed.

Abstract: Provided is a cooling device, a power conversion device, and a cooling system in which bubbles produced by boiling in the cooling device are inhibited from flowing out of the cooling device, and thus, vibration, noise, and damage to pipes and other components can be prevented. A cooling device according to the present invention includes a housing having a hollow interior, the housing having a refrigerant inlet from which refrigerant flows in and a refrigerant outlet from which the refrigerant flows out, and having, in the hollow interior, a refrigerant flow path through which the refrigerant flows, and an opening body provided in the housing, dividing the refrigerant flow path into a first area including a heating surface being at least one of a bottom surface and side surfaces of the housing and heating the refrigerant, and a second area including the refrigerant outlet, and having a plurality of openings.

Abstract: A frequency-variable filter includes a filter unit and matching circuits. The filter unit includes frequency-variable resonance circuits that include piezoelectric resonators. The matching circuits have a circuit configuration in which a real number component of an impedance increases as the frequency increases. For example, the matching circuits have an L-type circuit configuration that includes a reactance element connected in shunt to the side of the filter unit and that includes an inductor and a capacitor. As the filter unit includes the piezoelectric resonators, the real number component of the impedance increases as the pass band shifts to a high-frequency side, but the real number component of the impedance increases as the frequency increases in the matching circuits as well. Thus, the impedance matching is achieved.

Abstract: A high-frequency filter (10) includes a first input-output terminal (P1), a second input-output terminal (P2), a variable frequency filter (20), and a fixed frequency filter (30). The variable frequency filter (20) and the fixed frequency filter (30) are connected in series and coupled between the first input-output terminal (P1) and the second input-output terminal (P2). The variable frequency filter (20) is a filter capable of varying a passband and an attenuation band. The fixed frequency filter (30) is a filter having a fixed passband and a fixed attenuation band. The passband of the fixed frequency filter (30) is set so as to be at least partially overlapped with multiple passbands realized by the fixed frequency filter (30).

Abstract: A high-frequency filter (10) includes resonators (21, 31, and 32), an inductor (41), and a switch (51). The resonator (21) is connected between a first input/output terminal (P1) and a second input/output terminal (P2). One end of the inductor (41) is connected between the resonator (21) and the first input/output terminal (P1). One end of the resonator (31) is connected to the other end of the inductor (41). The switch (51) selects either a connection portion that connects the inductor (41) and the resonator (31) or the resonator (32) and connects either the connection portion or the resonator (32), which has been selected, to a terminal of the resonator (21) on the side of the second input/output terminal (P2). The switching between the connection modes of the switch (51) changes the circuit configuration of the high-frequency filter (10).

Abstract: A first attenuation circuit is connected between a node and ground, and the node is located between a ladder resonance circuit and a transmitter-side terminal. A second attenuation circuit is connected between a first parallel arm resonator of the ladder resonance circuit and ground and is connected in series to the first parallel arm resonator. The first attenuation circuit includes a second parallel arm resonator and a first switch that switches between a first state in which the second parallel arm resonator is connected to the node and a second state in which the first switch is open. The second attenuation circuit includes a capacitor and a second switch that switches between a first state in which the capacitor is connected to the first parallel arm resonator and a second state in which the first parallel arm resonator is connected to ground.

Abstract: A resonant circuit includes a resonator. An inductor is connected in parallel with the resonator. An inductor is connected in series with the parallel circuit formed of the resonator and the inductor. Further, a variable capacitor is connected in parallel with a series circuit formed of the inductor and the parallel circuit formed of the resonator and the inductor. The variable capacitor is connected in series with these circuits. As a result, a resonant circuit and a high-frequency filter supporting more communication signals are provided.

Abstract: A variable-frequency filter includes a series-arm resonant circuit and a parallel-arm resonant circuit. Each of the series-arm resonant circuit and the parallel-arm resonant circuit includes a piezoelectric resonator, an inductor, and a variable capacitor. A pass band of the variable-frequency filter is formed by a resonant point of the series-arm resonant circuit and a sub-anti-resonant point of the parallel-arm resonant circuit. An attenuation pole at a higher frequency than a pass band is formed by an anti-resonant point of the series-arm resonant circuit and a resonant point of the parallel-arm resonant circuit.

