Abstract: A bonding method is capable of realizing high bonding strength and connection reliability even at a connection part in a high temperature area by means of simple operation low temperature bonding. The method includes a first step wherein, on at least one of the bonded surfaces of two materials to be bonded having a smooth surface, a thin film of noble metal with a volume diffusion coefficient greater than that of the base metal of the material to be bonded is formed using an atomic layer deposition method at a vacuum of 1.0 Pa or higher, a second step wherein a laminate is formed by overlapping the two materials to be bonded so that the bonded surfaces of the two materials are connected through the thin film, and a third step wherein the two materials to be bonded are bonded by holding the laminate at a predetermined temperature.

Abstract: A bonding method is capable of realizing high bonding strength and connection reliability even at a connection part in a high temperature area by means of simple operation low temperature bonding. The method includes a first step wherein, on at least one of the bonded surfaces of two materials to be bonded having a smooth surface, a thin film of noble metal with a volume diffusion coefficient greater than that of the base metal of the material to be bonded is formed using an atomic layer deposition method at a vacuum of 1.0 Pa or higher, a second step wherein a laminate is formed by overlapping the two materials to be bonded so that the bonded surfaces of the two materials are connected through the thin film, and a third step wherein the two materials to be bonded are bonded by holding the laminate at a predetermined temperature.

Abstract: A tool holder of a machine tool, in which the machine tool includes a spindle head and a spindle supported by the spindle head, includes: a shank portion attached to the spindle; a rotary portion integrally provided to the shank portion and to which a welding tool (processing tool) used for friction stir welding is attachable; a bearing mechanism (bearing) supporting the rotary portion so that the rotary portion is rotatable; and a bearing holder holding the bearing mechanism, in which the bearing holder is disposed facing the spindle head and is capable of transmitting a load applied to the bearing mechanism to the spindle head.

Abstract: A friction stir welding tool attachable to a spindle of a machine tool includes: a shank connected to the spindle; a chuck connected to the shank through a heat insulating portion; a welding tool connected to the chuck and usable for friction stir welding; and a cooling jacket provided on a circumferential surface of the chuck. The cooling jacket is provided with a refrigerant path for delivering a refrigerant.

Abstract: A tool holder of a machine tool, in which the machine tool includes a spindle head and a spindle supported by the spindle head, includes: a shank portion attached to the spindle; a rotary portion integrally provided to the shank portion and to which a welding tool (processing tool) used for friction stir welding is attachable; a bearing mechanism (bearing) supporting the rotary portion so that the rotary portion is rotatable; and a bearing holder holding the bearing mechanism, in which the bearing holder is disposed facing the spindle head and is capable of transmitting a load applied to the bearing mechanism to the spindle head.

Abstract: A friction stir welding tool attachable to a spindle of a machine tool includes: a shank connected to the spindle; a chuck connected to the shank through a heat insulating portion; a welding tool connected to the chuck and usable for friction stir welding; and a cooling jacket provided on a circumferential surface of the chuck. The cooling jacket is provided with a refrigerant path for delivering a refrigerant.

Abstract: A memory system includes a nonvolatile memory including first and second regions for storing firmware and a controller configured to access the nonvolatile memory based on a command from a host device. When the controller receives new firmware along with an update command and old firmware is stored in the first region, the controller stores the new firmware in the second region. When execution of firmware is triggered by an event specified by the update command after the new firmware has been stored, the controller executes the new firmware. When execution of firmware is triggered by an event that is not specified by the update command after the new firmware has been stored, the controller executes the old firmware.

Abstract: Disclosed is a solder bonding structure which is capable of retaining sufficient solder bonding strength and ensuring high bonding reliability even in severe environments having an extremely large temperature difference. In the solder bonding structure, an electronic component 4 is mounted on a main surface 1a of a substrate having an electrode section 2 and an insulating film 3, and the electrode section 2 and the electronic component 4 are electrically bonded to each other through a solder section 5, and a flux residue 6 exuded from the solder section 5 is present between the electronic component 4 and the insulating film 3. The flux contains an acrylic resin, an activating agent, and a thixotropic agent having a hydroxyl group. The glass transition point of the acrylic resin is not higher than ?40° C., or not lower than the softening temperature of the flux residue. The flux residue has a maximum value of 300×10?6/K or less of linear thermal expansion coefficient within a temperature range from ?40° C.

Abstract: A flux for a solder paste according to an aspect of the invention includes an acrylic resin obtained by radically copolymerizing a (meth)acrylate having a C6-C15 alkyl group and a (meth)acrylate other than the above-mentioned (meth)acrylate; and rosins. The weight ratio of the acrylic resin is 0.5 or greater and 1.2 or less when the weight of the rosins is taken as 1, and the flux for a solder paste is fluidized by application of a shear force of 10 Pa or greater and 150 Pa or less.

Abstract: A solder paste according to an aspect of the invention includes, within a flux, an activator that has a dibasic acid with a molecular weight of 250 or less, a monobasic acid with a molecular weight of 150 or greater and 300 or less, and a dibasic acid with a molecular weight of 300 or greater and 600 or less; and at least one resin additive selected from the group consisting of high-density polyethylenes and polypropylenes. The solder paste has the resin additive in an amount of 4% by weight or greater and 12% by weight or less when the total amount of the flux is taken as 100% by weight, and has a viscosity of 400 Pa·s or greater at 80° C.

