Abstract: A method of manufacturing a bonded substrate includes: preparing one or plurality of products to be bonded, each including a brazing material layer and a copper plate laminated on both main surfaces of a ceramic substrate, laminating, one or a plurality of products bonded and a pair of clamping members that clamp them while providing a mold releasing layer between each thereof, heating the one or the plurality of products while pressing the one or the plurality of products in the pair of clamping members to obtain the one or the plurality of bonded substrates in which the ceramic substrate and the copper plate are bonded with a bonding layer, and removing the mold releasing layer from the bonded substrate by dissolving a portion in contact with the mold releasing layer of the copper plate included in the bonded substrate by wet etching.

Abstract: A filter includes: a piezoelectric substrate; a first acoustic wave resonator located on the piezoelectric substrate and including a pair of first reflectors including first grating electrodes and a pair of first comb-shaped electrodes that is located between the first reflectors and includes first electrode fingers; and a second acoustic wave resonator that is connected in series or parallel with the first acoustic wave resonator, is located on the piezoelectric substrate, and includes a pair of second reflectors including second grating electrodes and a pair of second comb-shaped electrodes that is located between the second reflectors and includes second electrode fingers, an average value of duty ratios of the second grating electrodes being different from an average value of duty ratios of the first grating electrodes, an average value of pitches of the second electrode fingers being substantially equal to an average value of pitches of the first electrode fingers.

Abstract: A power-demand-value calculating system includes a storage device and an arithmetic device. The storage device stores data of combinations of temperatures and power result values. The arithmetic device selects data equal to or higher than a predetermined temperature from the storage device and, calculates, when the power result values corresponding to the temperatures of the selected data are smaller than a power calculation value which is calculated from a regression formula derived from the data of the combinations and the temperatures of the selected data, a maximum power demand value based on the temperatures equal to or higher than the predetermined temperature and the regression formula.

Abstract: A filter includes: a piezoelectric substrate; a first acoustic wave resonator located on the piezoelectric substrate and including a pair of first reflectors including first grating electrodes and a pair of first comb-shaped electrodes that is located between the first reflectors and includes first electrode fingers; and a second acoustic wave resonator that is connected in series or parallel with the first acoustic wave resonator, is located on the piezoelectric substrate, and includes a pair of second reflectors including second grating electrodes and a pair of second comb-shaped electrodes that is located between the second reflectors and includes second electrode fingers, an average value of duty ratios of the second grating electrodes being different from an average value of duty ratios of the first grating electrodes, an average value of pitches of the second electrode fingers being substantially equal to an average value of pitches of the first electrode fingers.

Abstract: A power-demand-value calculating system includes: a storage device configured to store data of combinations of temperatures and power result values; and an arithmetic device configured to: select data equal to or higher than a predetermined temperature from the storage device; and, calculate, when the power result values corresponding to the temperatures of the selected data are smaller than a power calculation value which is calculated from a regression formula derived from the data of the combinations and the temperatures of the selected data, a maximum power demand value based on the temperatures equal to or higher than the predetermined temperature and the regression formula.

Abstract: A method of mounting a semiconductor element, the method includes: attaching a first solder joint material onto a first pad formed on a substrate supplying a second solder joint material onto the first solder joint material, a second melting point of the second solder joint material being lower than a first melting point of the first solder joint material; arranging the semiconductor element so that a second pad formed on the semiconductor element faces the first pad and a joint gap is provided between the semiconductor element and the substrate; and performing reflow at a reflow temperature lower than the first melting point and higher than the second melting point to join the first solder joint material and the second solder joint material.

Abstract: A non-transitory computer-readable recording medium stores an ordering program that causes a computer to execute a process. The process includes determining whether an article is a chemical material by using slip issue data that is input when ordering the article; checking whether the slip issue data includes permission identification information indicating that the article has been allowed to be ordered, when the article is determined to be the chemical material; and making an approval request to approve of ordering the article according to a result of the checking of the slip issue data.

Abstract: An optical unit in which an optical part having an optical element is mounted on a base having an optical waveguide includes a hydrophobic first area formed in a region including an optical axis of the optical part, a hydrophobic second area formed in a region facing the first area on a surface of the base, and a hydrophilic filler which fills peripheries of the first area and the second area between the optical part and the base.

