Abstract: A semiconductor device comprises a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.

Abstract: A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.

Abstract: A method of assembling a micro-actuator is provided in which a base frame having a plurality of actuator bases is placed on a stage, a first adhesive is applied to each of the actuator bases, and a base electrode frame having a plurality of base electrodes is placed on the first adhesive. The first adhesive is semi-cured by heating and pressing. A second adhesive is applied to each of the base electrodes, and a plurality of piezoelectric elements are placed on the second adhesive. The second adhesive is semi-cured by heating and pressing. A third adhesive is applied to the piezoelectric elements, and a movable electrode frame having a plurality of movable electrodes is placed on the third adhesive. The third adhesive is semi-cured by heating and pressing. Next, a fourth adhesive is applied to each of the movable electrodes, and a hinge plate frame having a plurality of hinge plates is placed on the fourth adhesive. The fourth adhesive is semi-cured by heating and pressing.

Abstract: In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable electrode is placed on the first adhesive. The movable plate and the movable electrode are clamped between a first stage and a first head, followed by heating for a first predetermined period of time while exerting a first predetermined press load onto the first head to semi-cure the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. The movable plate, the movable electrode and the piezoelectric element are clamped between the first stage and a second head, followed by heating for a second predetermined period of time while exerting a second predetermined press load onto the second head to semi-cure the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above.

Abstract: A Pb-free solder alloy and a soldered bond using the same, in which the solder alloy has no harmful environmental effect but has a solderability comparable to that of the conventional Pb—Sn solder alloy. The solder alloy of the present invention either consists of Zn: 3.0-14.0 wt %, Al: 0.0020-0.0080 wt %, and the balance of Sn and unavoidable impurities or consists of Zn: 3.0-14.0 wt %, Bi: 3.0-6.0 wt %, Al: 0.0020-0.0100 wt %, and the balance of Sn and unavoidable impurities. The soldered bond of the present invention consists of either of the present inventive solder alloys.

Abstract: The present invention provides a soldering method and a soldered joint securing a strength of joint equivalent to soldering using a conventional Pb—Sn solder alloy without having a detrimental effect on the environment and without causing a rise in cost.

Abstract: A semiconductor device comprises a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.

Abstract: A semiconductor device comprises a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.

Abstract: A method of forming bumps onto a chip having electrodes. The method includes the use of a template having through-holes arranged in correspondence to the electrodes of the chip. The template holds conductive balls to be formed into bumps to the template at the through-holes by vacuum suction. The through-holes of the template are formed by a laser, by supporting a glass plate on a support table having cavities and irradiating the plate with laser beams at the position of the cavities.

Abstract: A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.

Abstract: A lead-free solder alloy composition contains Sn, Bi and In, with respective contents such that the solder alloy composition provides a liquidus temperature below the heat resistant temperature of a work to be soldered. The alloy contains not more than about 60 wt % Bi; not more than about 50 wt % In; optionally at least one element selected from Ag, Zn, Ge, Ga, Sb, and P; and Sn. Also, lead-free solder powders containing same, and printed circuit boards, electronic components and electronic apparati employing such alloy.

Abstract: A method of manufacturing a template having through-holes for attracting and supporting electrically conductive balls by vacuum suction is disclosed. The through-holes are formed by etching and the side walls of the through-holes are smoothed by irradiation, with laser beams, of the side walls of the through-holes. A template and metallic bumps can be formed using this method. Alternatively, the template can be formed in a two-layered structure.