Abstract: Disclosed is a solder bonding structure which is capable of retaining sufficient solder bonding strength and ensuring high bonding reliability even in severe environments having an extremely large temperature difference. In the solder bonding structure, an electronic component 4 is mounted on a main surface 1a of a substrate having an electrode section 2 and an insulating film 3, and the electrode section 2 and the electronic component 4 are electrically bonded to each other through a solder section 5, and a flux residue 6 exuded from the solder section 5 is present between the electronic component 4 and the insulating film 3. The flux contains an acrylic resin, an activating agent, and a thixotropic agent having a hydroxyl group. The glass transition point of the acrylic resin is not higher than ?40° C., or not lower than the softening temperature of the flux residue. The flux residue has a maximum value of 300×10?6/K or less of linear thermal expansion coefficient within a temperature range from ?40° C.

Abstract: There is provided a soldering flux in which the volatilized amount in reflow is reduced to enable soldering with a smaller environmental load while suppressing the stickiness of the flux residue and ensuring a high reliability. A solder paste composition using the same is also provided. The soldering flux comprises a base resin, an activating agent, and a solvent, wherein the solvent comprises an oil component having an iodine value of 120 to 170. Preferably, the content of the oil component is 22 to 80% by weight relative to the whole flux. Also, the oil component preferably contains at least one of drying oil and semidrying oil, and more preferably contains one or more kinds selected from tung oil, poppy-seed oil, walnut oil, safflower oil, sunflower oil, and soy bean oil. The solder paste composition comprises the soldering flux described above and a solder alloy powder.

Abstract: Provided is a soldering flux in which the volatilized amount in reflowing is reduced to enable soldering with a small environmental load while suppressing the stickiness of the flux residue to ensure a high reliability, as well as a solder paste composition and a soldering method using the same. The soldering flux comprises a base resin, an activating agent, and a solvent, wherein the solvent comprises an organic acid anhydride being liquid form at 20° C. or higher and a polyhydric alcohol being liquid form at 20° C. or higher, and when the acid value and the content of the organic acid anhydride is AV (mgKOH/g) and WA(g), respectively, and the hydroxyl value and the content of the polyhydric alcohol is OHV (mgKOH/g) and WOH(g), respectively, then AV×WA:OHV×WOH=1:0.4 to 0.6.

Abstract: A plurality of detection electrodes, connection electrodes, and wires are integrally formed on one surface of a light guide to produce a capacitance-type sensor integral with the light guide. The electrodes are partially formed on a curved portion of the light guide. A resin layer allows an outer case and the light guide to be tightly secured to each other.

Abstract: A method for managing a storage apparatus includes acquiring error information for each of physical addresses assigned to a logical address, and managing the error information for each of the physical addresses.

Abstract: A reflective display portion includes indication and background portions. A first reflective layer is formed on the indication portion, and a second reflective layer is formed on the background portion on an outer surface of a translucent sheet. Each of the indication and the background portions has a different reflectance value. A light limiting layer is formed on an inner surface of the sheet at an inner side of the second reflective layer so as to reduce a difference of a light transmittance between the indication portion and the background portion. When the external light reflects, the indication portion and the background portion of the reflective display portion are observable owing to the difference of the light reflectance. The light from the light emitting display portion transmits the indication and background portions such that the display content of the light emitting display portion is observable.

Abstract: A disk storage device stores write data in a cache area of a data buffer according to a write command from a host, reports write completion to the host, and then writes the write data in the cache area to a storage medium. The disk storage device stores the write data stored in the data buffer in a save area created on the storage disk in response to the reception of a command which requires integrity, other than a write command, and reports a response to the host. Therefore processing time of this command and response time to the host can be decreased, while maintaining the safety of the write data.

Abstract: A recess is formed in a substrate. A bare chip, i.e., a light-emitting diode, is installed in the recess and connected to conductive members on the substrate with leads. A light-guiding layer composed of a light-guiding elastomer is disposed on the surface of the substrate. A light-guiding cover layer is bonded on the surface, and the bare chip and the leads are embedded in the elastomer. Light emitted from the bare chip passes through the light-guiding elastomer and is guided along the surface of the substrate to an illumination portion. Since the bare chip and the leads are embedded in the elastomer, failures such as disconnections of the leads under application of external force are suppressed.

Abstract: The storage device of the invention has a ramp mechanism which shakes out the head onto the disk medium, and causes the head to evacuate from the medium to hold it. The command queuing processing unit stores input/output commands into the command queue in the order of issuance by the host, and then, executes the commands in arrangement in the increasing order of the medium access time. Completion of commands is responded to the host in the order of completion of execution. The end of command is responded to the host in the order of end of execution. The emergency evacuation processing unit interrupts, upon receipt of an emergency evacuation command from the host during operation of the command queuing processing unit, operation of the command queuing processing unit and protects the head by causing the head to evacuate from the medium to the ramp mechanism.

Abstract: A semiconductor light-emitting element includes a semiconductor layer including a light-emitting layer, a refractive index gradient layer provided on a light extraction surface of the semiconductor layer, and a holding substrate bounded to an outer surface of the refractive index gradient layer with an adhesion layer interposed therebetween. A refractive index of the refractive index gradient layer is changed continuously or stepwise in a film thickness direction such that a semiconductor-layer-side refractive index is substantially equivalent to a refractive index of the semiconductor layer and a holding-substrate-side refractive index is substantially equivalent to a refractive index of the holding substrate. The refractive index gradient layer is formed by vapor plating.