Abstract: A method of determining a reinforcement position of a circuit board includes: setting a numerical model of a circuit board in which an electronic component is mounted in a front surface by bumps, and a reinforcing member is attached to a position corresponding to a bump located in a corner part of the electrical component in a back surface; incorporating information about a stud that is located in a periphery of the electronic component and fixes the circuit board to a chassis of the electronic device; performing a simulation for obtaining values of stresses generated in bumps of corner parts when a force is applied to the electronic component from a back side of the circuit board; and determining an arrangement of the reinforcing member in accordance with a position of the stud based on the values of stresses obtained by the simulation.

Abstract: A method of mounting a semiconductor element, the method includes: attaching a first solder joint material onto a first pad formed on a substrate supplying a second solder joint material onto the first solder joint material, a second melting point of the second solder joint material being lower than a first melting point of the first solder joint material; arranging the semiconductor element so that a second pad formed on the semiconductor element faces the first pad and a joint gap is provided between the semiconductor element and the substrate; and performing reflow at a reflow temperature lower than the first melting point and higher than the second melting point to join the first solder joint material and the second solder joint material.

Abstract: An optical unit in which an optical part having an optical element is mounted on a base having an optical waveguide includes a hydrophobic first area formed in a region including an optical axis of the optical part, a hydrophobic second area formed in a region facing the first area on a surface of the base, and a hydrophilic filler which fills peripheries of the first area and the second area between the optical part and the base.

Abstract: A substrate module includes: a substrate on which an electronic component is mounted; and a sealing resin that seals the electronic component, and has an opening, the opening being open along an extending direction of the substrate.

Abstract: Disclosed is a board reinforcing structure for reinforcing a circuit board in which an electronic component is mounted on a first surface, the electronic component having an electrode arranged in a rectangular-shaped region on the first surface. The board reinforcing structure includes a reinforcing member bonded to positions corresponding to corner parts of four corners of the rectangular-shaped region on a second surface provided on a side opposite to the first surface of the circuit board. In the board reinforcing structure, corresponding one of notches is formed in the reinforcing member at a position corresponding to one of the corner parts of the four corners of the rectangular-shaped region, and at least two apexes of the reinforcing member directed to an outside are formed to shape a contour thereof with the one of the notches.

Abstract: A conductive bonding material includes: a solder component including a metal foamed body of a first metal having at least one pore, the pore absorbs melted first metal when the metal foamed body is heated at a temperature higher than the melting point of the first metal, and a second metal having a melting point lower than the melting point of the first metal.

Abstract: A configuration includes the adhesive member to adhesively bond components together and a thermo-expandable material to expand upon being heated in the way of being disposed between at least one of the components adhesively bonded together by the adhesive member and the adhesive member and to push the adhesive member in a direction of getting apart from at least one of the components.

Abstract: An electro-conductive bonding material includes: metal components of a high-melting-point metal particle that have a first melting point or higher; a middle-melting-point metal particle that has a second melting point which is first temperature or higher, and second temperature or lower, the second temperature is lower than the first melting point and higher than the first temperature; and a low-melting-point metal particle that has a third melting point or lower, the third melting point is lower than the first temperature.

Abstract: A conductive bonding material comprising: a first metal particle; a second metal particle having an average particle diameter larger than an average particle diameter of the first metal particle; and a third metal particle having an average particle diameter larger than the average particle diameter of the first metal particle, a relative density larger than a relative density of the first metal particle, and a melting point higher than a melting point of the second metal particle.

Abstract: A printed wiring board includes a first conductive paste forming a wiring pattern, and a second conductive paste including kneaded first conductive material and second conductive material whose particles are finer than those of the first conductive material.

Abstract: To provide an electronic component, containing: a wiring board containing electrode pads; a component including a plurality of electrodes, the component being mounted on the wiring board; a sealing resin covering the component; and a plurality of terminals configured to connect a wiring provided within the wiring board to an external substrate, wherein the plurality of electrodes and the electrode pads are connected with solder, and wherein a first resin layer and a second resin layer are provided between the solder and the sealing resin in this order from the side of the solder, where the first resin layer has a first Young's modulus and the second resin layer has a second Young's modulus larger than the first Young's modulus.

Abstract: An electro-conductive bonding material includes: metal components of a high-melting-point metal particle that have a first melting point or higher; a middle-melting-point metal particle that has a second melting point which is first temperature or higher, and second temperature or lower, the second temperature is lower than the first melting point and higher than the first temperature; and a low-melting-point metal particle that has a third melting point or lower, the third melting point is lower than the first temperature.