Abstract: A cooler configured to cool an electronic device includes: a refrigerant inlet portion configured to guide refrigerant from an outside of a casing to an inside of the casing; a refrigerant outlet portion configured to guide the refrigerant from the inside of the casing to the outside of the casing; and a metal member configured to define a flow path region in which the refrigerant is caused to flow from the refrigerant inlet portion to the refrigerant outlet portion in the inside of the casing. The metal member includes: a plurality of opening portions configured to cause the refrigerant to pass therethrough; and a capture and reduction portion having such a shape as to capture air bubbles, which are generated through a connection surface between the casing and the electronic device, so as to reduce the air bubbles through cooling by the refrigerant when the electronic device is cooled.

Abstract: A resonant circuit includes a resonator having a resonant frequency and an anti-resonant frequency, an inductor connected in series to the resonator, an inductor connected in parallel to the resonator, and a series circuit in which a variable capacitor is connected in series to an inductor (15). The series circuit is connected in parallel to the resonator. The anti-resonant frequency closest to the resonant frequency of the resonator is moved toward higher frequencies or lower frequencies of the resonant frequency on a frequency axis with a variation in the capacitance value of the variable capacitor. With this configuration, a resonator device and a high-frequency filter are provided, in which the relationship between a transmission frequency band and a reception frequency band on the frequency axis is applicable to a variety of multiple communication bands.

Abstract: In a power converting device, an anode lead plate and a cathode lead plate are disposed opposed in an interior of an insulating plate, whereby the respective current directions are opposed and a magnetic field is negated, because of which inductance is reduced. Also, as external connection terminals, which are end portions of the anode lead plate and the cathode lead plate, pass through the interior of the insulating plate and are disposed in another space of the case from a lower portion of the insulating plate, the wiring distance between a capacitor element and a power semiconductor module is short, and inductance can be reduced.

Abstract: A filter circuit includes a serial arm connected between ports (P1-P2), a parallel arm having a resonator connected in series between ports (P1-P3), and another parallel arm having another resonator connected in series between ports (P2-P3). The serial arm includes a switching circuit, and the switching circuit connects an inductor or a capacitor to the serial arm in series using a switch.

Abstract: Provided is a cooling device, a power conversion device, and a cooling system in which bubbles produced by boiling in the cooling device are inhibited from flowing out of the cooling device, and thus, vibration, noise, and damage to pipes and other components can be prevented. A cooling device according to the present invention includes a housing having a hollow interior, the housing having a refrigerant inlet from which refrigerant flows in and a refrigerant outlet from which the refrigerant flows out, and having, in the hollow interior, a refrigerant flow path through which the refrigerant flows, and an opening body provided in the housing, dividing the refrigerant flow path into a first area including a heating surface being at least one of a bottom surface and side surfaces of the housing and heating the refrigerant, and a second area including the refrigerant outlet, and having a plurality of openings.

Abstract: A high-frequency filter (10) includes resonators (21, 31, and 32), an inductor (41), and a switch (51). The resonator (21) is connected between a first input/output terminal (P1) and a second input/output terminal (P2). One end of the inductor (41) is connected between the resonator (21) and the first input/output terminal (P1). One end of the resonator (31) is connected to the other end of the inductor (41). The switch (51) selects either a connection portion that connects the inductor (41) and the resonator (31) or the resonator (32) and connects either the connection portion or the resonator (32), which has been selected, to a terminal of the resonator (21) on the side of the second input/output terminal (P2). The switching between the connection modes of the switch (51) changes the circuit configuration of the high-frequency filter (10).

Abstract: In the semiconductor module according to the present invention, a conducting member which is used to electrically connect a semiconductor element arranged on a substrate or a bus bar with another electronic component is provided with a structure having flexibility capable of, in a junction with the semiconductor element, reducing the thermal stress due to difference in a coefficient of linear expansion between the conducting member and the semiconductor element, and absorbing dimensional error in objects to be connected. Therefore, the semiconductor module achieves both increased current capacity of the semiconductor device and improved reliability of the semiconductor module.

Abstract: A semiconductor module is provided with a conductive member having one end, in a longitudinal direction, joined to an electrode of a semiconductor element that is mounted on an insulating substrate, the other end of the conductive member in the longitudinal direction being joined to a component different from the electrode. The conductive member is made up of a metal sheet, and has a bent portion at the one end and at the other end. The bent portion provided at the one end has a cut in a leading end portion, in the longitudinal direction, and an end joining section at which the cut is not present is joined to the electrode of the semiconductor element. As a result, a semiconductor module can be realized that allows combination of increased current capacity with improved reliability.